component
XD232
Public Made by Adomby adom
XINLUDA RS232 ICs, DIP-16. Pinout cross-checked by two models against the datasheet, KiCad symbol/footprint/3D.
3D Model
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Symbol & Footprint
Schematic Symbol
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PCB Footprint
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Datasheet
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README
markdownXD232
XINLUDA · RS232 ICs · DIP-16
XD232 from XINLUDA, in a DIP-16. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.
Pinout
| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | C1+ | passive | Positive lead of the C1 charge-pump capacitor. |
| 2 | V+ | power_out | Positive charge pump output (+10V unloaded) for storage capacitor only. |
| 3 | C1- | passive | Negative lead of the C1 charge-pump capacitor. |
| 4 | C2+ | passive | Positive lead of the C2 charge-pump capacitor. |
| 5 | C2- | passive | Negative lead of the C2 charge-pump capacitor. |
| 6 | V- | power_out | Negative charge pump output (-10V unloaded) for storage capacitor only. |
| 7 | T2OUT | output | RS-232 line data output (to remote RS-232 system), driver 2. |
| 8 | R2IN | input | RS-232 line data input (from remote RS-232 system), receiver 2, with 5k nominal input resistance and ±30V operating range. |
| 9 | R2OUT | output | Logic data output (to UART), receiver 2. |
| 10 | T2IN | input | Logic data input (from UART), driver 2, TTL/CMOS compatible with built-in 400k pull-up to VCC. |
| 11 | T1IN | input | Logic data input (from UART), driver 1, TTL/CMOS compatible with built-in 400k pull-up to VCC. |
| 12 | R1OUT | output | Logic data output (to UART), receiver 1. |
| 13 | R1IN | input | RS-232 line data input (from remote RS-232 system), receiver 1, with 5k nominal input resistance and ±30V operating range. |
| 14 | T1OUT | output | RS-232 line data output (to remote RS-232 system), driver 1. |
| 15 | GND | power_in | Ground. |
| 16 | VCC | power_in | Supply voltage, connect to external 5V power supply (absolute maximum -0.3 to +6V). |
Key specifications
| Parameter | Value |
|---|---|
| Manufacturer | XINLUDA |
| Package | DIP-16 |
| Category | Interface |
| Pins | 16 |
Electrical characteristics
Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).
| Parameter | Symbol | Min | Typ | Max | Unit | Conditions | Page |
|---|---|---|---|---|---|---|---|
| Output Voltage Swing | -5 | 7.3 | V | All transmitter outputs loaded with 3kΩ to ground | 5 | ||
| Receiver Input Voltage Operating Range | -30 | 30 | V | 5 | |||
| RS-232 Input Hysteresis | 0.2 | 0.5 | 1 | V | VCC = +5V, no hysteresis in shutdown | 5 | |
| RS-232 Input Resistance | 3 | 5 | 7 | kΩ | TA = +25°C, VCC = +5V | 5 | |
| Transition Region Slew Rate | 4 | 30 | V/µs | TA = +25°C, VCC = +5V, RL = 3kΩ to 7kΩ, CL = 50pF to 2500pF, measured from +3V to -3V or -3V to +3V | 5 | ||
| Transmitter Output Short-Circuit Current | -10 | 10 | mA | 5 | |||
| Transmitter Output Resistance | 300 | Ω | VCC = V+ = V- = 0V, VOUT = ±2V | 5 | |||
| VCC Supply Current | 8 | 16 | mA | No load, TA = +25°C | 5 | ||
| Logic Pullup Current | 1.5 | 200 | µA | VTIN = 0V | 5 | ||
| TTL/CMOS Output Voltage Low | 0.4 | V | IOUT = 1.6mA (IOUT = 3.2mA) | 5 | |||
| TTL/CMOS Output Voltage High | 3.5 | V | IOUT = -1mA | 5 | |||
| Propagation Delay tPHLS | tPHLS | 4 | 40 | µs | RS-232 IN to TTL/CMOS OUT, CL = 150pF | 5 | |
| Propagation Delay tPLHS | tPLHS | 6 | 40 | µs | RS-232 IN to TTL/CMOS OUT, CL = 150pF | 5 | |
| VIN Input voltage (TIN) | VIN | -0.3 | V | TIN | 4 | ||
| VIN Input voltage (RIN) | VIN | -30 | 30 | V | RIN | 4 | |
| Output voltage (ROUT) | VOUT | -0.3 | V | ROUT | 4 | ||
| Supply voltage range | VCC | -0.3 | 6 | V | 4 | ||
| V+ (Note 1) | V+ | 14 | V | (Note 1) | 4 | ||
| V- (Note 1) | V- | -14 | 0.3 | V | (Note 1) | 4 | |
| Continuous Power Dissipation | P | 820 | mW | TA = +70°C; DIP16 derate 10.53mW/°C above +70°C | 4 | ||
| Operating Temperature Range | Totr | -40 | 85 | ℃ | 4 | ||
| Storage temperature range | Tstg | -45 | 125 | 4 | |||
| Lead Temperature soldering | TLT | 300 | ℃ | Soldering, 10s | 4 | ||
| Soldering Temperature reflow | TST | 225 | ℃ | Reflow | 4 | ||
| Lead-free package soldering temperature | Tf | 260 | ℃ | All other lead(Pb)-free packages | 4 | ||
| Lead-containing package soldering temperature | Tc | 240 | ℃ | All other packages containing lead(Pb) | 4 |
CAD (KiCad official)
- Symbol:
XD232 - Footprint:
Package_DIP:DIP-16_W7.62mm - 3D model: DIP-16 (KiCad packages3D, STEP)
- 3D model files:
xd232-etched.step/xd232-etched.glbcarry the MPN laser-etched on the die in a toggleableAdom.LaserEtchgroup (Fusion-ready);xd232.step/xd232.glbare the bare package body.
Provenance
Data extracted from the manufacturer datasheet, not a distributor listing:
- Datasheet: XINLUDA datasheet (11 pp, sha256
3bd61626045185e9, retrieved 2026-10-16, tier: lcsc) - Extractor: parts-factory
2.0.0/extract_pins 0.3, primaryclaude-haiku-5-5(text), consensusclaude-sonnet-5-5(agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish. - CAD: KiCad official libraries (CC-BY-SA 4.0).