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Contents

README

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LM4040DIZ-5.0

Texas Instruments · Voltage References · TO-92-3

LM4040DIZ-5.0 from Texas Instruments, in a TO-92-3. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 * passive This pin must be left floating or connected to the anode; TI recommends connecting it to the anode in high-EMI or high-frequency switching-noise environments.
2 Cathode passive Shunt current input and reverse breakdown (output) voltage pin, 5V for this LM4040DIZ-5.0 version.
3 Anode power_in Anode pin, normally grounded.

Key specifications

Parameter Value
Manufacturer Texas Instruments
Package TO-92-3
Category Power Supply Chip
Pins 3

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
Reverse Breakdown Voltage Tolerance (D grade) VR -50 50 mV IR = 100μA, TA = TJ = 25°C 27
Reverse Breakdown Voltage Tolerance (D grade) VR -99 99 mV IR = 100μA, TA = TJ = TMIN to TMAX 27
Minimum Operating Current IRMIN 54 79 μA TA = TJ = 25°C 27
Minimum Operating Current IRMIN 85 μA TA = TJ = TMIN to TMAX 27
Average Reverse Breakdown Voltage Temperature Coefficient ΔVR/ΔT -30 30 ppm/°C IR = 10mA 27
Average Reverse Breakdown Voltage Temperature Coefficient ΔVR/ΔT -150 150 ppm/°C IR = 1mA, TA = TJ = TMIN to TMAX 27
Average Reverse Breakdown Voltage Temperature Coefficient ΔVR/ΔT 20 ppm/°C IR = 1mA, TA = TJ = 25°C 27
Reverse Breakdown Voltage Change with Operating Current Change ΔVR/ΔIR 0.5 1.3 mV IRMIN ≤ IR ≤ 1mA, TA = TJ = 25°C 27
Reverse Breakdown Voltage Change with Operating Current Change ΔVR/ΔIR 1.8 mV IRMIN ≤ IR ≤ 1mA, TA = TJ = TMIN to TMAX 27
Reverse Breakdown Voltage Change with Operating Current Change ΔVR/ΔIR 3.5 10 mV 1mA ≤ IR ≤ 15mA, TA = TJ = 25°C 27
Reverse Breakdown Voltage Change with Operating Current Change ΔVR/ΔIR 15 mV 1mA ≤ IR ≤ 15mA, TA = TJ = TMIN to TMAX 27
Reverse Dynamic Impedance ZR 0.5 1.1 Ω IR = 1mA, f = 120Hz, IAC = 0.1 IR, TA = TJ = 25°C 27
Reverse Dynamic Impedance ZR 1.5 Ω IR = 1mA, f = 120Hz, IAC = 0.1 IR, TA = TJ = TMIN to TMAX 27
Reverse Current IR 74 15 μA to mA LM4040-N-5.0 6
Reverse Current (absolute maximum) 20 mA 5
Forward Current (absolute maximum) 10 mA 5
Power dissipation, TO-92 (Z) package 550 mW TA = 25°C 5
Storage temperature Tstg -65 150 °C 5
Industrial operating temperature TA -40 85 °C Industrial Temperature 6
Junction-to-ambient thermal resistance RθJA 166 °C/W LP (TO-92), 3 pins 6
Junction-to-case (top) thermal resistance RθJC(top) 88.2 °C/W LP (TO-92) 6
Junction-to-board thermal resistance RθJB 145.2 °C/W LP (TO-92) 6
Junction-to-top characterization parameter ψJT 32.5 °C/W LP (TO-92) 6
Reverse Breakdown Voltage VR 5 V IR = 100μA 27
Wideband Noise eN 80 μVrms IR = 100μA, 10Hz ≤ f ≤ 10kHz 27
Reverse Breakdown Voltage Long Term Stability ΔVR 120 ppm t = 1000 hrs, T = 25°C ±0.1°C, IR = 100μA 27
Thermal Hysteresis VHYST 0.08 % ΔT = −40°C to 125°C 27

CAD (KiCad official)

  • Symbol: LM4040DIZ-5.0
  • Footprint: Package_TO_SOT_THT:TO-92_Inline
  • 3D model: TO-92-3 (KiCad packages3D, STEP)
  • 3D model files: lm4040diz-5-0-etched.step / lm4040diz-5-0-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); lm4040diz-5-0.step / lm4040diz-5-0.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: Texas Instruments datasheet (86 pp, sha256 c06c6337438bd950, retrieved 2026-10-22, tier: lcsc)
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-sonnet-5-5 (text), consensus claude-sonnet-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF