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SY89323LMG-TR
Public Made by Adomby adom
Microchip Tech Translators / Level Shifters, MLF-8. Pinout cross-checked by two models against the datasheet, KiCad symbol/footprint/3D.
3D Model
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Symbol & Footprint
Schematic Symbol
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PCB Footprint
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Datasheet
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README
markdownSY89323LMG-TR
Microchip Tech · Translators / Level Shifters · MLF-8
SY89323LMG-TR from Microchip Tech, in a MLF-8. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.
Pinout
| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | IN0 | input | Differential PECL/ECL input with an internal 75kΩ pull-down resistor; if left open the pin defaults LOW and the Q output will be LOW. |
| 2 | /IN0 | input | Complementary differential PECL/ECL input with internal 75kΩ pull-up and pull-down resistors; if left floating it defaults to VCC/2 and may be left open when not used. |
| 3 | /IN1 | input | Complementary differential PECL/ECL input with internal 75kΩ pull-up and pull-down resistors; if left floating it defaults to VCC/2 and may be left open when not used. |
| 4 | IN1 | input | Differential PECL/ECL input with an internal 75kΩ pull-down resistor; if left open the pin defaults LOW and the Q output will be LOW. |
| 5 | GND | power_in | Ground pin; GND and the exposed pad must be tied to the ground plane. |
| 6 | Q1 | output | Single-ended LVTTL output that defaults to LOW if the IN inputs are left open. |
| 7 | Q0 | output | Single-ended LVTTL output that defaults to LOW if the IN inputs are left open. |
| 8 | VCC | power_in | Positive power supply; bypass with 0.1µF//0.01µF low ESR capacitors. |
| 9 | EP | passive | Exposed pad (from the footprint; not named in the datasheet pin table). |
Key specifications
| Parameter | Value |
|---|---|
| Manufacturer | Microchip Tech |
| Package | MLF-8 |
| Category | Logic ICs |
| Pins | 9 |
Electrical characteristics
Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).
| Parameter | Symbol | Min | Typ | Max | Unit | Conditions | Page |
|---|---|---|---|---|---|---|---|
| Supply Voltage (VCC) | VCC | -0.5 | 3.8 | V | 3 | ||
| Input Voltage (VIN) | VIN | -0.5 | V | 3 | |||
| LVPECL Output Current (IOUT) Continuous | IOUT | 50 | mA | Continuous | 3 | ||
| LVPECL Output Current (IOUT) Surge | IOUT | 100 | mA | Surge | 3 | ||
| Input Current, source or sink on IN, /IN | -50 | 50 | mA | Source or sink current on IN, /IN | 3 | ||
| Lead Temperature (soldering) | 260 | °C | soldering, 20 sec. | 3 | |||
| Storage Temperature (TS) | TS | -65 | 150 | °C | 3 | ||
| Supply Voltage (VCC) operating | VCC | 3 | 3.6 | V | 3 | ||
| Ambient Temperature (TA) | TA | -40 | 85 | °C | 3 | ||
| Output HIGH Voltage | VOH | 2 | V | IOH = -3.0mA | 3 | ||
| Output LOW Voltage | VOL | 0.5 | V | IOL = 24mA | 3 | ||
| Power Supply Current | ICC | 30 | mA | 3 | |||
| Output Short Circuit Current | IOS | -80 | -240 | mA | VOUT = 0V | 3 | |
| Minimum Peak-to-Peak Input | VPP | 200 | mV | 3 | |||
| Input HIGH Current | IIH | 150 | µA | 3 | |||
| Input LOW Current (IN) | IIL | 0.5 | µA | IN | 3 | ||
| Input LOW Current (/IN) | IIL | -300 | µA | /IN | 3 | ||
| Maximum Input Frequency | fMAX | 275 | MHz | Notes 1, 2 | 4 | ||
| Propagation Delay | tpd | 1.5 | 2.5 | ns | 4 | ||
| Part-to-Part Skew | tskpp | 0.5 | ns | Notes 3 | 4 | ||
| Within-Device Skew (HIGH-to-HIGH) | tskew++ | 0.3 | ns | Notes 4 | 4 | ||
| Within-Device Skew (LOW-to-LOW) | tskew-, | 0.3 | ns | Notes 5 | 4 | ||
| Cycle-to-Cycle Jitter | tjitter | 2 | psRMS | Note 6 | 4 | ||
| Total Jitter | 25 | psPP | Note 7 | 4 | |||
| Output Rise/Fall Time | tr | 0.5 | 1 | ns | 1.0V to 2.0V | 4 | |
| Thermal Resistance, Junction-to-Ambient (still air) | θJA | 93 | °C/W | Still-Air | 3 | ||
| Thermal Resistance, Junction-to-Ambient (500 lfpm) | θJA | 87 | °C/W | 500lfpm | 3 | ||
| Thermal Resistance, Junction-to-Board | ΨJB | 60 | °C/W | Junction-to-Board | 3 |
CAD (KiCad official)
- Symbol:
SY89323LMG-TR - Footprint:
Package_DFN_QFN:MLF-8-1EP_3x3mm_P0.65mm_EP1.55x2.3mm - 3D model: MLF-8 (KiCad packages3D, STEP)
- 3D model files:
sy89323lmg-tr-etched.step/sy89323lmg-tr-etched.glbcarry the MPN laser-etched on the die in a toggleableAdom.LaserEtchgroup (Fusion-ready);sy89323lmg-tr.step/sy89323lmg-tr.glbare the bare package body.
Provenance
Data extracted from the manufacturer datasheet, not a distributor listing:
- Datasheet: Microchip Tech datasheet (5 pp, sha256
d9dbdc29b0232d27, retrieved 2026-10-31, tier: lcsc) - Extractor: parts-factory
2.0.0/extract_pins 0.3, primaryclaude-haiku-5-5(text), consensusclaude-sonnet-5-5(agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish. - CAD: KiCad official libraries (CC-BY-SA 4.0).