component

LMH0341SQE

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by adom

Texas Instruments Interface - Specialized, WQFN-48-EP(7x7). Pinout reviewed by a person against the datasheet, KiCad symbol/footprint/3D.

componentcommunication interface chip-uart-485-232lmh0341sqefactory-2.0.0extractor-text
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Contents

README

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LMH0341SQE

Texas Instruments · Interface - Specialized · WQFN-48-EP(7x7)

LMH0341SQE from Texas Instruments, in a WQFN-48-EP(7x7). Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 VDD3V3 power_in 3.3V Power Supply connection
2 Loopthru_EN input Loopthrough enable Input, H=Reclocked Loopthrough active, L=Reclocked Loopthrough disabled
3 GPIO_0 bidirectional General Purpose Input/Output pin 0, software configurable I/O pin
4 GPIO_1 bidirectional General Purpose Input/Output pin 1, software configurable I/O pin
5 RSVD_H input Configuration Input, must tie High via 5 kΩ resistor to VDD3V3
6 VDD2V5 power_in 2.5V Power Supply connection
7 GND power_in Ground connection
8 GND power_in Ground connection
9 GND power_in Ground connection
10 GPIO_2 bidirectional General Purpose Input/Output pin 2, software configurable I/O pin
11 RX_MUX_SEL input Input multiplexer select, H=RXIN1 selected, L=RXIN0 selected
12 DNC unconnected Do Not Connect, leave open
13 RSET input Serial Loopthrough Output Amplitude Control, resistor connected from this pin to ground to set the signal amplitude, nominally 7.87kΩ for 800mV output (SMPTE)
14 VDD3V3 power_in 3.3V Power Supply connection
15 RXIN0+ input Serial differential input Pin, Channel 0, positive input
16 RXIN0- input Serial differential input Pin, Channel 0, negative input
17 VDD3V3 power_in 3.3V Power Supply connection
18 RXIN1- input Serial differential input Pin, Channel 1, negative input
19 RXIN1+ input Serial differential input Pin, Channel 1, positive input
20 TXOUT+ output Serial Digital Interface Output Pin, Non-Inverting Output
21 TXOUT- output Serial Digital Interface Output Pin, Inverting Output
22 GND power_in Ground connection
23 GND power_in Ground connection
24 VDD2V5 power_in 2.5V Power Supply connection
25 LF_REF input Loop Filter Reference
26 LF_CP input Loop Filter Connection
27 VDDPLL power_in 3.3V PLL Power Supply connection
28 GND power_in Ground connection
29 RESET input Reset Input Pin, H=normal mode, L=device in RESET
30 LOCK output PLL LOCK Status Output, H=unlock condition, L=PLL is Locked
31 SDA bidirectional SMBus Data I/O Pin
32 SCK input SMBus Clock Input Pin
33 SMB_CS input SMBus Chip Select Input Pin, device is selected when High
34 VDD2V5 power_in 2.5V Power Supply connection
35 VDD3V3 power_in 3.3V Power Supply connection
36 RX4- output LVDS Data Output Pin RX4 negative, five channel wide DDR interface
37 RX4+ output LVDS Data Output Pin RX4 positive, five channel wide DDR interface
38 RX3- output LVDS Data Output Pin RX3 negative, five channel wide DDR interface
39 RX3+ output LVDS Data Output Pin RX3 positive, five channel wide DDR interface
40 RX2- output LVDS Data Output Pin RX2 negative, five channel wide DDR interface
41 RX2+ output LVDS Data Output Pin RX2 positive, five channel wide DDR interface
42 RX1- output LVDS Data Output Pin RX1 negative, five channel wide DDR interface
43 RX1+ output LVDS Data Output Pin RX1 positive, five channel wide DDR interface
44 RX0- output LVDS Data Output Pin RX0 negative, five channel wide DDR interface
45 RX0+ output LVDS Data Output Pin RX0 positive, five channel wide DDR interface
46 RXCLK- output LVDS Clock Output Pin negative, DDR Interface
47 RXCLK+ output LVDS Clock Output Pin positive, DDR Interface
48 DVB_ASI input DVB_ASI Select Input, H=DVB_ASI Mode enabled, L=Normal Mode enabled
DAP GND power_in Die Attach Pad, ground connection, primary GND connection for the device and must be connected to Ground along with the GND pins

Key specifications

Parameter Value
Manufacturer Texas Instruments
Package WQFN-48-EP(7x7)
Category Communication Interface Chip/UART/485/232
Pins 49

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
Supply Voltage (VDD3V3) VDD3V3 -0.3 4 V 6
Supply Voltage (VDD2V5) VDD2V5 -0.3 3 V 6
LVCMOS input voltage -0.3 V Upper limit printed as (VDD3V3+0.3V) 6
LVCMOS output voltage -0.3 V Upper limit printed as (VDD3V3+0.3V) 6
SMBus I/O Voltage -0.3 3.6 V 6
LVDS Input Voltage 0.3 3.6 V Printed as 0.3V to 3.6V 6
Junction Temperature 150 °C 6
Storage Temperature -65 150 °C 6
Lead Temperature, Soldering 260 °C 4 seconds 6
ESD Rating, Human Body Model -8 8 kV 1.5 KΩ, 100 pF; printed as ≥±8KV 6
Supply Voltage (VDD3V3-GND) VDD3V3 3.135 3.3 3.465 V 6
Supply Voltage (VDD2V5-GND) VDD2V5 2.375 2.5 2.625 V 6
Supply noise amplitude 100 mVP-P 10 Hz to 50 MHz 6
Ambient Temperature -40 25 85 °C 6
Case Temperature 102 °C 6
Input Data Rate (LMH0341) 270 2970 Mbps LMH0341 row 6
LVDS PCB board trace length 25 cm mismatch <2% 6
Loopthrough Output Driver Pullup Resistor Termination Voltage 2.5 2.625 V Maximum termination voltage should be identical to the device supply voltage (footnote 1) 6
2.5V supply current, 2.97 Gbps, LT off IDD2.5 67 77 mA 2.97 Gbps, LT off 7
2.5V supply current, 1.485 Gbps, LT off IDD2.5 52 59 mA 1.485 Gbps, LT off 7
2.5V supply current, 270 Mbps, LT off IDD2.5 40 46 mA 270 Mbps, LT off 7
2.5V supply current, 2.97 Gbps, LT on IDD2.5 99 108 mA 2.97 Gbps, LT on 7
2.5V supply current, 1.486 Gbps, LT on IDD2.5 84 92 mA 1.486 Gbps, LT on 7
2.5V supply current, 270 Mbps, LT on IDD2.5 65 71 mA 270 Mbps, LT on 7
3.3V supply current, LT off IDD3.3 106 120 mA LT off 7
3.3V supply current, LT on IDD3.3 112 127 mA LT on 7
Power Consumption PD 617 710 mW 2.97 Gbps, loopthrough enabled 7
Power Consumption PD 580 670 mW 1.485 Gbps, loopthrough enabled 7
Power Consumption PD 532 620 mW 270 Mbps, Loopthrough enabled 7
Power Consumption PD 517 610 mW 2.97 Gbps, Loopthrough Disabled 7
Power Consumption PD 480 560 mW 1.485 Gbps, Loopthrough Disabled 7
Power Consumption PD 450 530 mW 270 Mbps, Loopthrough Disabled 7
High Level Input Voltage VIH 2 V Upper limit printed as VDD3V3+0.3 7
Low Level Input Voltage VIL -0.3 0.8 V 7
High Level Output Voltage VOH 2.7 3.25 V IOH = −0.4 mA 7
Low Level Output Voltage VOL 0.1 0.3 V IOL = 2 mA 7
Input Current IIN -40 40 µA VIN = 0.4V, 2.5V or VDD; pullup and pulldown resistors not enabled 7
Input Differential Voltage VID 230 2200 mV DC Coupled, VCM = 0.05V to VDD-0.05V 8
Input Current IIN -350 50 µA 0V < VIN < 2.4V 8
Input Termination RIT 84 100 116 Ω 8
Input Jitter Tolerance TOLJIT 6 UI Frequency < f2 (From SMPTE RP 184) 8
Input Jitter Tolerance TOLJIT 0.6 UI Frequency < f3 8
Input Return Loss RL 25 dB Measured on 'ALP' evaluation board, 1.5 GHz 8
Input Return Loss RL 12 dB Measured on 'ALP' evaluation board, 3 GHz 8
Jitter Peaking δ 0.05 dB See Figure 9 8
Differential Output Voltage VOD 230 310 mV RL = 100Ω 8
Offset Voltage VOS 1.125 1.25 1.375 V 8
Output Short Circuit Current IOS -50 mA VOUT = 0V, RL = 100Ω 8
LVDS Low to High Transition time tROTR 300 ps See Figure 3 9
LVDS High to Low Transition time tROTF 300 ps See Figure 3 9
RxCLKOUT Duty Cycle tRODC 45 50 55 % 9
Data, Clock Input Low Voltage VSIL 0.8 V 10
Data, Clock Input High Voltage VSIH 2.1 V Printed as 2.1 VSDD 10
SDI Output Datarate 270 2970 MHz 11
SDI Output Voltage (Loopthrough Into 75Ω Load) VOD 720 800 880 mV Loopthrough into 75Ω load 11
Output Return Loss RL 15 dB Measured 5 MHz to 1483 MHz 11
Bus Operating Frequency fSMB 10 100 kHz 10
Time in which a device must be operational after power on tPOR 500 ms 10
Input Termination (SMBus), RSTERM RSTERM 1000 Ω SMBus termination resistor value (single printed value, no min/max) 6
Thermal Resistance, Junction to Ambient θJA 26 °C/W Junction to ambient 6

Materials and finish

As the datasheet states them (page.json metadata.appearance; the 3D model's colours follow it).

Part Material Colour / plating Datasheet says Page
housing Abs ESD Rating, Human Body Model, 1.5 KΩ, 100 pF ≥±8KV (1) “Absolute Maximum Ratings” are the ratings beyond which the safety of the device cannot be ensured. It is not implied that the device 6

CAD (KiCad official)

  • Symbol: LMH0341SQE
  • Footprint: Package_DFN_QFN:QFN-48-1EP_7x7mm_P0.5mm_EP5.15x5.15mm
  • 3D model: WQFN-48-EP(7x7) (KiCad packages3D, STEP)
  • 3D model files: lmh0341sqe-etched.step / lmh0341sqe-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); lmh0341sqe.step / lmh0341sqe.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: Texas Instruments datasheet (35 pp, sha256 e95da2b015ff92f7, retrieved 2026-10-21, tier: lcsc)
  • Extractor: ds2sf (Claude). Every pin and dimension is cited to a datasheet page; it refuses to fabricate.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF