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SMD0805P035TF
Public Made by Adomby adom
RUILON Shenzhen Ruilongyuan Elec Resettable Fuses, 0805. Unpolarised two-terminal part: the datasheet prints no pin numbers, so pins 1 and 2 follow the library convention, KiCad symbol/footprint/3D.
3D Model
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Symbol & Footprint
Schematic Symbol
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PCB Footprint
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Datasheet
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README
markdownSMD0805P035TF
RUILON Shenzhen Ruilongyuan Elec · Resettable Fuses · 0805
SMD0805P035TF from RUILON Shenzhen Ruilongyuan Elec, in a 0805. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.
Pinout
| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | 1 | passive | Terminal 1 of an unpolarised fuse; either orientation. |
| 2 | 2 | passive | Terminal 2 of an unpolarised fuse; either orientation. |
Key specifications
| Parameter | Value |
|---|---|
| Manufacturer | RUILON Shenzhen Ruilongyuan Elec |
| Package | 0805 |
| Category | Circuit Protection |
| Pins | 2 |
Electrical characteristics
Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).
| Parameter | Symbol | Min | Typ | Max | Unit | Conditions | Page |
|---|---|---|---|---|---|---|---|
| Hold current (Ihold) | Ihold | 0.35 | A | 25°C still air; maximum current device will not trip (per datasheet definition) | 3 | ||
| Trip current (Itrip) | Itrip | 0.75 | A | 25°C still air; minimum current at which device always trips (per datasheet definition) | 3 | ||
| Maximum operating voltage (Vmax) | Vmax | 6 | VDC | At rated current (Imax) | 2 | ||
| Maximum fault current (Imax) | Imax | 30 | A | At rated voltage (Vmax) | 2 | ||
| Maximum time to trip | Tmax | 0.1 | s | At 8 A test current | 2 | ||
| Device resistance prior to tripping (min) | Rimin | 0.2 | Ω | 25°C, prior to tripping | 2 | ||
| Device resistance one hour post reflow (max) | R1max | 1.2 | Ω | Measured one hour post reflow | 2 | ||
| Resistance change, passive aging | ΔR | -5 | 5 | % | Passive aging +85℃, 1000 hrs; typical (printed ±5% typical) | 1 | |
| Resistance change, humidity aging | ΔR | -5 | 5 | % | Humidity aging +85℃, 85% R.H., 168 hours; typical (printed ±5% typical) | 1 | |
| Resistance change, thermal shock | ΔR | -33 | 33 | % | Thermal shock +85℃ to -40℃, 20 times; typical (printed ±33% typical) | 1 | |
| Ambient operating temperature | -40 | 85 | °C | Ambient operating conditions | 1 | ||
| Maximum surface temperature in tripped state | 125 | °C | Device in tripped state | 1 | |||
| Reflow preheat temperature (Ts) | Ts | 150 | 200 | °C | Pb-free reflow preheat, Ts(min) to Ts(max) | 4 | |
| Reflow preheat time (ts) | ts | 60 | 180 | s | Pb-free reflow preheat, Ts(min) to Ts(max) | 4 | |
| Time above liquidus (tL) | tL | 60 | 150 | s | Pb-free reflow, liquidus TL 217°C | 4 | |
| Time within 5°C of peak (tp) | tp | 20 | 40 | s | Pb-free reflow, within 5°C of actual peak temperature | 4 | |
| Time 25°C to peak | 8 | min | Pb-free reflow, 25°C to peak temperature | 4 | |||
| Ramp-up rate to peak | 3 | °C/s | Pb-free reflow, average ramp-up rate (TL to peak) | 4 | |||
| Ramp-down rate | 6 | °C/s | Pb-free reflow, from peak | 4 | |||
| Soldering iron tip temperature | 350 | °C | Hand soldering with iron, if used (note 12) | 8 | |||
| Soldering iron contact time | 3 | s | Iron tip to solder joint contact | 8 | |||
| Distance from soldering iron joint to PTC | 1.5 | mm | Hand soldering, weld position away from PTC | 8 | |||
| Power dissipation in tripped state (Pd) | Pd | 0.5 | W | Tripped state, 25°C still air, at rated voltage | 2 | ||
| Hold current derating, ambient -40 ºC | Ihold | 0.47 | A | Ambient -40 ºC (thermal derating table) | 3 | ||
| Hold current derating, ambient -20 ºC | Ihold | 0.44 | A | Ambient -20 ºC (thermal derating table) | 3 | ||
| Hold current derating, ambient 0 ºC | Ihold | 0.39 | A | Ambient 0 ºC (thermal derating table) | 3 | ||
| Hold current derating, ambient 25 ºC | Ihold | 0.35 | A | Ambient 25 ºC (thermal derating table) | 3 | ||
| Hold current derating, ambient 40 ºC | Ihold | 0.3 | A | Ambient 40 ºC (thermal derating table) | 3 | ||
| Hold current derating, ambient 50 ºC | Ihold | 0.27 | A | Ambient 50 ºC (thermal derating table) | 3 | ||
| Hold current derating, ambient 60 ºC | Ihold | 0.24 | A | Ambient 60 ºC (thermal derating table) | 3 | ||
| Hold current derating, ambient 70 ºC | Ihold | 0.2 | A | Ambient 70 ºC (thermal derating table) | 3 | ||
| Hold current derating, ambient 85 ºC | Ihold | 0.14 | A | Ambient 85 ºC (thermal derating table) | 3 |
CAD (KiCad official)
- Symbol:
SMD0805P035TF - Footprint:
Fuse:Fuse_0805_2012Metric - 3D model: 0805 (KiCad packages3D, STEP)
- 3D model files:
smd0805p035tf-etched.step/smd0805p035tf-etched.glbcarry the MPN laser-etched on the die in a toggleableAdom.LaserEtchgroup (Fusion-ready);smd0805p035tf.step/smd0805p035tf.glbare the bare package body.
Provenance
Data extracted from the manufacturer datasheet, not a distributor listing:
- Datasheet: RUILON Shenzhen Ruilongyuan Elec datasheet (8 pp, sha256
c86aa9323bf63cf7, retrieved 2026-10-17, tier: lcsc) - Extractor: parts-factory
2.0.0/extract_pins, primarytwo-terminal convention(convention), consensusoff(agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish. - CAD: KiCad official libraries (CC-BY-SA 4.0).