component
OPA2330M
Public Made by Adomby adom
HGSEMI Operational Amplifier, SOP-8. Pinout cross-checked by two models against the datasheet, KiCad symbol/footprint/3D.
3D Model
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Symbol & Footprint
Schematic Symbol
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PCB Footprint
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Datasheet
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README
markdownOPA2330M
HGSEMI · Operational Amplifier · SOP-8
OPA2330M from HGSEMI, in a SOP-8. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.
Pinout
| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | OUTA | output | Channel A amplifier output with rail-to-rail swing. |
| 2 | INA- | input | Channel A inverting input; input range is VSS-0.5V to VDD+0.5V absolute maximum. |
| 3 | INA+ | input | Channel A non-inverting input; input range is VSS-0.5V to VDD+0.5V absolute maximum. |
| 4 | VSS | power_in | Negative supply or ground; the supply (VDD to VSS) is 1.8V to 5.5V single-supply, or ±0.9V to ±2.75V dual. |
| 5 | INB+ | input | Channel B non-inverting input; input range is VSS-0.5V to VDD+0.5V absolute maximum. |
| 6 | INB- | input | Channel B inverting input; input range is VSS-0.5V to VDD+0.5V absolute maximum. |
| 7 | OUTB | output | Channel B amplifier output with rail-to-rail swing. |
| 8 | VDD | power_in | Positive supply, 1.8V to 5.5V (7.5V absolute maximum), bypassed with a 0.1µF ceramic capacitor close to the pin. |
Key specifications
| Parameter | Value |
|---|---|
| Manufacturer | HGSEMI |
| Package | SOP-8 |
| Category | Amplifiers/Comparators |
| Pins | 8 |
Electrical characteristics
Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).
| Parameter | Symbol | Min | Typ | Max | Unit | Conditions | Page |
|---|---|---|---|---|---|---|---|
| Input Offset Voltage | VOS | 2 | 10 | µV | 4 | ||
| Power Supply Voltage (VDD to Vss) | -0.5 | 7.5 | V | 3 | |||
| PDB Input Voltage | 7 | V | min is Vss-0.5V (not numeric) | 3 | |||
| Operating Temperature Range | -45 | 125 | °C | 3 | |||
| Storage Temperature Range | -55 | 150 | °C | 3 | |||
| Junction Temperature | 160 | °C | 3 | ||||
| Lead Temperature (Soldering) | 260 | °C | 10 seconds | 3 | |||
| Package Thermal Resistance SOP-8, θJA | θJA | 125 | °C/W | TA=+25°C | 3 | ||
| Supply Voltage (single supply) | 1.8 | 5.5 | V | Single-supply operation | 1 |
CAD (KiCad official)
- Symbol:
OPA2330M - Footprint:
Package_SO:SOIC-8_3.9x4.9mm_P1.27mm - 3D model: SOP-8 (KiCad packages3D, STEP)
- 3D model files:
opa2330m-etched.step/opa2330m-etched.glbcarry the MPN laser-etched on the die in a toggleableAdom.LaserEtchgroup (Fusion-ready);opa2330m.step/opa2330m.glbare the bare package body.
Provenance
Data extracted from the manufacturer datasheet, not a distributor listing:
- Datasheet: HGSEMI datasheet (14 pp, sha256
0e3e56d42179c628, retrieved 2026-10-18, tier: lcsc) - Extractor: parts-factory
2.0.0/extract_pins 0.3, primaryclaude-sonnet-5-5(text+vision), consensusclaude-opus-5-5(agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish. - CAD: KiCad official libraries (CC-BY-SA 4.0).