Loads when you scroll to it. Unloads after 5 minutes in the background.

Symbol & Footprint

Schematic Symbol

Open full view ↗
Loads when you scroll to it. Unloads after 5 minutes in the background.

PCB Footprint

Open full view ↗
Loads when you scroll to it. Unloads after 5 minutes in the background.
Loads when you scroll to it. Unloads after 5 minutes in the background.
Download PDF
Contents

README

markdown

ES2C

onsemi · Fast Recovery / High Efficiency Diodes · DO-214AA(SMB)

ES2C from onsemi, in a DO-214AA(SMB). Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 K passive Cathode: the banded/marked end per the datasheet; pad 1 of the KiCad diode footprint.
2 A passive Anode.

Key specifications

Parameter Value
Manufacturer onsemi
Package DO-214AA(SMB)
Category Diodes
Pins 2

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
Maximum Repetitive Reverse Voltage (ES2C) VRRM 150 V TA = 25°C 1
Average Rectified Forward Current IF(AV) 2 A 0.375″ lead length at TL = 115°C 1
Non-Repetitive Peak Forward Surge Current IFSM 50 A 8.3 ms single half-sine wave 1
Storage Temperature Range TSTG -55 150 °C 1
Operating Junction Temperature Range TJ -55 150 °C 1
Power Dissipation PD 1.66 W TA = 25°C 1
Thermal Resistance, Junction to Ambient RθJA 75 °C/W Device mounted on FR-4 PCB (Note 1) 1
Thermal Resistance, Junction to Lead RθJL 20 °C/W Device mounted on FR-4 PCB (Note 1) 1
Maximum Forward Voltage VF 0.9 V IF = 2.0 A 1
Reverse Recovery Time trr 20 ns IF = 0.5 A, IR = 1.0 A, IRR = 0.25 A 1
Maximum Reverse Current at Rated VR IR 10 µA TA = 25C 1
Maximum Reverse Current at Rated VR IR 350 µA TA = 100C 1
Total Capacitance CT 18 pF VR = 4.0 V, f = 1.0 MHz 1

CAD (KiCad official)

  • Symbol: ES2C
  • Footprint: Diode_SMD:D_SMB
  • 3D model: DO-214AA(SMB) (KiCad packages3D, STEP)
  • 3D model files: es2c-etched.step / es2c-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); es2c.step / es2c.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: onsemi datasheet (5 pp, sha256 3ddaa1298e4c7b76, retrieved 2026-10-23, tier: manufacturer)
  • Extractor: parts-factory 2.0.0 / extract_pins, primary cathode-band convention (convention), consensus off (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF