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EFM8BB10F8I-A-SOIC16

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SILICON LABS SILICON LABS, SOIC-16. Pinout cross-checked by two models against the datasheet, KiCad symbol/footprint/3D.

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3D Model

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Symbol & Footprint

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Datasheet

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Contents

README

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EFM8BB10F8I-A-SOIC16

SILICON LABS · SILICON LABS · SOIC-16

EFM8BB10F8I-A-SOIC16 from SILICON LABS, in a SOIC-16. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 P0.2 bidirectional Multifunction I/O with crossbar capability; also P0MAT.2, INT0.2, INT1.2, ADC0.2, CMP0P.2, CMP0N.2.
2 P0.1 bidirectional Multifunction I/O with crossbar capability; also P0MAT.1, INT0.1, INT1.1, ADC0.1, CMP0P.1, CMP0N.1.
3 P0.0 bidirectional Multifunction I/O with crossbar capability; also P0MAT.0, INT0.0, INT1.0, ADC0.0, CMP0P.0, CMP0N.0.
4 GND power_in Ground.
5 VDD power_in Supply power input (device specified for 2.2 to 3.6 V operation).
6 RSTb / C2CK bidirectional Active-low reset and C2 debug clock.
7 P2.0 / C2D bidirectional Multifunction I/O and C2 debug data.
8 P1.3 bidirectional Multifunction I/O with crossbar capability; also P1MAT.3, ADC0.11, CMP1P.5, CMP1N.5.
9 P1.2 bidirectional Multifunction I/O with crossbar capability; also P1MAT.2, ADC0.10, CMP1P.4, CMP1N.4.
10 P1.1 bidirectional Multifunction I/O with crossbar capability; also P1MAT.1, ADC0.9, CMP1P.3, CMP1N.3.
11 P1.0 bidirectional Multifunction I/O with crossbar capability; also P1MAT.0, ADC0.8, CMP1P.2, CMP1N.2.
12 P0.7 bidirectional Multifunction I/O with crossbar capability; also P0MAT.7, INT0.7, INT1.7, ADC0.7, CMP1P.1, CMP1N.1.
13 P0.6 bidirectional Multifunction I/O with crossbar capability; also P0MAT.6, CNVSTR, INT0.6, INT1.6, ADC0.6, CMP1P.0, CMP1N.0.
14 P0.5 bidirectional Multifunction I/O with crossbar capability; also P0MAT.5, INT0.5, INT1.5, ADC0.5, CMP0P.5, CMP0N.5.
15 P0.4 bidirectional Multifunction I/O with crossbar capability; also P0MAT.4, INT0.4, INT1.4, ADC0.4, CMP0P.4, CMP0N.4.
16 P0.3 bidirectional Multifunction I/O with crossbar capability; also P0MAT.3, EXTCLK, INT0.3, INT1.3, ADC0.3, CMP0P.3, CMP0N.3.

Key specifications

Parameter Value
Manufacturer SILICON LABS
Package SOIC-16
Category Embedded Processors & Controllers
Pins 16

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
Operating Supply Voltage on VDD VDD 2.2 3.6 V 15
System Clock Frequency fSYSCLK 0 25 MHz 15
Operating Ambient Temperature TA -40 125 °C I-grade or A-grade devices 15
Normal Mode supply current IDD 4.45 5.25 mA FSYSCLK = 24.5 MHz 16
Normal Mode supply current IDD 915 1600 μA FSYSCLK = 1.53 MHz 16
Normal Mode supply current IDD 250 290 μA FSYSCLK = 80 kHz, TA = 25 °C 16
Normal Mode supply current IDD 250 725 μA FSYSCLK = 80 kHz 16
Idle Mode supply current IDD 2.05 2.6 mA FSYSCLK = 24.5 MHz 16
Idle Mode supply current IDD 550 1000 μA FSYSCLK = 1.53 MHz 16
Idle Mode supply current IDD 125 130 μA FSYSCLK = 80 kHz, TA = 25 °C 16
Idle Mode supply current IDD 125 550 μA FSYSCLK = 80 kHz 16
Stop Mode supply current IDD 105 120 μA TA = 25 °C 16
Stop Mode supply current IDD 105 270 μA TA = -40 to +125 °C 16
External Input CMOS Clock Frequency fCMOS 0 25 MHz at EXTCLK pin 20
External Input CMOS Clock High Time tCMOSH 18 ns 20
External Input CMOS Clock Low Time tCMOSL 18 ns 20
ADC Throughput Rate (High Speed Mode) fS 200 ksps 12 Bit Mode 21
ADC Throughput Rate (High Speed Mode) fS 800 ksps 10 Bit Mode 21
ADC Throughput Rate (Low Power Mode) fS 62.5 ksps 12 Bit Mode 21
ADC Throughput Rate (Low Power Mode) fS 250 ksps 10 Bit Mode 21
ADC Tracking Time tTRK 230 ns High Speed Mode 21
ADC Tracking Time tTRK 450 ns Low Power Mode 21
ADC Power-On Time tPWR 1.2 µs 21
SAR Clock Frequency fSAR 6.25 MHz High Speed Mode, Reference is 2.4 V internal 21
SAR Clock Frequency fSAR 12.5 MHz High Speed Mode, Reference is not 2.4 V internal 21
SAR Clock Frequency fSAR 4 MHz Low Power Mode 21
ADC Voltage Reference Range VREF 1 V upper limit printed as VDD 21
Integral Nonlinearity INL 1 2.3 LSB 12 Bit Mode (printed ±) 21
Integral Nonlinearity INL 0.2 0.6 LSB 10 Bit Mode (printed ±) 21
Differential Nonlinearity DNL -1 0.7 1.9 LSB 12 Bit Mode 21
Differential Nonlinearity DNL 0.2 0.6 LSB 10 Bit Mode (printed ±) 21
Offset Error EOFF -3 0 3 LSB 12 Bit Mode, VREF = 1.65 V 21
Offset Error EOFF -2 0 2 LSB 10 Bit Mode, VREF = 1.65 V 21
Slope Error EM 0.02 0.1 % 12 Bit Mode (printed ±) 22
Slope Error EM 0.06 0.24 % 10 Bit Mode (printed ±) 22
Signal-to-Noise SNR 61 66 dB 12 Bit Mode 22
Signal-to-Noise SNR 53 60 dB 10 Bit Mode 22
Signal-to-Noise Plus Distortion SNDR 61 66 dB 12 Bit Mode 22
Signal-to-Noise Plus Distortion SNDR 53 60 dB 10 Bit Mode 22
Internal Fast Settling Reference Output Voltage VREFFS 1.62 1.65 1.68 V 1.65 V Setting 22
Internal Fast Settling Reference Output Voltage VREFFS 2.35 2.4 2.45 V 2.4 V Setting, VDD ≥ 2.6 V 22
Reference Turn-on Time tREFFS 1.5 µs 22
1.8 V LDO Output Voltage VOUT_1.8V 1.74 1.8 1.85 V 23
Thermal Resistance (Junction to Ambient) θJA 70 °C/W SOIC-16 Packages 29
Ambient Temperature Under Bias TBIAS -55 125 °C 29
Storage Temperature TSTG -65 150 °C 29
Voltage on VDD VDD -0.3 4.2 V min printed GND-0.3 29
Voltage on I/O pins or RST VIN -0.3 5.8 V VDD ≥ 3.3 V; min printed GND-0.3 29
Voltage on I/O pins or RST VIN -0.3 V V < 3.3 V; min printed GND-0.3, max printed VDD+2.5 29
Total Current Sunk into Supply Pin IVDD 200 mA 29
Total Current Sourced out of Ground Pin IGND 200 mA 29
Current Sourced or Sunk by Any I/O Pin or RSTb IIO -100 100 mA 29
Operating Junction Temperature TJ -40 130 °C TA = -40 °C to 125 °C (I-grade or A-grade parts only) 29
Shutdown Mode supply current IDD 0.2 μA Core halted and all clocks stopped, Internal LDO Off, Supply monitor off 16
High-Frequency Oscillator supply current IHFOSC 155 µA Operating at 24.5 MHz, TA = 25 °C 16
Low-Frequency Oscillator supply current ILFOSC 3.5 µA Operating at 80 kHz, TA = 25 °C 16

Materials and finish

As the datasheet states them (page.json metadata.appearance; the 3D model's colours follow it).

Part Material Colour / plating Datasheet says Page
housing PC 4. Recommended card reflow profile is per the JEDEC/IPC J-STD-020 specification for Small Body Components. 45

CAD (KiCad official)

  • Symbol: EFM8BB10F8I-A-SOIC16
  • Footprint: Package_SO:SOIC-16_3.9x9.9mm_P1.27mm
  • 3D model: SOIC-16 (KiCad packages3D, STEP)
  • 3D model files: efm8bb10f8i-a-soic16-etched.step / efm8bb10f8i-a-soic16-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); efm8bb10f8i-a-soic16.step / efm8bb10f8i-a-soic16.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: SILICON LABS datasheet (57 pp, sha256 5f29936d14410a6c, retrieved 2026-10-23, tier: lcsc)
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-sonnet-5-5 (text), consensus claude-sonnet-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF