component
TPS62160QDSGRQ1
Public Made by Adomby adom
Texas Instruments DC-DC Converters, WSON-8-EP(2x2). Pinout cross-checked by two models against the datasheet, KiCad symbol/footprint/3D.
3D Model
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Symbol & Footprint
Schematic Symbol
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PCB Footprint
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Datasheet
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README
markdownTPS62160QDSGRQ1
Texas Instruments · DC-DC Converters · WSON-8-EP(2x2)
TPS62160QDSGRQ1 from Texas Instruments, in a WSON-8-EP(2x2). Pinout and pin descriptions extracted from the manufacturer datasheet by ds2sf; symbol, footprint, and 3D from KiCad-official CAD.
Pinout
| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | PGND | power_in | Power ground node; must be soldered to ground plane and exposed thermal pad for adequate dissipation and mechanical reliability. |
| 2 | VIN | power_in | Power supply input; rated for operating voltages from 3V to 17V per device specifications. |
| 3 | EN | input | Enable logic input; high level activates converter operation, low level triggers shutdown mode. |
| 4 | AGND | power_in | Analog ground reference point for feedback divider network and internal control circuitry. |
| 5 | FB | input | Feedback voltage input for adjustable output versions; internally compared to 0.8V reference. |
| 6 | VOS | input | Output voltage sense input; supplies feedback signal to internal compensation network. |
| 7 | SW | output | Switching node output driven by internal high and low-side MOSFETs; connects to external inductor. |
| 8 | PG | output | Open-drain power good output indicating output voltage regulation status; goes high impedance when device is disabled. |
| 9 | Exposed Thermal Pad | power_in | Thermal dissipation interface connected to AGND; must be soldered to PCB ground plane for adequate heat removal. |
Key specifications
| Parameter | Value |
|---|---|
| Manufacturer | Texas Instruments |
| Package | WSON-8-EP(2x2) |
| Category | Power Management (PMIC) |
| Pins | 9 |
CAD (KiCad official)
- Symbol:
TPS62160QDSGRQ1 - Footprint:
Package_SON:WSON-8-1EP_2x2mm_P0.5mm_EP0.9x1.6mm - 3D model: WSON-8-EP(2x2) (KiCad packages3D, STEP)
- 3D model files:
tps62160qdsgrq1-etched.step/tps62160qdsgrq1-etched.glbcarry the MPN laser-etched on the die in a toggleableAdom.LaserEtchgroup (Fusion-ready);tps62160qdsgrq1.step/tps62160qdsgrq1.glbare the bare package body.
Provenance
Data extracted from the manufacturer datasheet, not a distributor listing:
- Datasheet: Texas Instruments datasheet (31 pp, sha256
8426ddbeb039e891, retrieved 2026-09-23, tier: lcsc) - Datasheet language: Chinese. Pin names, descriptions, and specs on this page were extracted and translated to English by ds2sf; the linked PDF is the manufacturer original.
- Extractor: parts-factory
2.0.0/extract_pins 0.2, primaryclaude-haiku-4-5-20251001(text), consensusclaude-sonnet-5(agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish. - CAD: KiCad official libraries (CC-BY-SA 4.0).