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TPS62093RGTR
Public Made by Adomby adom
Texas Instruments DC-DC Converters, VQFN-16-EP(3x3). Pinout cross-checked by two models against the datasheet, KiCad symbol/footprint/3D.
3D Model
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Symbol & Footprint
Schematic Symbol
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PCB Footprint
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Datasheet
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README
markdownTPS62093RGTR
Texas Instruments · DC-DC Converters · VQFN-16-EP(3x3)
TPS62093RGTR from Texas Instruments, in a VQFN-16-EP(3x3). Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.
Pinout
| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | SW | bidirectional | Switch pin of the power stage. |
| 2 | SW | bidirectional | Switch pin of the power stage. |
| 3 | FREQ | input | Selects the switching frequency: Low sets 2.8 MHz typical and High sets 1.4 MHz typical; the pin has an active pull-down of about 400 kΩ and can be left floating for 2.8 MHz operation. |
| 4 | PG | output | Open-drain power good output that is high impedance when the output is within regulation and pulled low when the output is below its nominal value; the pull-up resistor must not connect to a voltage higher than the device input voltage. |
| 5 | FB | input | Feedback pin; for the adjustable version a resistor divider is connected here to set the output voltage, while for the fixed-output versions it may be connected to GND and has a pull-down of about 400 kΩ that is active when EN is low. |
| 6 | AGND | power_in | Analog ground; the exposed thermal pad is connected to AGND. |
| 7 | CP | bidirectional | Internal charge pump flying capacitor pin; connect a 10 nF capacitor between CP and CN. |
| 8 | CN | bidirectional | Internal charge pump flying capacitor pin; connect a 10 nF capacitor between CP and CN. |
| 9 | SS | input | Softstart control pin; a capacitor on this pin sets the softstart time, and leaving it floating sets the minimum start-up time. |
| 10 | AVIN | power_in | Bias supply input voltage pin. |
| 11 | PVIN | power_in | Power supply input voltage pin. |
| 12 | PVIN | power_in | Power supply input voltage pin. |
| 13 | EN | input | Device enable; it must be pulled high to enable the device and pulled low to disable it, with a pull-down of about 400 kΩ active when EN is low. |
| 14 | PGND | power_in | Power ground connection. |
| 15 | PGND | power_in | Power ground connection. |
| 16 | VOS | input | Output voltage sense pin; it must be connected to the output voltage. |
| 17 | EP | passive | Exposed pad (from the footprint; not named in the datasheet pin table). |
Key specifications
| Parameter | Value |
|---|---|
| Manufacturer | Texas Instruments |
| Package | VQFN-16-EP(3x3) |
| Category | Power Management (PMIC) |
| Pins | 17 |
Electrical characteristics
Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).
| Parameter | Symbol | Min | Typ | Max | Unit | Conditions | Page |
|---|---|---|---|---|---|---|---|
| Voltage range PVIN, AVIN, FB, SS, EN, FREQ, VOS | -0.3 | 7 | V | 4 | |||
| Voltage range SW, PG | -0.3 | V | 4 | ||||
| Voltage range CN, CP | -0.3 | V | 4 | ||||
| Power Good sink current PG | 1 | mA | 4 | ||||
| Operating junction temperature | TJ | -40 | 150 | °C | 4 | ||
| Storage temperature | Tstg | -65 | 150 | °C | 4 | ||
| Input voltage range | VIN | 2.5 | 6 | V | 4 | ||
| Operating ambient temperature | TA | -40 | 85 | °C | 4 | ||
| Operating junction temperature | TJ | -40 | 125 | °C | 4 | ||
| Junction-to-ambient thermal resistance | RθJA | 47 | °C/W | QFN (16 pins) | 4 | ||
| Junction-to-case (top) thermal resistance | RθJCtop | 60 | °C/W | QFN (16 pins) | 4 | ||
| Junction-to-board thermal resistance | RθJB | 20 | °C/W | QFN (16 pins) | 4 | ||
| Junction-to-top characterization parameter | ψJT | 1.5 | °C/W | QFN (16 pins) | 4 | ||
| Junction-to-board characterization parameter | ψJB | 20 | °C/W | QFN (16 pins) | 4 | ||
| Junction-to-case (bottom) thermal resistance | RθJCbot | 5.3 | °C/W | QFN (16 pins) | 4 | ||
| VIN Input voltage range | VIN | 2.5 | 6 | V | 5 | ||
| Quiescent current | IQIN | 20 | µA | Not switching, FB = FB +5%, into PVIN and AVIN | 5 | ||
| Shutdown current | Isd | 0.6 | 5 | µA | Into PVIN and AVIN | 5 | |
| Undervoltage lockout threshold | 2.1 | 2.2 | 2.3 | V | VIN falling | 5 | |
| Undervoltage lockout hysteresis | 200 | mV | 5 | ||||
| Thermal shutdown | 150 | ºC | Temperature rising | 5 | |||
| Thermal shutdown hysteresis | 20 | ºC | 5 | ||||
| Input leakage current | Ilkg | 10 | 100 | nA | EN, FREQ = GND or VIN | 5 | |
| Pull down resistance | RPD | 400 | kΩ | 5 | |||
| Softstart current | ISS | 6.3 | 7.5 | 8.7 | µA | 5 | |
| Power good threshold, output voltage rising | Vth | 93 | 95 | 97 | % | Output voltage rising | 5 |
| Power good threshold, output voltage falling | Vth | 88 | 90 | 92 | % | Output voltage falling | 5 |
| Low level voltage | VL | 0.4 | V | I(sink) = 1 mA | 5 | ||
| PG sinking current | IPG | 1 | mA | 5 | |||
| Leakage current | Ilkg | 10 | 100 | nA | VPG = 3.6 V | 5 | |
| High side FET on-resistance | RDS(on) | 50 | mΩ | ISW = 500 mA | 5 | ||
| Low side FET on-resistance | RDS(on) | 40 | mΩ | ISW = 500 mA | 5 | ||
| High side FET switch current limit | ILIM | 3.7 | 4.6 | 5.5 | A | 5 | |
| Switching frequency | fs | 2.8 | MHz | FREQ = GND, IOUT = 3 A | 5 | ||
| Switching frequency | fs | 1.4 | MHz | FREQ = VIN, IOUT = 3 A | 5 | ||
| Output discharge resistor | Rod | 200 | Ω | EN = GND, VOUT = 1.8 V | 5 | ||
| Output voltage accuracy (PWM) | VOUT | -1.4 | 1.4 | % | VIN ≥ VOUT + 1 V, fixed output voltage; IOUT = 1 A, PWM mode | 5 | |
| Output voltage accuracy (PFM) | VOUT | -1.4 | 2.5 | % | VIN ≥ VOUT + 1 V, fixed output voltage; IOUT = 0 mA, FREQ = High and Low, PFM mode | 5 | |
| Line regulation | 0.016 | %/V | VOUT = 1.8 V, PWM operation | 5 | |||
| Load regulation | 0.04 | %/A | VOUT = 1.8 V, PWM operation | 5 |
CAD (KiCad official)
- Symbol:
TPS62093RGTR - Footprint:
Package_DFN_QFN:QFN-16-1EP_3x3mm_P0.5mm_EP1.7x1.7mm - 3D model: VQFN-16-EP(3x3) (KiCad packages3D, STEP)
- 3D model files:
tps62093rgtr-etched.step/tps62093rgtr-etched.glbcarry the MPN laser-etched on the die in a toggleableAdom.LaserEtchgroup (Fusion-ready);tps62093rgtr.step/tps62093rgtr.glbare the bare package body.
Provenance
Data extracted from the manufacturer datasheet, not a distributor listing:
- Datasheet: Texas Instruments datasheet (32 pp, sha256
1aca00440b3d4033, retrieved 2026-10-08, tier: manufacturer) - Extractor: parts-factory
2.0.0/extract_pins 0.3, primaryclaude-haiku-5-5(text), consensusclaude-sonnet-5-5(agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish. - CAD: KiCad official libraries (CC-BY-SA 4.0).