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Contents

README

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SPP11N80C3

Infineon Technologies · MOSFETs · TO-220-3

SPP11N80C3 from Infineon Technologies, in a TO-220-3. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 G input Gate; static gate-source voltage limited to ±20 V (±30 V AC, f>1 Hz), threshold 2.1 to 3.9 V at ID=0.68 mA.
2 D passive Drain (also connected to the mounting tab); VDS 800 V, continuous drain current 11 A at TC=25 °C, 33 A pulsed.
3 S passive Source; connects to the load return or ground side of the switch, with diode forward current IS of 11 A.

Key specifications

Parameter Value
Manufacturer Infineon Technologies
Package TO-220-3
Category Transistors/Thyristors
Pins 3

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
Continuous drain current ID 11 A TC=25 °C 1
Continuous drain current ID 7.1 A TC=100 °C 1
Pulsed drain current ID,pulse 33 A TC=25 °C 1
Avalanche energy, single pulse EAS 470 mJ ID=2.2 A, VDD=50 V 1
Avalanche energy, repetitive EAR 0.2 mJ ID=11 A, VDD=50 V 1
Avalanche current, repetitive IAR 11 A 1
MOSFET dv/dt ruggedness dv/dt 50 V/ns VDS=0…640 V 1
Gate source voltage, static VGS -20 20 V static 1
Gate source voltage, AC VGS -30 30 V AC (f >1 Hz) 1
Power dissipation Ptot 156 W TC=25 °C 1
Operating and storage temperature Tj, Tstg -55 150 °C 1
Mounting torque 60 Ncm M3 and M3.5 screws 1
Continuous diode forward current IS 11 A TC=25 °C 2
Diode pulse current IS,pulse 33 A 2
Reverse diode dv/dt dv/dt 4 V/ns ISD=ID, di/dt=200 A/µs, VDClink=400 V 2
Soldering temperature, wave soldering (leads) Tsold 260 °C 1.6 mm (0.063 in.) from case for 10 s 2
Thermal resistance, junction - case RthJC 0.8 K/W 2
Thermal resistance, junction - ambient RthJA 62 K/W leaded 2
Drain-source breakdown voltage V(BR)DSS 800 V VGS=0 V, ID=250 µA 2
Gate threshold voltage VGS(th) 2.1 3 3.9 V VDS=VGS, ID=0.68 mA 2
Zero gate voltage drain current (Tj=25 °C) IDSS 20 µA VDS=800 V, VGS=0 V, Tj=25 °C 2
Gate-source leakage current IGSS 100 nA VGS=20 V, VDS=0 V 2
Drain-source on-state resistance (Tj=25 °C) RDS(on) 0.39 0.45 Ω VGS=10 V, ID=7.1 A, Tj=25 °C 2
Gate charge total Qg 64 85 nC VDD=640 V, ID=11 A, VGS=0 to 10 V 3
Diode forward voltage VSD 1 1.2 V VGS=0 V, IF=IS=11 A, Tj=25 °C 3

CAD (KiCad official)

  • Symbol: SPP11N80C3
  • Footprint: Package_TO_SOT_THT:TO-220-3_Vertical
  • 3D model: TO-220-3 (KiCad packages3D, STEP)
  • 3D model files: spp11n80c3-etched.step / spp11n80c3-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); spp11n80c3.step / spp11n80c3.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: Infineon Technologies datasheet (10 pp, sha256 b4723a3a477e6497, retrieved 2026-10-19, tier: lcsc)
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-sonnet-5-5 (text+vision), consensus claude-opus-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF