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Contents

README

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AD5672RBCPZ-REEL7

Analog Devices · Digital To Analog Converters (DACs) · LFCSP-20(4x4)

AD5672RBCPZ-REEL7 from Analog Devices, in a LFCSP-20(4x4). Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 VDD power_in Power supply input; the device operates from 2.7 V to 5.5 V and VDD should be decoupled with a 10 µF capacitor in parallel with a 0.1 µF capacitor to GND.
2 VLOGIC power_in Digital power supply; the voltage on this pin ranges from 1.62 V to 5.5 V.
3 SYNC input Active-low frame synchronization input; when SYNC goes low, data transfers in on the falling edges of the next 24 clocks.
4 SCLK input Serial clock input; data is clocked into the input shift register on the falling edge of SCLK at rates of up to 50 MHz.
5 SDI input Serial data input to the 24-bit input shift register, clocked in on the falling edge of SCLK.
6 VOUT7 output Analog output voltage from DAC 7; the output amplifier has rail-to-rail operation.
7 VOUT6 output Analog output voltage from DAC 6; the output amplifier has rail-to-rail operation.
8 VOUT5 output Analog output voltage from DAC 5; the output amplifier has rail-to-rail operation.
9 VOUT4 output Analog output voltage from DAC 4; the output amplifier has rail-to-rail operation.
10 NIC unconnected No internal connection.
11 GND power_in Ground reference point for all circuitry on the device.
12 LDAC input Load DAC input; pulsing low updates any or all DAC registers that have new input data so all outputs update simultaneously, and the pin can be tied permanently low.
13 SDO output Serial data output used for daisy-chaining or readback; data transfers on the rising edge of SCLK and is valid on the falling edge.
14 RESET input Asynchronous reset input that is falling-edge sensitive; while RESET is low all LDAC pulses are ignored, and activation loads the input and DAC registers with zero scale or midscale per the RSTSEL state.
15 VREF power_in Reference voltage input/output; it is the reference output by default and becomes an external reference input when the internal reference is disabled.
16 NIC unconnected No internal connection.
17 VOUT3 output Analog output voltage from DAC 3; the output amplifier has rail-to-rail operation.
18 VOUT2 output Analog output voltage from DAC 2; the output amplifier has rail-to-rail operation.
19 VOUT1 output Analog output voltage from DAC 1; the output amplifier has rail-to-rail operation.
20 VOUT0 output Analog output voltage from DAC 0; the output amplifier has rail-to-rail operation.
21 EP passive Exposed pad (from the footprint; not named in the datasheet pin table).

Key specifications

Parameter Value
Manufacturer Analog Devices
Package LFCSP-20(4x4)
Category ADC/DAC/Data Conversion
Pins 21

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
Relative Accuracy (INL), Gain = 1 -1 0.12 1 LSB Gain = 1 4
Relative Accuracy (INL), Gain = 2 -1 0.12 1 LSB Gain = 2 4
Differential Nonlinearity (DNL), Gain = 1 -0.1 0.01 0.1 LSB Gain = 1 4
Differential Nonlinearity (DNL), Gain = 2 -0.1 0.01 0.1 LSB Gain = 2 4
Zero Code Error 0.8 1.6 mV Gain = 1 or gain = 2 4
Offset Error, Gain = 1 -2 -0.75 2 mV Gain = 1 4
Offset Error, Gain = 2 -1.5 -0.1 1.5 mV Gain = 2 4
Full-Scale Error, Gain = 1 -0.14 -0.018 0.14 % of FSR Gain = 1 4
Full-Scale Error, Gain = 2 -0.07 -0.013 0.07 % of FSR Gain = 2 4
Gain Error, Gain = 1 -0.12 0.04 0.12 % of FSR Gain = 1 4
Gain Error, Gain = 2 -0.06 -0.02 0.06 % of FSR Gain = 2 4
Total Unadjusted Error (TUE), Gain = 1 TUE -0.18 0.03 0.18 % of FSR Gain = 1 4
Total Unadjusted Error (TUE), Gain = 2 TUE -0.14 0.006 0.14 % of FSR Gain = 2 4
Offset Error Drift -1 1 µV/°C 4
Output Voltage Range, Gain = 1 0 2.5 V Gain = 1 4
Output Voltage Range, Gain = 2 0 5 V Gain = 2 4
Capacitive Load Stability 2 nF RL = ∞ 4
Capacitive Load Stability 10 nF RL = 1 kΩ 4
Output Current Load Capability -20 20 mA VDD ≥ 3 V 4
Reference Output Voltage 2.4975 2.5025 V 4
Reference Temperature Coefficient 2 5 ppm/°C See the Terminology section 4
Input Current -1 1 µA Per pin 5
Input Voltage Low VIL 0.3 × VLOGIC 5
Input Voltage High VIH 0.7 × VLOGIC 5
Output Voltage Low VOL 0.4 V IOL = 200 μA 5
Logic supply voltage VLOGIC 1.62 5.5 V 5
Supply voltage, Gain = 1 VDD 2.7 5.5 V Gain = 1 5
Supply voltage, Gain = 2 VDD 5.5 V Gain = 2 5
VLOGIC Supply Current, Power-on, −40°C to +105°C ILOGIC 1 µA Power-on, −40°C to +105°C 5
VLOGIC Supply Current, Power-on, −40°C to +125°C ILOGIC 1.3 µA Power-on, −40°C to +125°C 5
VLOGIC Supply Current, Power-down, −40°C to +105°C ILOGIC 0.5 µA Power-down, −40°C to +105°C 5
VLOGIC Supply Current, Power-down, −40°C to +125°C ILOGIC 1.3 µA Power-down, −40°C to +125°C 5
VDD Supply Current, Normal Mode IDD 1.1 1.26 mA Internal reference off, −40°C to +85°C 5
VDD Supply Current, Normal Mode IDD 1.8 2 mA Internal reference on, −40°C to +85°C 5
VDD Supply Current, Normal Mode IDD 1.1 1.3 mA Internal reference off 5
VDD Supply Current, Normal Mode IDD 1.8 2.1 mA Internal reference on 5
VDD Supply Current, All Power-Down Modes IDD 1 1.7 µA −40°C to +85°C 5
VDD Supply Current, All Power-Down Modes IDD 1 2.5 µA −40°C to +105°C 5
VDD Supply Current, All Power-Down Modes IDD 1 5.5 µA −40°C to +125°C 5
VDD to GND -0.3 7 V 12
VLOGIC to GND -0.3 7 V 12
Operating Temperature Range -40 125 °C 12
Storage Temperature Range -65 150 °C 12
Junction Temperature 125 °C 12
Reflow Soldering Peak Temperature, Pb-Free (J-STD-020) 260 °C 12
Junction-to-ambient thermal resistance, 20-Lead LFCSP (CP-20-8) θJA 82 °C/W JEDEC 2S2P thermal test board with nine thermal vias 12
Junction-to-board thermal resistance, 20-Lead LFCSP (CP-20-8) θJB 16.67 °C/W JEDEC 2S2P thermal test board with nine thermal vias 12
Junction-to-case thermal resistance, 20-Lead LFCSP (CP-20-8) θJC 32.5 °C/W JEDEC 2S2P thermal test board with nine thermal vias 12
Junction-to-top characterization parameter, 20-Lead LFCSP (CP-20-8) ΨJT 0.43 °C/W JEDEC 2S2P thermal test board with nine thermal vias 12
Junction-to-board characterization parameter, 20-Lead LFCSP (CP-20-8) ΨJB 22 °C/W JEDEC 2S2P thermal test board with nine thermal vias 12

CAD (KiCad official)

  • Symbol: AD5672RBCPZ-REEL7
  • Footprint: Package_DFN_QFN:QFN-20-1EP_4x4mm_P0.5mm_EP2.5x2.5mm
  • 3D model: LFCSP-20(4x4) (KiCad packages3D, STEP)
  • 3D model files: ad5672rbcpz-reel7-etched.step / ad5672rbcpz-reel7-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); ad5672rbcpz-reel7.step / ad5672rbcpz-reel7.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: Analog Devices datasheet (36 pp, sha256 82203c70f66724f4, retrieved 2026-10-30, tier: manufacturer)
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-haiku-5-5 (text), consensus claude-sonnet-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF