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Contents

README

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SL8N65CD

Slkor SLKORMICRO Elec · MOSFETs · TO-252

SL8N65CD from Slkor SLKORMICRO Elec, in a TO-252. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 G input Gate; controls the channel, with gate-source voltage rated ±30 V, threshold 2.5 to 4.5 V at 250 uA, and drive of 10 V for the rated RDS(on).
2 D passive Drain, the center lead (shortened) electrically common with the exposed tab; drain-source voltage rated 650 V and continuous current 8 A at TC = 25°C.
3 S passive Source; body diode runs source-to-drain with continuous forward current up to 8 A and forward voltage max 1.2 V.

Key specifications

Parameter Value
Manufacturer Slkor SLKORMICRO Elec
Package TO-252
Category Transistors/Thyristors
Pins 3

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
Drain-Source Breakdown Voltage BVDSS 650 V VGS = 0 V, ID = 250uA 2
Drain-Source Breakdown Voltage (TJ = 150℃) BVDSS 650 V VGS = 0 V, ID = 250uA, TJ = 150℃ 2
Zero Gate Voltage Drain Current IDSS 1 uA VDS = 600 V, VGS = 0 V 2
Gate-Body Leakage Current, Forward IGSSF 100 nA VGS = 30 V, VDS = 0 V 2
Gate-Body Leakage Current, Reverse IGSSR -100 nA VGS = -30 V, VDS = 0 V 2
Gate Threshold Voltage VGS(th) 2.5 4.5 V VDS = VGS, ID = 250uA 2
Static Drain-Source On-Resistance RDS(on) 550 600 mΩ VGS = 10 V, ID = 2.5 A 2
Maximum Continuous Drain-Source Diode Forward Current IS 8 A 2
Maximum Pulsed Drain-Source Diode Forward Current ISM 24 A 2
Drain-Source Diode Forward Voltage VSD 1.2 V VGS = 0 V, IS = 2.5A 2
Drain-Source Voltage VDSS 650 V 1
Drain Current - Continuous ID 8 A TC = 25℃; drain current limited by maximum junction temperature 1
Drain Current - Continuous ID 4.8 A TC = 100℃ 1
Drain Current - Pulsed IDM 24 A Note 1 (repetitive rating: pulse width limited by maximum junction temperature) 1
Gate-Source Voltage VGSS -30 30 V 1
Single Pulsed Avalanche Energy EAS 156 mJ Note 2: L = 80mH, VDD = 80V, RG = 25Ω, Starting TJ = 25°C 1
Avalanche Current IAR 1.9 A Note 1 1
Repetitive Avalanche Energy EAR 0.61 mJ Note 1 1
Peak Diode Recovery dv/dt dv/dt 20 V/ns Note 3 1
MOSFET dv/dt dv/dt 100 V/ns 1
Power Dissipation (first printed value) PD 24 W TC = 25℃ 1
Power Dissipation (second printed value) PD 69 W TC = 25℃ 1
Derate above 25℃ (first printed value) PD 0.19 W/℃ Derate above 25℃ 1
Derate above 25℃ (second printed value) PD 0.56 W/℃ Derate above 25℃ 1
Operating and Storage Temperature Range TJ, TSTG -55 150 ℃ 1
Maximum Lead Temperature for Soldering TL 260 ℃ 1/8" from case for 5 seconds 1
Thermal Resistance, Junction-to-Case (first printed value) RθJC 5.2 ℃/W 1
Thermal Resistance, Junction-to-Case (second printed value) RθJC 1.8 ℃/W 1
Thermal Resistance, Junction-to-Ambient (first printed value) RθJA 62.5 ℃/W 1
Thermal Resistance, Junction-to-Ambient (second printed value) RθJA 62.5 ℃/W 1

CAD (KiCad official)

  • Symbol: SL8N65CD
  • Footprint: Package_TO_SOT_SMD:TO-252-2
  • 3D model: TO-252 (KiCad packages3D, STEP)
  • 3D model files: sl8n65cd-etched.step / sl8n65cd-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); sl8n65cd.step / sl8n65cd.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: Slkor SLKORMICRO Elec datasheet (8 pp, sha256 d5590205827a3d27, retrieved 2026-10-18, tier: lcsc)
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-sonnet-5-5 (text+vision), consensus claude-opus-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF