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README

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MM32SPIN05PT

MindMotion Microelectronics · Microcontroller Units (MCUs/MPUs/SOCs) · LQFP-32(7x7)

MM32SPIN05PT from MindMotion Microelectronics, in a LQFP-32(7x7). Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 VDD power_in Digital power supply pin.
2 PD0-OSC_IN bidirectional 5V-tolerant (FT) I/O, main function PD0, used as HSE oscillator input OSC_IN; alternate function I2C1_SDA.
3 PD1-OSC_OUT bidirectional 5V-tolerant (FT) I/O, main function PD1, used as HSE oscillator output OSC_OUT; alternate function I2C1_SCL.
4 nRST bidirectional 5V-tolerant (FT) I/O, device reset input (nRST) with main function nRST.
5 VDDA power_in Analog power supply pin.
6 PA0-WKUP bidirectional Standard (TC) I/O PA0 with WKUP wake-up function; alternates UART2_CTS, TIM2_CH1_ETR, SPI2_NSS, TIM2_CH3, COMP1_OUT; additional function ADC1_VIN[0].
7 PA1 bidirectional Standard (TC) I/O; alternates UART2_RTS, TIM2_CH2; additional functions ADC1_VIN[1] and COMP1_INP[0].
8 PA2 bidirectional Standard (TC) I/O; alternates UART2_TX, TIM2_CH3, SPI2_NSS; additional functions ADC1_VIN[2] and COMP1_INP[1].
9 PA3 bidirectional Standard (TC) I/O; alternates UART2_RX, TIM2_CH4; additional functions ADC1_VIN[3] and COMP1_INP[2].
10 PA4 bidirectional Standard (TC) I/O; alternates SPI1_NSS, TIM1_BKIN, TIM14_CH1, I2C1_SDA; additional functions ADC1_VIN[4] and COMP1_INP[3].
11 PA5 bidirectional Standard (TC) I/O; alternates SPI1_SCK, TIM2_CH1_ETR, TIM1_ETR, I2C1_SCL, TIM1_CH3N; additional functions ADC1_VIN[5] and COMP1_INM[0].
12 PA6 bidirectional Standard (TC) I/O; alternates SPI1_MISO, TIM3_CH1, TIM1_BKIN, UART2_RX, TIM1_ETR, TIM16_CH1, TIM1_CH3, COMP1_OUT; additional functions ADC1_VIN[6] and COMP1_INM[1].
13 PA7 bidirectional Standard (TC) I/O; alternates SPI1_MOSI, TIM3_CH2, TIM1_CH1N, TIM14_CH1, TIM17_CH1, TIM1_CH2N, TIM1_CH3N; additional functions ADC1_VIN[7] and COMP1_INM[2].
14 PB0 bidirectional Standard (TC) I/O; alternates TIM3_CH3, TIM1_CH2N, TIM1_CH1N, TIM1_CH3; additional function ADC1_VIN[8].
15 PB1 bidirectional Standard (TC) I/O; alternates TIM14_CH1, TIM3_CH4, TIM1_CH3N, TIM1_CH4, TIM1_CH2N, MCO, TIM1_CH2, TIM1_CH1N; additional function ADC1_VIN[9].
16 VSS power_in Digital ground pin.
17 VDD power_in Digital power supply pin.
18 PA8 bidirectional 5V-tolerant (FT) I/O; alternates MCO, TIM1_CH1, TIM1_CH2, TIM1_CH3.
19 PA9 bidirectional 5V-tolerant (FT) I/O; alternates UART1_TX, TIM1_CH2, UART1_RX, I2C1_SCL, MCO, TIM1_CH1N, TIM1_CH4.
20 PA10 bidirectional 5V-tolerant (FT) I/O; alternates TIM17_BKIN, UART1_RX, TIM1_CH3, UART1_TX, I2C1_SDA, TIM1_CH1, SPI2_SCK.
21 PA11 bidirectional 5V-tolerant (FT) I/O; alternates UART1_CTS, SPI2_MOSI, TIM1_CH4, I2C1_SCL, COMP1_OUT.
22 PA12 bidirectional 5V-tolerant (FT) I/O; alternates UART1_RTS, TIM1_ETR, SPI2_MISO, I2C1_SDA, TIM1_CH2.
23 PA13 bidirectional 5V-tolerant (FT) I/O; default function SWDIO; alternates SPI2_MISO, MCO, TIM1_CH2, TIM1_BKIN.
24 PA14 bidirectional 5V-tolerant (FT) I/O; default function SWDCLK; alternates UART2_TX, SPI1_NSS.
25 PA15 bidirectional 5V-tolerant (FT) I/O; alternates SPI1_NSS, UART2_RX, TIM2_CH1_ETR.
26 PB3 bidirectional Standard (TC) I/O; alternates SPI1_SCK, TIM2_CH2, UART1_TX, TIM2_CH3, TIM1_CH1, TIM2_CH1; additional function ADC1_VIN[10].
27 PB4 bidirectional Standard (TC) I/O; alternates SPI1_MISO, TIM3_CH1, UART1_RX, TIM17_BKIN, TIM1_CH2, TIM2_CH2; additional function ADC1_VIN[11].
28 PB5 bidirectional 5V-tolerant (FT) I/O; alternates SPI1_MOSI, TIM3_CH2, TIM16_BKIN, MCO, TIM1_CH3, TIM2_CH3.
29 PB6 bidirectional 5V-tolerant (FT) I/O; alternates UART1_TX, I2C1_SCL, TIM16_CH1N, TIM2_CH1.
30 PB7 bidirectional Standard (TC) I/O; alternates UART1_RX, I2C1_SDA, TIM17_CH1N, UART2_TX; additional function ADC1_VIN[12].
31 BOOT0-PB8 input 5V-tolerant (FT) pin combining BOOT0 boot-mode select input and PB8 (alternates I2C1_SCL, TIM16_CH1, UART2_RX).
32 VSS power_in Digital ground pin.

Key specifications

Parameter Value
Manufacturer MindMotion Microelectronics
Package LQFP-32(7x7)
Category Single Chip Microcomputer/Microcontroller
Pins 32

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
Main supply voltage VDD - VSS -0.3 5.8 V including VDDA and VSSA 34
Input voltage on 5V tolerant pin VIN 5.8 V min is VSS - 0.3 34
Voltage variations between different power pins /ΔVDDx/ 50 mV 34
Voltage variations between different ground pins /VSSx − VSS/ 50 mV 34
Total current into VDD/VDDA IVDD 120 mA 34
Total current out of VSS IVSS 120 mA 35
Output sink current on any I/O IIO 20 mA 35
Output current on any I/O IIO -18 mA 35
Injection current on a pin IINJ(PIN) -5 5 mA NRST, OSC_IN and other pins 35
Total injection current on all I/O and control pins ΣIINJ(PIN) -25 25 mA 35
Internal AHB clock frequency fHCLK 0 72 MHz 35
Standard operating voltage VDD 2 5.5 V 35
Analog operating voltage (ADC not used) VDDA 2 5.5 V Must be the same voltage as VDD 35
Analog operating voltage (ADC used) VDDA 2.5 5.5 V 35
Ambient temperature TA -40 105 °C 35
Junction temperature range TJ -40 125 °C 35
VDD rise time rate tVDD 300 µS/V TA = 25°C 36
VDD fall time rate tVDD 300 µS/V TA = 25°C 36
Power on/down reset threshold VPOR/PDR 1.66 V 37
PDR hysteresis VPDRhys 110 mV 37
Reset duration TRSTTEMPO 0.61 ms 37
Supply current in Stop mode IDD 6 µA Enter the stop mode after reset, TA=25°C 38
Supply current in Standby mode IDD 0.4 µA Enter the standby mode after reset, TA=25°C 38
High-speed external user clock frequency fHSE_ext 2 8 24 MHz 41
OSC_IN rise time tr(HSE) 20 ns 41
OSC_IN fall time tf(HSE) 20 ns 41
OSC_IN input capacitance Cin(HSE) 5 pF 41
Duty cycle DuCy(HSE) 45 55 % 41
OSC_IN input leakage current IL -1 1 μA VSS ≤ VIN ≤ VDD 41
HSE oscillator frequency fOSC_IN 4 8 24 MHz 42
HSI frequency fHSI 48 MHz 48/72 MHz 43
HSI accuracy ACCHSI -6 6 % TA = -40°C ~ 105°C 43
HSI accuracy ACCHSI -4 4 % TA = -10°C ~ 105°C 43
HSI accuracy ACCHSI -1 1 % TA = 25 43
LSI frequency fLSI 40 KHz 43
LSI oscillator power consumption IDD(LSI) 1.1 1.7 μA 43
Wakeup from Sleep mode tWUSLEEP 4.2 μS HSI clock wakeup 44
Wakeup from Stop mode tWUSTOP 12 μS HSI clock wakeup < 2μS 44
Wakeup from Standby mode tWUSTDBY 230 μS The regulator wakes up from the off mode < 38μS 44
Data retention tRET 20 Year TA = 105°C 45
Data retention tRET 100 Year TA = 25°C 45
ESD voltage (HBM) VESD(HBM) -6000 6000 V TA = 25°C, Conforming to JEDECJS-001-2017 46
ESD voltage (CDM) VESD(CDM) -500 500 V TA = 25°C, Conforming to JEDECJS-002-2018 46
Latch-up current ILU -100 100 mA TA = 25°C, Conforming to JESD78E 46
Input leakage current Ilkg -1 1 µA 2.5V< VDD < 5.5V 47
Weak pull-up equivalent resistor RPU 10 50 kΩ 2.5V< VDD < 5.5V 47
Weak pull-down equivalent resistor RPD 10 100 kΩ 2.5V< VDD < 5.5V 47
I/O pin capacitance CIO 10 pF 2.5V< VDD < 5.5V 47
Output low level voltage, SPEED[1:0]=11 VOL 0.4 V /IIO/ = 6mA, VDD = 3.3V 48
Output high level voltage, SPEED[1:0]=11 VOH 2.8 V /IIO/ = 6mA, VDD = 3.3V 48
Output low level voltage, SPEED[1:0]=11 VOL 0.8 V /IIO/ = 20mA, VDD = 3.3V 48
Output high level voltage, SPEED[1:0]=11 VOH 2.2 V /IIO/ = 20mA, VDD = 3.3V 48
SPI clock frequency, master mode fSCK 0 36 MHz Master mode 54
SPI clock frequency, slave mode fSCK 0 18 MHz Slave mode 54
ADC supply voltage VDDA 2.5 3 5.5 V 57
ADC clock frequency fADC 15 MHz 57
ADC sampling rate fS 1 MHz 57
Comprehensive error ET 10 14 LSB fPCLK2 = 60MHz, fADC = 15MHz, RAIN < 10KΩ, VDDA = 3.3V, TA = 25°C 59
Offset error EO 4 10 LSB fPCLK2 = 60MHz, fADC = 15MHz, RAIN < 10KΩ, VDDA = 3.3V, TA = 25°C 59
Gain error EG 6 8 LSB fPCLK2 = 60MHz, fADC = 15MHz, RAIN < 10KΩ, VDDA = 3.3V, TA = 25°C 59
Temperature sensor average slope Avg_Slope 4.571 4.801 5.984 mV/°C VDD = 3.3V 61
Temperature sensor voltage at 25°C V25 1.433 1.451 1.467 V VDD = 3.3V 61

CAD (KiCad official)

  • Symbol: MM32SPIN05PT
  • Footprint: Package_QFP:LQFP-32_7x7mm_P0.8mm
  • 3D model: LQFP-32(7x7) (KiCad packages3D, STEP)
  • 3D model files: mm32spin05pt-etched.step / mm32spin05pt-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); mm32spin05pt.step / mm32spin05pt.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: MindMotion Microelectronics datasheet (74 pp, sha256 746f0c686c09733e, retrieved 2026-10-23, tier: lcsc)
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-sonnet-5-5 (text), consensus claude-sonnet-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF