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Contents

README

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TPS4H000BQPWPRQ1

Texas Instruments · Power Distribution Switches · HTSSOP-20-EP

TPS4H000BQPWPRQ1 from Texas Instruments, in a HTSSOP-20-EP. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 IN1 input Input control for channel 1 activation; internal pulldown
2 IN2 input Input control for channel 2 activation; internal pulldown
3 IN3 input Input control for channel 3 activation; internal pulldown
4 IN4 input Input control for channel 4 activation; internal pulldown
5 SEH input CS channel-selection bit for current-sense multiplexing; internal pulldown
6 SEL input CS channel-selection bit for current-sense multiplexing; internal pulldown
7 FAULT tri_state Global fault report with open-drain structure, ORed logic for quad-channel fault conditions
8 CS output Current-sense analog output
9 CL output Adjustable current limit pin; connect to device GND if external current limit is not used
10 GND power_in Ground pin
11 DIAG_EN input Enable-disable pin for diagnostics; internal pulldown
12 THER input Thermal shutdown behavior control, latch off or auto-retry; internal pulldown
13 NC unconnected No internal connection
14 NC unconnected No internal connection
15 OUT4 output Output of channel 4 high side-switch, connected to the load
16 OUT3 output Output of channel 3 high side-switch, connected to the load
17 VS power_in Power supply voltage, 3.4 V to 40 V
18 VS power_in Power supply voltage, 3.4 V to 40 V
19 OUT2 output Output of channel 2 high side-switch, connected to the load
20 OUT1 output Output of channel 1 high side-switch, connected to the load
21 Thermal pad passive Exposed pad (from the footprint; not named in the datasheet pin table).

Key specifications

Parameter Value
Manufacturer Texas Instruments
Package HTSSOP-20-EP
Category Power Management (PMIC)
Pins 21

CAD (KiCad official)

  • Symbol: TPS4H000BQPWPRQ1
  • Footprint: Package_SO:TSSOP-20-1EP_4.4x6.5mm_P0.65mm_EP2.15x3.35mm
  • 3D model: HTSSOP-20-EP, generated from the KiCad footprint (body from the F.Fab outline, terminals on the pads, 1.2 mm nominal TSSOP height). Neither the vendor nor KiCad ships a 3D model for this package, so the dimensions are nominal, not the manufacturer's CAD (STEP)
  • 3D model files: tps4h000bqpwprq1-etched.step / tps4h000bqpwprq1-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); tps4h000bqpwprq1.step / tps4h000bqpwprq1.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: Texas Instruments datasheet (39 pp, sha256 60b04c6aa1486b75, retrieved 2026-10-01, tier: lcsc)
  • Datasheet language: Chinese. Pin names, descriptions, and specs on this page were extracted and translated to English by ds2sf; the linked PDF is the manufacturer original.
  • Extractor: parts-factory 2.0.0 / extract_pins 0.2, primary claude-haiku-4-5-20251001 (text), consensus claude-sonnet-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF