component
HF81GS-Z
Public Made by Adomby adom
Monolithic Power Systems Power Management Specialized - PMIC, SOIC-8. Pinout cross-checked by two models against the datasheet, KiCad symbol/footprint/3D.
3D Model
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Symbol & Footprint
Schematic Symbol
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PCB Footprint
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Datasheet
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README
markdownHF81GS-Z
Monolithic Power Systems · Power Management Specialized - PMIC · SOIC-8
HF81GS-Z from Monolithic Power Systems, in a SOIC-8. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.
Pinout
| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | NC | unconnected | Not connected. |
| 2 | L1 | passive | AC Line 1 terminal of the two-terminal bleeder, paired with pin 3 for redundancy; L1-L2 rated up to 1000V. |
| 3 | L1 | passive | AC Line 1 terminal of the two-terminal bleeder, paired with pin 2 for redundancy; L1-L2 rated up to 1000V. |
| 4 | NC | unconnected | Not connected. |
| 5 | NC | unconnected | Not connected. |
| 6 | L2 | passive | AC Line 2 terminal of the two-terminal bleeder, paired with pin 7 for redundancy; L1-L2 rated up to 1000V. |
| 7 | L2 | passive | AC Line 2 terminal of the two-terminal bleeder, paired with pin 6 for redundancy; L1-L2 rated up to 1000V. |
| 8 | NC | unconnected | Not connected. |
Key specifications
| Parameter | Value |
|---|---|
| Manufacturer | Monolithic Power Systems |
| Package | SOIC-8 |
| Category | Power Supply Chip |
| Pins | 8 |
Electrical characteristics
Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).
| Parameter | Symbol | Min | Typ | Max | Unit | Conditions | Page |
|---|---|---|---|---|---|---|---|
| L1-L2 Pin Voltage | 1000 | V | 2 | ||||
| Storage Temperature | -65 | 150 | °C | 2 | |||
| Continuous Power Dissipation | 1.4 | W | TA = +25°C | 2 | |||
| Single Avalanche Energy | 70 | μJ | L=5mH, Vgs=10V, VDD=1.4V | 2 | |||
| Junction Temperature | TJ | 150 | °C | 2 | |||
| Operating Junction Temperature | TJ | -40 | 125 | °C | 2 | ||
| Junction-to-Ambient Thermal Resistance | θJA | 90 | °C/W | SOIC8, JESD51-7 4-layer PCB | 2 | ||
| Junction-to-Case Thermal Resistance | θJC | 45 | °C/W | SOIC8, JESD51-7 4-layer PCB | 2 | ||
| AC Removal Detection Time | tDETECT | 25 | ms | Line Cycle Frequency 47 to 63Hz | 3 | ||
| Saturation Current | ISC | 3 | mA | L1-L2 voltage from 110V to 410V | 3 | ||
| Supply Current | ISUPPLY | 15 | μA | L1-L2 voltage 1000V | 3 | ||
| UVLO | V_OFF_L1/L2 | 3.7 | V | 3 |
CAD (KiCad official)
- Symbol:
HF81GS-Z - Footprint:
Package_SO:SOIC-8_3.9x4.9mm_P1.27mm - 3D model: SOIC-8 (KiCad packages3D, STEP)
- 3D model files:
hf81gs-z-etched.step/hf81gs-z-etched.glbcarry the MPN laser-etched on the die in a toggleableAdom.LaserEtchgroup (Fusion-ready);hf81gs-z.step/hf81gs-z.glbare the bare package body.
Provenance
Data extracted from the manufacturer datasheet, not a distributor listing:
- Datasheet: Monolithic Power Systems datasheet (10 pp, sha256
e549d110fac46558, retrieved 2026-10-23, tier: lcsc) - Extractor: parts-factory
2.0.0/extract_pins 0.3, primaryclaude-sonnet-5-5(text), consensusclaude-sonnet-5-5(agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish. - CAD: KiCad official libraries (CC-BY-SA 4.0).