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TLV27L2IDR

Texas Instruments · Operational Amplifier · SOIC-8

TLV27L2IDR from Texas Instruments, in a SOIC-8. Pinout and pin descriptions extracted from the manufacturer datasheet by ds2sf; symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 1OUT output Amplifier A output. Rail-to-rail CMOS output stage; typical swing from rail 50-420 mV depending on load and supply. Max output current 100 mA (absolute max).
2 1IN- input Amplifier A inverting input. BiMOS high-impedance input (~1000 GΩ differential, ~8 pF common-mode capacitance); input bias current ~1 pA typical.
3 1IN+ input Amplifier A non-inverting input. Input common-mode voltage range −0.2 V to (VS − 1.2 V); high impedance BiMOS input.
4 GND power_in Negative supply / ground pin (V−). In single-supply operation tie to GND; in dual-supply operation connect to the negative rail (down to −8 V). Referenced by all absolute-maximum voltages (Note 1).
5 2IN+ input Amplifier B non-inverting input. Input common-mode voltage range −0.2 V to (VS − 1.2 V); high-impedance BiMOS input.
6 2IN- input Amplifier B inverting input. High-impedance BiMOS input; input bias current ~1 pA typical.
7 2OUT output Amplifier B output. Rail-to-rail CMOS output stage; drives up to 100 mA (absolute max), typical output current 400 µA at 0.5 V from rail with VS = 2.7 V.
8 VDD power_in Positive supply pin (V+). Operating range 2.7 V to 16 V single-supply (±1.35 V to ±8 V dual). Absolute max 16.5 V. Recommend a 0.1 µF ceramic in parallel with a 6.8 µF tantalum placed within 0.1 in of the pin.

Key specifications

Parameter Value
Manufacturer Texas Instruments
Package SOIC-8
Category Op-amp/Cmp
Pins 8

Ordering variants

Same part, different packaging or reel option.

  • TLV27L2CD
  • TLV27L2CDR
  • TLV27L2IDR
  • TLV27L2CDGK
  • TLV27L2CDGKR
  • TLV27L2IDGK
  • TLV27L2IDGKR

CAD (KiCad official)

  • Symbol: TLV27L2IDR
  • Footprint: Package_SO:SOIC-8_3.9x4.9mm_P1.27mm
  • 3D model: SOIC-8 (KiCad packages3D, STEP)

3D model downloads

Two STEP files. Same geometry, different body top:

File Size Use it when
tlv27l2idr.step 122 KB You want the bare part, or you mark your own boards.
tlv27l2idr-etched.step 1.6 MB You want the part with TLV27L2IDR already on it.

The marking in the etched file is real recessed geometry cut into the solid, not a texture or a decal: 413 faces against 147 in the bare model. It survives export, section views, and rendering in any CAD tool, and it drops straight into KiCad or Fusion with no extra setup.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: Texas Instruments datasheet (26 pp, sha256 e6368f3cb3a839c1, retrieved 2026-08-17, tier: manufacturer)
  • Extractor: ds2sf (Claude). Every pin and dimension is cited to a datasheet page; it refuses to fabricate.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF