Loads when you scroll to it. Unloads after 5 minutes in the background.

Symbol & Footprint

Schematic Symbol

Open full view ↗
Loads when you scroll to it. Unloads after 5 minutes in the background.

PCB Footprint

Open full view ↗
Loads when you scroll to it. Unloads after 5 minutes in the background.
Loads when you scroll to it. Unloads after 5 minutes in the background.
Download PDF
Contents

README

markdown

SN74HC374PW

lingxingic · Flip Flops · TSSOP-20

SN74HC374PW from lingxingic, in a TSSOP-20. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 OE input Active-low output enable; when high, outputs Q0 to Q7 go to high impedance (Z) without changing the stored register state.
2 Q0 tri_state Three-state, non-inverting data output of flip-flop 0; high impedance while OE is high.
3 D0 input Data input to flip-flop 0, which must meet the setup and hold times relative to the rising edge of CP.
4 D1 input Data input to flip-flop 1, which must meet the setup and hold times relative to the rising edge of CP.
5 Q1 tri_state Three-state, non-inverting data output of flip-flop 1; high impedance while OE is high.
6 Q2 tri_state Three-state, non-inverting data output of flip-flop 2; high impedance while OE is high.
7 D2 input Data input to flip-flop 2, which must meet the setup and hold times relative to the rising edge of CP.
8 D3 input Data input to flip-flop 3, which must meet the setup and hold times relative to the rising edge of CP.
9 Q3 tri_state Three-state, non-inverting data output of flip-flop 3; high impedance while OE is high.
10 GND power_in Ground reference, 0 V.
11 CP input Clock input; the flip-flops capture D on the low-to-high (rising) clock edge.
12 Q4 tri_state Three-state, non-inverting data output of flip-flop 4; high impedance while OE is high.
13 D4 input Data input to flip-flop 4, which must meet the setup and hold times relative to the rising edge of CP.
14 D5 input Data input to flip-flop 5, which must meet the setup and hold times relative to the rising edge of CP.
15 Q5 tri_state Three-state, non-inverting data output of flip-flop 5; high impedance while OE is high.
16 Q6 tri_state Three-state, non-inverting data output of flip-flop 6; high impedance while OE is high.
17 D6 input Data input to flip-flop 6, which must meet the setup and hold times relative to the rising edge of CP.
18 D7 input Data input to flip-flop 7, which must meet the setup and hold times relative to the rising edge of CP.
19 Q7 tri_state Three-state, non-inverting data output of flip-flop 7; high impedance while OE is high.
20 VCC power_in Supply voltage; absolute maximum 7.0 V and recommended range 2.0 V to 6.0 V for the SN74HC374.

Key specifications

Parameter Value
Manufacturer lingxingic
Package TSSOP-20
Category Logic
Pins 20

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
Supply voltage (absolute max) VCC -0.5 7 V 6
Input clamp current IIK -20 20 mA VI<-0.5V 或 VI>VCC+0.5V 6
Output clamp current IOK -20 20 mA VO<-0.5V 或 VO>VCC+0.5V 6
Output current IO -35 35 mA -0.5V<VO<VCC+0.5V 6
Supply current (absolute max) ICC 70 mA 6
Ground current IGND -70 mA 6
Storage temperature Tstg -65 150 ℃ 6
Total power dissipation Ptot 500 mW 6
Soldering temperature TL 260 ℃ 10秒; SOP/TSSOP/SOP(M) 6
Supply voltage (recommended, SN74HC374) VCC 2 5 6 V 7
Input voltage (recommended) VI 0 V 7
Output voltage (recommended) VO 0 V 7
Input rise and fall rate Δt/ΔV 625 ns/V VCC=2.0V 7
Input rise and fall rate Δt/ΔV 1.67 139 ns/V VCC=4.5V 7
Input rise and fall rate Δt/ΔV 83 ns/V VCC=6.0V 7
Operating ambient temperature Tamb -40 125 ℃ 7
High-level input voltage VIH 1.5 V Tamb=-40~125℃; VCC=2.0V 8
High-level input voltage VIH 3.15 V Tamb=-40~125℃; VCC=4.5V 8
High-level input voltage VIH 4.2 V Tamb=-40~125℃; VCC=6.0V 8
Low-level input voltage VIL 0.5 V Tamb=-40~125℃; VCC=2.0V 8
Low-level input voltage VIL 1.35 V Tamb=-40~125℃; VCC=4.5V 8
Low-level input voltage VIL 1.8 V Tamb=-40~125℃; VCC=6.0V 8
High-level output voltage VOH 1.9 V Tamb=-40~125℃; VI=VIH或VIL;IO=-20uA;VCC=2.0V 8
High-level output voltage VOH 4.4 V Tamb=-40~125℃; VI=VIH或VIL;IO=-20uA;VCC=4.5V 8
High-level output voltage VOH 5.9 V Tamb=-40~125℃; VI=VIH或VIL;IO=-20uA;VCC=6.0V 8
High-level output voltage VOH 3.7 V Tamb=-40~125℃; VI=VIH或VIL;IO=-6.0mA;VCC=4.5V 8
High-level output voltage VOH 5.2 V Tamb=-40~125℃; VI=VIH或VIL;IO=-7.8mA;VCC=6.0V 8
Low-level output voltage VOL 0.1 V Tamb=-40~125℃; VI=VIH或VIL;IO=20uA;VCC=2.0V 8
Low-level output voltage VOL 0.4 V Tamb=-40~125℃; VI=VIH或VIL;IO=6.0mA;VCC=4.5V 8
Input leakage current II -1 1 uA Tamb=-40~125℃; VI=VCC或GND;VCC=6.0V 8
Off-state output current IOZ -10 10 uA Tamb=-40~125℃; VI=VIH或VIL;VCC=6.0V;VO=VCC或GND 8
Quiescent supply current ICC 160 uA Tamb=-40~125℃; VI=VCC或GND;IO=0A;VCC=6.0V 8
Propagation delay CP to Qn tpd 250 ns Tamb=-40~125℃; 见图6; VCC=2.0V 12
Propagation delay CP to Qn tpd 50 ns Tamb=-40~125℃; 见图6; VCC=4.5V 12
Propagation delay CP to Qn tpd 43 ns Tamb=-40~125℃; 见图6; VCC=6.0V 12
Enable time OE to Qn ten 225 ns Tamb=-40~125℃; 见图7; VCC=2.0V 12
Enable time OE to Qn ten 45 ns Tamb=-40~125℃; 见图7; VCC=4.5V 12
Enable time OE to Qn ten 38 ns Tamb=-40~125℃; 见图7; VCC=6.0V 12
Disable time OE to Qn tdis 225 ns Tamb=-40~125℃; 见图7; VCC=2.0V 12
Disable time OE to Qn tdis 45 ns Tamb=-40~125℃; 见图7; VCC=4.5V 12
Disable time OE to Qn tdis 38 ns Tamb=-40~125℃; 见图7; VCC=6.0V 12
Output transition time Qn tt 90 ns Tamb=-40~125℃; Qn输出; 见图6; VCC=2.0V 12
Output transition time Qn tt 18 ns Tamb=-40~125℃; Qn输出; 见图6; VCC=4.5V 12
Output transition time Qn tt 15 ns Tamb=-40~125℃; Qn输出; 见图6; VCC=6.0V 12
CP pulse width (high or low) tW 120 ns Tamb=-40~125℃; 见图6; VCC=2.0V 12
CP pulse width (high or low) tW 24 ns Tamb=-40~125℃; 见图6; VCC=4.5V 12
CP pulse width (high or low) tW 20 ns Tamb=-40~125℃; 见图6; VCC=6.0V 12
Data Dn to CP setup time tsu 90 ns Tamb=-40~125℃; 见图6; VCC=2.0V 12
Data Dn to CP setup time tsu 18 ns Tamb=-40~125℃; 见图6; VCC=4.5V 12
Data Dn to CP setup time tsu 15 ns Tamb=-40~125℃; 见图6; VCC=6.0V 12
Data Dn to CP hold time th 5 ns Tamb=-40~125℃; 见图6; VCC=2.0V 12
Maximum clock frequency fmax fmax 4 MHz Tamb=-40~125℃; CP输入; 见图6; VCC=2.0V 12
Maximum clock frequency fmax fmax 20 MHz Tamb=-40~125℃; CP输入; 见图6; VCC=4.5V 12
Maximum clock frequency fmax fmax 24 MHz Tamb=-40~125℃; CP输入; 见图6; VCC=6.0V 12

CAD (KiCad official)

  • Symbol: SN74HC374PW
  • Footprint: Package_SO:TSSOP-20_4.4x6.5mm_P0.65mm
  • 3D model: TSSOP-20 (KiCad packages3D, STEP)
  • 3D model files: sn74hc374pw-etched.step / sn74hc374pw-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); sn74hc374pw.step / sn74hc374pw.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: lingxingic datasheet (21 pp, sha256 e6d21ba7a671b3e3, retrieved 2026-10-19, tier: lcsc)
  • Datasheet language: Chinese. Pin names, descriptions, and specs on this page were extracted and translated to English by ds2sf; the linked PDF is the manufacturer original.
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-haiku-5-5 (text), consensus claude-sonnet-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF