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README

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INA186A4IDDFR

Texas Instruments · Current Sense Amplifiers · TSOT-23-8

INA186A4IDDFR from Texas Instruments, in a TSOT-23-8. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 VS power_in Analog power supply pin, operating from 1.7 V to 5.5 V.
2 ENABLE input Enable pin: driving it to VS turns the device on, driving it to GND turns it off, reducing supply current and placing the output in high-impedance state, and it must be driven externally or connected to VS if unused.
3 REF input Reference input that enables bidirectional current sensing with an externally applied voltage, which must be within GND to VS.
4 GND power_in Analog ground pin.
5 OUT output Analog output giving the gained-up voltage difference from IN+ to IN-, offset by the voltage applied to REF; absolute limit is GND - 0.3 V to (VS) + 0.3 V.
6 NC unconnected No internal connection; can be left floating, grounded, or connected to supply.
7 IN+ input Current-sense amplifier positive input; connect to bus voltage side of sense resistor for high-side applications or to load side for low-side applications.
8 IN- input Current-sense amplifier negative input; connect to load side of sense resistor for high-side applications or to ground side for low-side applications.

Key specifications

Parameter Value
Manufacturer Texas Instruments
Package TSOT-23-8
Category Amplifiers/Comparators
Pins 8

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
Common-mode rejection ratio CMRR 120 150 dB VSENSE = 0 mV, VIN+ = -0.1 V to 40 V, TA = -40°C to +125°C 5
Offset voltage, RTI VOS -3 50 µV VS = 1.8 V, VSENSE = 0 mV 5
Offset drift, RTI dVOS/dT 0.05 0.5 µV/°C VSENSE = 0 mV, TA = -40°C to +125°C 5
Power-supply rejection ratio, RTI PSRR -1 10 µV/V VSENSE = 0 mV, VS = 1.7 V to 5.5 V 5
Input bias current IIB 0.5 3 nA VSENSE = 0 mV 5
Input offset current IIO -0.07 0.07 nA VSENSE = 0 mV 5
Gain (A4 devices) G 200 V/V A4 devices 5
Gain error EG -0.04 1 % VOUT = 0.1 V to VS, 0.1 V 5
Gain error drift 2 10 ppm/°C TA = -40°C to +125°C 5
Nonlinearity error -0.01 0.01 % VOUT = 0.1 V to VS, 0.1 V 5
Reference voltage rejection ratio RVRR -2 10 µV/V VREF = 100 mV to VS, 100 mV, TA = -40°C to +125°C 5
Maximum capacitive load 1 nF No sustained oscillation 5
Bandwidth (A4 devices) BW 33 kHz A4 devices, CLOAD = 10 pF 5
Slew rate SR 0.3 V/µs VS = 5.0 V, VOUT = 0.5 V to 4.5 V 5
Settling time tS 30 µs From current step to within 1% of final value 5
Voltage noise density 75 nV/√Hz 5
Leakage input current IEN 1 100 nA 0 V ≤ VENABLE ≤ VS 5
High-level input voltage (DDF package) VIH 6 V DDF Package 5
Low-level input voltage (DDF package) VIL 0 V DDF Package 5
Hysteresis (DDF package) VHYS 300 mV DDF Package 5
Output leakage disabled IODIS 1 5 µA VS = 5.0 V, VOUT = 0 V to 5.0 V, VENABLE = 0 V 5
Quiescent current IQ 48 65 µA VS = 1.8 V, VSENSE = 0 mV 5
Quiescent current over temperature IQ 90 µA VS = 1.8 V, VSENSE = 0 mV, TA = -40°C to +125°C 5
Quiescent current disabled IQDIS 10 100 nA VENABLE = 0 V, VSENSE = 0 mV 6
Supply voltage VS 6 V 4
Differential input voltage (VIN+), (VIN-) VIN -42 42 V 4
Analog inputs with respect to GND VIN+, VIN- -0.3 42 V with respect to GND 4
ENABLE pin voltage VENABLE -0.3 6 V 4
Input current into any pin 5 mA 4
Operating temperature TA -55 150 °C 4
Junction temperature TJ 150 °C 4
Storage temperature Tstg -65 150 °C 4
Electrostatic discharge, human-body model V(ESD) -3000 3000 V HBM, per ANSI/ESDA/JEDEC JS-001 4
Electrostatic discharge, charged-device model V(ESD) -1000 1000 V CDM, per JEDEC JESD22-C101 4
Common-mode input range VCM -0.2 40 V 4
Input pin voltage range VIN+, VIN- -0.2 40 V 4
Operating supply voltage VS 1.7 5.5 V 4
Operating free-air temperature TA -40 125 °C 4
Junction-to-ambient thermal resistance (DDF) RθJA 137.2 °C/W DDF (SOT23) 8-pin 4
Junction-to-case (top) thermal resistance (DDF) RθJC(top) 38.4 °C/W DDF (SOT23) 8-pin 4
Junction-to-board thermal resistance (DDF) RθJB 57.1 °C/W DDF (SOT23) 8-pin 4
Junction-to-top characterization parameter (DDF) ΨJT 5.1 °C/W DDF (SOT23) 8-pin 4
Junction-to-board characterization parameter (DDF) ΨJB 56.6 °C/W DDF (SOT23) 8-pin 4

CAD (KiCad official)

  • Symbol: INA186A4IDDFR
  • Footprint: Package_TO_SOT_SMD:TSOT-23-8
  • 3D model: TSOT-23-8 (KiCad packages3D, STEP)
  • 3D model files: ina186a4iddfr-etched.step / ina186a4iddfr-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); ina186a4iddfr.step / ina186a4iddfr.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: Texas Instruments datasheet (45 pp, sha256 9b6f07521db2cf0a, retrieved 2026-11-05, tier: manufacturer)
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-haiku-5-5 (text), consensus claude-sonnet-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF