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Contents

README

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DMN31D5L-7

Diodes Incorporated · MOSFETs · SOT-23

DMN31D5L-7 from Diodes Incorporated, in a SOT-23. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 G input Gate, ESD-protected via an internal gate protection diode; VGSS rating ±20 V and threshold VGS(TH) 0.8 V to 1.6 V at ID = 250 µA.
2 S passive Source terminal of the N-channel MOSFET, with the body diode (IS max 0.3 A) running from source to drain.
3 D passive Drain terminal, with VDSS of 30 V and continuous drain current of 0.5 A at TA = +25°C (VGS = 4 V).

Key specifications

Parameter Value
Manufacturer Diodes Incorporated
Package SOT-23
Category Transistors/Thyristors
Pins 3

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
Drain-Source Voltage VDSS 30 V 2
Gate-Source Voltage VGSS -20 20 V 2
Continuous Drain Current, TA = +25°C ID 0.5 A VGS = 4V, steady state, TA = +25°C (Note 6) 2
Continuous Drain Current, TA = +75°C ID 0.4 A VGS = 4V, steady state, TA = +75°C (Note 6) 2
Maximum Continuous Body Diode Forward Current IS 0.3 A 2
Pulsed Drain Current IDM 5 A 10µs pulse, duty cycle = 1% 2
Total Power Dissipation (minimum recommended pad layout) PD 350 mW Device mounted on FR-4 PCB, 2oz copper, minimum recommended pad layout (Note 5) 2
Total Power Dissipation (1 inch square copper plate) PD 520 mW Device mounted on FR-4 PCB, 2oz copper, 1 inch square copper plate (Note 6) 2
Thermal Resistance, Junction to Ambient, steady state (minimum pad) RθJA 357 °C/W Steady state, device mounted on FR-4 PCB, minimum recommended pad layout (Note 5) 2
Thermal Resistance, Junction to Ambient, steady state (1 inch square plate) RθJA 240 °C/W Steady state, device mounted on FR-4 PCB, 1 inch square copper plate (Note 6) 2
Operating and Storage Temperature Range TJ, TSTG -55 150 °C 2
Drain-Source Breakdown Voltage BVDSS 30 V VGS = 0V, ID = 100μA 2
Zero Gate Voltage Drain Current @TC = +25°C IDSS 1 μA VDS = 30V, VGS = 0V 2
Gate-Source Leakage IGSS -10 10 μA VGS = ±10V, VDS = 0V 2
Gate Threshold Voltage VGS(TH) 0.8 1.6 V VDS = VGS, ID = 250μA 2
Static Drain-Source On-Resistance RDS(ON) 1.5 Ω VGS = 4.0V, ID = 10mA 2
Static Drain-Source On-Resistance RDS(ON) 2 Ω VGS = 2.5V, ID = 10mA 2
Diode Forward Voltage VSD 1.2 V VGS = 0V, IS = 10mA 2
Transient Thermal Resistance reference (RθJA) RθJA 372 °C/W Figure 13 note: RθJA = 372°C/W used as basis for r(t) transient curve 5

Materials and finish

As the datasheet states them (page.json metadata.appearance; the 3D model's colours follow it).

Part Material Colour / plating Datasheet says Page
contacts Copper tin  Terminals: Finish ⎯ Matte Tin Annealed over Copper Leadframe. 1

CAD (KiCad official)

  • Symbol: DMN31D5L-7
  • Footprint: Package_TO_SOT_SMD:SOT-23
  • 3D model: SOT-23 (KiCad packages3D, STEP)
  • 3D model files: dmn31d5l-7-etched.step / dmn31d5l-7-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); dmn31d5l-7.step / dmn31d5l-7.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: Diodes Incorporated datasheet (7 pp, sha256 4a78a04714c04607, retrieved 2026-10-18, tier: lcsc)
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-sonnet-5-5 (text+vision), consensus claude-opus-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF