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Contents

README

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CAT811RTBI-GT3-HXY

HXY MOSFET · Supervisor And Reset ICs · SOT-143

CAT811RTBI-GT3-HXY from HXY MOSFET, in a SOT-143. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 GND power_in Ground reference pin for the device.
2 RESET output Push-pull output that is pulled low when VIN is below the detect level and pushed high when VIN is above the detect level for 240ms.
3 MR input Manual reset input with logic thresholds of VIH at 0.7xVIN minimum and VIL at 0.3xVIN maximum.
4 VIN power_in Power input and the voltage node to be monitored, with an input voltage range of 1 to 6 V.

Key specifications

Parameter Value
Manufacturer HXY MOSFET
Package SOT-143
Category Power Management (PMIC)
Pins 4

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
Input voltage range VIN -0.3 8 V 2
Input voltage range VIN 1 6 V 3
Quiescent current IQ 3 5 10 µA VIN = 3.6V, TA=25°C 3
Quiescent current IQ 2 3.5 10 µA VIN = 3.6V, TA=-40°C 3
Quiescent current IQ 4 6.3 15 µA VIN = 3.6V, TA=125°C 3
Detecting voltage level VDET 2.564 2.63 2.696 V VDET = 2.63V 3
Delay time 150 240 560 ms TA = -40°C to 85°C 3
Reset falling delay 2 50 µs VIN falling below VDET 3
Reset output low voltage VOL 0 0.03 0.3 V ISINK = 1.2mA, VIN=2V 3
Lead temperature 260 °C 2
Output voltage RESET VRESET -0.3 V upper limit printed as VIN+0.3 V 2
Junction temperature TJ -40 125 °C 2
Continuous power dissipation PD 0.3 W 2
Storage temperature range TSTG -65 150 °C 2
Thermal resistance, junction-to-ambient θJA 280 °C/W 2
Thermal resistance, junction-case θJC 90 °C/W 2

CAD (KiCad official)

  • Symbol: CAT811RTBI-GT3-HXY
  • Footprint: Package_TO_SOT_SMD:SOT-143
  • 3D model: SOT-143 (KiCad packages3D, STEP)
  • 3D model files: cat811rtbi-gt3-hxy-etched.step / cat811rtbi-gt3-hxy-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); cat811rtbi-gt3-hxy.step / cat811rtbi-gt3-hxy.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: HXY MOSFET datasheet (5 pp, sha256 2f8088f223f3d88e, retrieved 2026-11-02, tier: lcsc)
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-haiku-5-5 (text), consensus claude-sonnet-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF