AD8400ARZ100 from Analog Devices, in a SOIC-8-150mil. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin	Name	Type	Function
1	B1	passive	Terminal B of RDAC (fixed resistor end terminal; voltage limited to 0 V to VDD).
2	GND	power_in	Ground.
3	CS	input	Chip Select input, active low; when CS returns high, data in the serial input register is decoded based on the address bits and loaded into the target DAC register.
4	SDI	input	Serial Data Input.
5	CLK	input	Serial Clock Input, positive edge triggered.
6	VDD	power_in	Positive power supply, specified for operation at both 3 V and 5 V (absolute max −0.3 V to +8 V).
7	W1	passive	Wiper of RDAC, Addr = 00.
8	A1	passive	Terminal A of RDAC (fixed resistor end terminal; voltage limited to 0 V to VDD).

Key specifications

Parameter	Value
Manufacturer	Analog Devices
Package	SOIC-8-150mil
Category	Data Converters
Pins	8

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter	Symbol	Min	Typ	Max	Unit	Conditions	Page
Nominal Resistance	RAB	70	100	130	kΩ	TA = 25°C, Model: AD840XYY100	6
Resistance Tempco	ΔRAB/ΔT		500		ppm/°C	VAB = VDD, Wiper = No Connect	6
Resistor Differential NL	R-DNL	-1		1	LSB	RWB, VA = No Connect	6
Resistor Nonlinearity	R-INL	-2		2	LSB	RWB, VA = No Connect	6
Wiper Resistance	RW		50	100	Ω	VDD = 5V, IW = VDD/RAB	6
Wiper Resistance	RW			200	Ω	VDD = 3V, IW = VDD/RAB	6
Nominal Resistance Match	ΔR/RAB		0.2	1	%	CH 1 to CH 2, CH 3, or CH 4, VAB = VDD, TA = 25°C	6
Integral Nonlinearity	INL	-4		4	LSB		6
Differential Nonlinearity	DNL	-1		1	LSB	VDD = 5 V	6
Differential Nonlinearity	DNL	-1.5		1.5	LSB	VDD = 3 V, TA = −40°C to +85°C	6
Voltage Divider Tempco	ΔVW/ΔT		15		ppm/°C	Code = 80H	6
Full-Scale Error	VWFSE	-1	-0.25	0	LSB	Code = FFH	6
Zero-Scale Error	VWZSE	0	0.1	1	LSB	Code = 00H	6
Shutdown Current	IA_SD		0.01	5	μA	VA = VDD, VB = 0 V, SHDN = 0	6
Shutdown Wiper Resistance	RW_SD		100	200	Ω	VA = VDD, VB = 0 V, SHDN = 0, VDD = 5 V	6
Input Logic High	VIH	2.4			V	VDD = 5 V	6
Input Logic Low	VIL			0.8	V	VDD = 5 V	6
Input Logic High	VIH	2.1			V	VDD = 3 V	6
Input Logic Low	VIL			0.6	V	VDD = 3 V	6
Output Logic Low	VOL			0.4	V	IOL = 1.6 mA, VDD = 5 V	6
Input Current	IIL	-1		1	μA	VIN = 0 V or 5 V, VDD = 5 V	6
Power Supply Range	VDD	2.7		5.5	V	VDD range	6
Supply Current (CMOS)	IDD		0.01	5	μA	VIH = VDD or VIL = 0 V	6
Supply Current (TTL)	IDD		0.9	4	mA	VIH = 2.4 V or 0.8 V, VDD = 5.5 V	6
Power Dissipation (CMOS)	PDISS			27.5	μW	VIH = VDD or VIL = 0 V, VDD = 5.5 V	6
Power Supply Sensitivity	PSS		0.0002	0.001	%/%	VDD = 5 V ± 10%	6
Power Supply Sensitivity	PSS		0.006	0.03	%/%	VDD = 3 V ± 10%	6
Input Clock Pulse Width	tCH, tCL	10			ns	Clock level high or low	10
Data Setup Time	tDS	5			ns		10
Data Hold Time	tDH	5			ns		10
CLK to SDO Propagation Delay	tPD			25	ns	RL = 1 kΩ to 5 V, CL ≤ 20 pF	10
CS Setup Time	tCSS	10			ns		10
CS High Pulse Width	tCSW	10			ns		10
Reset Pulse Width	tRS	50			ns		10
CLK Fall to CS Rise Hold Time	tCSH	0			ns		10
CS Rise to Clock Rise Setup	tCS1	10			ns		10
Voltage Range	VA, VB, VW	0			V	upper limit VDD	6
Capacitance Ax, Bx	CA, CB		15		pF	f = 1 MHz, measured to GND, code = 80H	6
Capacitance Wx	CW		80		pF	f = 1 MHz, measured to GND, code = 80H	6
Input Capacitance	CIL		5		pF		6
Bandwidth −3 dB	BW_100K		71		kHz	R = 100 kΩ	7
Total Harmonic Distortion	THDW		0.003		%	VA = 1 V rms + 2 V dc, VB = 2 V dc, f = 1 kHz	7
VW Settling Time	tS_100K		18		μs	VA = VDD, VB = 0 V, ±1% error band	7
Resistor Noise Voltage	eNWB_100K		29		nV/√Hz	RWB = 50 kΩ, f = 1 kHz, RS = 0	7
Crosstalk	CT		-65		dB	VA = VDD, VB = 0 V	7
VDD to GND	VDD	-0.3		8	V	TA = 25°C	11
VA, VB, VW to GND		0			V	0 V, VDD	11
IWB, IWA Pulsed		-20		20	mA		11
IWB Continuous		-5		5	mA	RWB ≤ 1 kΩ, A Open	11
IWA Continuous		-5		5	mA	RWA ≤ 1 kΩ, B Open	11
IAB Continuous		-540		540	μA	RAB = 100 kΩ	11
Digital Input and Output Voltage to GND		0		7	V		11
Operating Temperature Range	TA	-40		125	°C		11
Maximum Junction Temperature	TJ max			150	°C		11
Storage Temperature		-65		150	°C		11
Lead Temperature				300	°C	Soldering, 10 sec	11
Thermal Resistance	θJA		158		°C/W	SOIC (R-8)	11

CAD (KiCad official)

Symbol: AD8400ARZ100
Footprint: Package_SO:SOIC-8_3.9x4.9mm_P1.27mm
3D model: SOIC-8-150mil (KiCad packages3D, STEP)
3D model files: ad8400arz100-etched.step / ad8400arz100-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); ad8400arz100.step / ad8400arz100.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

Datasheet: Analog Devices datasheet (32 pp, sha256 c51edf50aaea939c, retrieved 2026-10-30, tier: manufacturer)
Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-sonnet-5-5 (text), consensus claude-sonnet-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF

AD8400ARZ100

Verified AD8400ARZ100

Verification log 1 record

3D Model

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