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Contents

README

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XC6219B302MR-MS

MSKSEMI · Voltage Regulators - Linear, Low Drop Out (LDO) Regulators · SOT-23-5

XC6219B302MR-MS from MSKSEMI, in a SOT-23-5. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 VIN power_in Power input pin; the datasheet's absolute maximum supply voltage is 8V (range -0.3V to 8V), and a 10uF input capacitor should be connected between VIN and GND.
2 GND power_in Ground pin; keep the resistance of the VIN-to-GND wiring low, and place the input and output capacitors as close to the IC as possible.
3 CE input Chip enable pin that shuts down the internal circuitry; the datasheet recommends driving it with either a VIN or VSS voltage, and its logic polarity is set by the selected option.
4 NC unconnected No connection; the datasheet lists this pin as no connection.
5 VOUT power_out Regulated output pin; an output capacitor of at least 10uF should be connected as close as possible to VOUT and GND for phase compensation.

Key specifications

Parameter Value
Manufacturer MSKSEMI
Package SOT-23-5
Category Power Management (PMIC)
Pins 5

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
Supply Voltage (absolute maximum) -0.3 8 V 4
Storage Temperature -50 125 C 4
Operating Temperature -40 85 C 4
Line Regulation △Vout1/(△Vin·Vout) 0.05 0.2 %/V 4.3V≤Vin≤8V, Iout=10mA 5
Load Regulation △Vout 10 30 V Vin=4.3V, 1.0mA≤Iout≤100mA 5
Output voltage Temperature Coefficient △Vout/(Ta· Vout) -100 100 Ppm/C Iout=30mA, 0C≤Ta≤70C 5
Input Voltage Vin 8 V 5
Thermal Resistance (Junction to Ambient), SOT23-5 θJA 500 ℃/W Assume no ambient airflow, no heat sink 4
Power Dissipation, SOT23-5 PD 0.25 W Ta=25℃ 4
Output Capacitor (CL), minimum CL 10 uF Connected as close as possible to VOUT and GND pins 6

CAD (KiCad official)

  • Symbol: XC6219B302MR-MS
  • Footprint: Package_TO_SOT_SMD:SOT-23-5
  • 3D model: SOT-23-5 (KiCad packages3D, STEP)
  • 3D model files: xc6219b302mr-ms-etched.step / xc6219b302mr-ms-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); xc6219b302mr-ms.step / xc6219b302mr-ms.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: MSKSEMI datasheet (9 pp, sha256 86e38fb7ca4262ed, retrieved 2026-10-18, tier: lcsc)
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-haiku-5-5 (text), consensus claude-sonnet-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF