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LM2576HVS-5.0RG

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HANSCHIP semiconductor DC-DC Converters, TO-263-5. Pinout cross-checked by two models against the datasheet, KiCad symbol/footprint/3D.

componentpower management (pmic)lm2576hvs-5.0rgfactory-2.0.0extractor-text
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Contents

README

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LM2576HVS-5.0RG

HANSCHIP semiconductor · DC-DC Converters · TO-263-5

LM2576HVS-5.0RG from HANSCHIP semiconductor, in a TO-263-5. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 VIN power_in Supply input voltage pin; maximum 55 V for the LM2576HV (40 V for LM2576).
2 Output output Switching output of the regulator, which drives the external inductor and catch diode and delivers up to 3 A.
3 Ground power_in Ground pin; the package tab is also ground.
4 Feedback input Feedback sense input that regulates the output voltage; on fixed-output parts such as the 5.0 V version it connects to the output.
5 ON/OFF input Active-low shutdown input with TTL-compatible levels; VIH is 1.4 V typical and VIL is 1.2 V typical, and the pin accepts -0.3 V to +VIN.
6 EP passive Exposed pad (from the footprint; not named in the datasheet pin table).

Key specifications

Parameter Value
Manufacturer HANSCHIP semiconductor
Package TO-263-5
Category Power Management (PMIC)
Pins 6

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
Output voltage (VIN = 12V, I load = 0.5A) VOUT 4.9 5 5.1 V VIN = 12V, I load = 0.5A 5
Output voltage LM2576HV (TJ = 25°C, standard-font limits) VOUT 4.8 5 5.225 V 8V ≤ VIN ≤ 55V, 0.5A ≤ I load ≤ 3A; TJ = 25°C 5
Output voltage LM2576HV (full operating junction temperature range, bold limits) VOUT 4.75 5 5.275 V 8V ≤ VIN ≤ 55V, 0.5A ≤ I load ≤ 3A; full TJ range 5
Oscillator frequency (TJ = 25°C) fO 47 52 58 kHz Note 11 7
Oscillator frequency (full operating junction temperature range) fO 42 52 63 kHz Note 11 7
Saturation voltage (TJ = 25°C) VSAT 1.4 1.8 V IOUT = 3A (Note 4) 7
Saturation voltage (full operating junction temperature range) VSAT 1.4 2 V IOUT = 3A (Note 4) 7
Maximum duty cycle (ON) DC 93 98 % Note 5: feedback pin disconnected from output, tied to 0V 7
Current limit (TJ = 25°C) ICL 4.2 5.8 6.9 A Notes 4, 11 7
Current limit (full operating junction temperature range) ICL 3.5 5.8 7.5 A Notes 4, 11 7
Output leakage current IL 7.5 mA Output = 0V; Notes 6, 7 7
Output leakage current IL 2 30 mA Output = -1V; Notes 6, 7 7
Quiescent current IQ 5 10 mA Note 6: feedback pin open from output, tied to +12V (5.0V type) 7
Standby quiescent current ISTBY 50 200 µA ON/OFF pin = 5V (OFF) 7
ON/OFF control logic input high (TJ = 25°C) VIH 2.2 1.4 V VOUT = 0V 7
ON/OFF control logic input high (full operating junction temperature range) VIH 2.4 1.4 V VOUT = 0V 7
ON/OFF control logic input low (TJ = 25°C) VIL 1.2 1 V VOUT = nominal input voltage 7
ON/OFF control logic input low (full operating junction temperature range) VIL 1.2 0.8 V VOUT = nominal input voltage 7
ON/OFF control input current (OFF) IIH 12 30 µA ON/OFF control = 5V (OFF) 7
ON/OFF control input current (ON) IIL 0 10 µA ON/OFF control = 0V (ON) 7
Supply voltage (LM2576HV) VIN 55 V LM2576HV 5
Operating junction temperature range TA -40 125 ℃ 5
Maximum supply voltage (LM2576HV) VIN 55 V 4
ON/OFF pin input voltage VON_OFF -0.3 V -0.3 ≤ V ≤ +VIN (upper limit printed as +VIN) 4
Output voltage to ground (steady state) -1 V Steady state 4
Storage temperature range TSTG -65 150 ℃ 4
Maximum junction temperature TJ 150 ℃ 4
ESD rating ESD 2 KV C = 100 pF, R = 1.5 kΩ 4
Lead soldering temperature TLEAD 245 ℃ 10 s soldering 4
Junction-to-ambient thermal resistance (TO-263) RθJA 42.6 ℃/W TO-263 package 5
Junction-to-case (top) thermal resistance (TO-263) RθJC(top) 43.3 ℃/W TO-263 package 5
Junction-to-board thermal resistance (TO-263) RθJB 22.4 ℃/W TO-263 package 5
Junction-to-top characterization parameter (TO-263) ψJT 10.7 ℃/W TO-263 package 5
Junction-to-board characterization parameter (TO-263) ψJB 21.3 ℃/W TO-263 package 5
Junction-to-case (bottom) thermal resistance (TO-263) RθJC(bot) 0.4 ℃/W TO-263 package 5
Junction-to-ambient thermal resistance (S package) θJA 50 °C/W S (TO-263) package, 0.5 sq in copper (Note 10) 7

CAD (KiCad official)

  • Symbol: LM2576HVS-5.0RG
  • Footprint: Package_TO_SOT_SMD:TO-263-5_TabPin6
  • 3D model: TO-263-5 (KiCad packages3D, STEP)
  • 3D model files: lm2576hvs-5-0rg-etched.step / lm2576hvs-5-0rg-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); lm2576hvs-5-0rg.step / lm2576hvs-5-0rg.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: HANSCHIP semiconductor datasheet (13 pp, sha256 ce51146fc016d417, retrieved 2026-10-18, tier: lcsc)
  • Datasheet language: Chinese. Pin names, descriptions, and specs on this page were extracted and translated to English by ds2sf; the linked PDF is the manufacturer original.
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-sonnet-5-5 (text+vision), consensus claude-opus-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF