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Contents

Pinout
Key specifications
Electrical characteristics
Materials and finish
CAD (KiCad official)
Provenance

README

markdown

ESP32-S2-MINI-1-N4

Espressif Systems · RF and Wireless · 56-VFQFN Exposed Pad

ESP32-S2-MINI-1-N4 from Espressif Systems, in a 56-VFQFN Exposed Pad. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin	Name	Type	Function
1	GND	power_in	Ground.
2	GND	power_in	Ground.
3	3V3	power_in	Power supply, recommended 3.0 to 3.6 V (3.3 V typ), with at least 0.5 A delivered by the external supply.
4	IO0	bidirectional	RTC_GPIO0/GPIO0; strapping pin (default pull-up) that selects SPI boot when 1 and Download Boot when 0 together with GPIO46.
5	IO1	bidirectional	General-purpose I/O with functions RTC_GPIO1, GPIO1, TOUCH1, ADC1_CH0.
6	IO2	bidirectional	General-purpose I/O with functions RTC_GPIO2, GPIO2, TOUCH2, ADC1_CH1.
7	IO3	bidirectional	General-purpose I/O with functions RTC_GPIO3, GPIO3, TOUCH3, ADC1_CH2.
8	IO4	bidirectional	General-purpose I/O with functions RTC_GPIO4, GPIO4, TOUCH4, ADC1_CH3.
9	IO5	bidirectional	General-purpose I/O with functions RTC_GPIO5, GPIO5, TOUCH5, ADC1_CH4.
10	IO6	bidirectional	General-purpose I/O with functions RTC_GPIO6, GPIO6, TOUCH6, ADC1_CH5.
11	IO7	bidirectional	General-purpose I/O with functions RTC_GPIO7, GPIO7, TOUCH7, ADC1_CH6.
12	IO8	bidirectional	General-purpose I/O with functions RTC_GPIO8, GPIO8, TOUCH8, ADC1_CH7.
13	IO9	bidirectional	General-purpose I/O with functions RTC_GPIO9, GPIO9, TOUCH9, ADC1_CH8, FSPIHD.
14	IO10	bidirectional	General-purpose I/O with functions RTC_GPIO10, GPIO10, TOUCH10, ADC1_CH9, FSPICS0, FSPIIO4.
15	IO11	bidirectional	General-purpose I/O with functions RTC_GPIO11, GPIO11, TOUCH11, ADC2_CH0, FSPID, FSPIIO5.
16	IO12	bidirectional	General-purpose I/O with functions RTC_GPIO12, GPIO12, TOUCH12, ADC2_CH1, FSPICLK, FSPIIO6.
17	IO13	bidirectional	General-purpose I/O with functions RTC_GPIO13, GPIO13, TOUCH13, ADC2_CH2, FSPIQ, FSPIIO7.
18	IO14	bidirectional	General-purpose I/O with functions RTC_GPIO14, GPIO14, TOUCH14, ADC2_CH3, FSPIWP, FSPIDQS.
19	IO15	bidirectional	General-purpose I/O with functions RTC_GPIO15, GPIO15, U0RTS, ADC2_CH4, XTAL_32K_P.
20	IO16	bidirectional	General-purpose I/O with functions RTC_GPIO16, GPIO16, U0CTS, ADC2_CH5, XTAL_32K_N.
21	IO17	bidirectional	General-purpose I/O with functions RTC_GPIO17, GPIO17, U1TXD, ADC2_CH6, DAC_1.
22	IO18	bidirectional	General-purpose I/O with functions RTC_GPIO18, GPIO18, U1RXD, ADC2_CH7, DAC_2, CLK_OUT3.
23	IO19	bidirectional	General-purpose I/O with functions RTC_GPIO19, GPIO19, U1RTS, ADC2_CH8, CLK_OUT2, USB D-.
24	IO20	bidirectional	General-purpose I/O with functions RTC_GPIO20, GPIO20, U1CTS, ADC2_CH9, CLK_OUT1, USB D+.
25	IO21	bidirectional	General-purpose I/O with functions RTC_GPIO21, GPIO21.
26	IO26	bidirectional	SPICS1/GPIO26; used by the embedded PSRAM only on the N4R2 variants, so it is a usable GPIO on the -N4 module.
27	NC	unconnected	No connection.
28	IO33	bidirectional	General-purpose I/O with functions SPIIO4, GPIO33, FSPIHD.
29	IO34	bidirectional	General-purpose I/O with functions SPIIO5, GPIO34, FSPICS0.
30	GND	power_in	Ground.
31	IO35	bidirectional	General-purpose I/O with functions SPIIO6, GPIO35, FSPID.
32	IO36	bidirectional	General-purpose I/O with functions SPIIO7, GPIO36, FSPICLK.
33	IO37	bidirectional	General-purpose I/O with functions SPIDQS, GPIO37, FSPIQ.
34	IO38	bidirectional	General-purpose I/O with functions GPIO38, FSPIWP.
35	IO39	bidirectional	General-purpose I/O with functions MTCK, GPIO39, CLK_OUT3.
36	IO40	bidirectional	General-purpose I/O with functions MTDO, GPIO40, CLK_OUT2.
37	IO41	bidirectional	General-purpose I/O with functions MTDI, GPIO41, CLK_OUT1.
38	IO42	bidirectional	General-purpose I/O with functions MTMS, GPIO42.
39	TXD0	bidirectional	UART0 transmit U0TXD / GPIO43 / CLK_OUT1; also the default ROM message output.
40	RXD0	bidirectional	UART0 receive U0RXD / GPIO44 / CLK_OUT2.
41	IO45	bidirectional	GPIO45; strapping pin (default pull-down) that selects the VDD_SPI voltage.
42	GND	power_in	Ground.
43	GND	power_in	Ground.
44	IO46	input	GPIO46 input only; strapping pin (default pull-down) that controls boot mode together with GPIO0 and ROM message printing.
45	EN	input	Chip enable: high turns the chip on, low powers it off; do not leave floating.
46	GND	power_in	Ground.
47	GND	power_in	Ground.
48	GND	power_in	Ground.
49	GND	power_in	Ground.
50	GND	power_in	Ground.
51	GND	power_in	Ground.
52	GND	power_in	Ground.
53	GND	power_in	Ground.
54	GND	power_in	Ground.
55	GND	power_in	Ground.
56	GND	power_in	Ground.
57	GND	power_in	Ground.
58	GND	power_in	Ground.
59	GND	power_in	Ground.
60	GND	power_in	Ground.
61	GND	power_in	Ground; this is the EPAD, and soldering it to the base board ground is optional but improves thermal performance.
62	GND	power_in	Ground.
63	GND	power_in	Ground.
64	GND	power_in	Ground.
65	GND	power_in	Ground.

Key specifications

Parameter	Value
Manufacturer	Espressif Systems
Package	56-VFQFN Exposed Pad
Category	RF and Wireless
Pins	65

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter	Symbol	Min	Typ	Max	Unit	Conditions	Page
Power supply voltage	VDD33	-0.3		3.6	V		15
Storage temperature	TSTORE	-40		105	°C		15
Power supply voltage	VDD33	3	3.3	3.6	V		15
Current delivered by external power supply	IVDD	0.5			A		15
Operating ambient temperature (85 °C version)	TA	-40		85	°C	85 °C version	15
High-level input current	IIH			50	nA		15
Low-level input current	IIL			50	nA		15

Materials and finish

As the datasheet states them (page.json metadata.appearance; the 3D model's colours follow it).

Part	Material	Colour / plating	Datasheet says	Page
housing	THERMOPLASTIC		HOUSING MATERIAL: THERMOPLASTIC, WHITE, UL 94V-0;	27
contacts	COPPER ALLOY	gold	CONTACT MATERIAL: COPPER ALLOY, GOLD PLATED ALL OVER;	27
shell	COPPER ALLOY	gold	SHELL MATERIAL: COPPER ALLOY, GOLD PLATED ALL OVER;	27

CAD (KiCad official)

Symbol: ESP32-S2-MINI-1-N4
Footprint: PCM_Espressif:ESP32-S2-MINI-1
3D model: 56-VFQFN Exposed Pad (KiCad packages3D, STEP)
3D model files: esp32-s2-mini-1-n4-etched.step / esp32-s2-mini-1-n4-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); esp32-s2-mini-1-n4.step / esp32-s2-mini-1-n4.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

Datasheet: Espressif Systems datasheet (34 pp, sha256 06999476c9d1dede, retrieved 2026-10-28, tier: manufacturer)
Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-sonnet-5-5 (text+vision), consensus claude-opus-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF