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Contents

README

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GBU2510

XUMAO · Bridge Rectifiers · GBU

GBU2510 from XUMAO, in a GBU. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 - passive DC negative output of the bridge, the leftmost lead marked "-" on the package face; rated 1000V VRRM and 25A average forward current.
2 AC1 passive AC input lead marked "AC" (second from left); maximum RMS input voltage 700V.
3 AC2 passive AC input lead marked "AC" (third from left); maximum RMS input voltage 700V.
4 + passive DC positive output of the bridge, the rightmost lead marked "+" on the package face; rated 25A average forward current.

Key specifications

Parameter Value
Manufacturer XUMAO
Package GBU
Category Diodes
Pins 4

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
Maximum Recurrent Peak Reverse Voltage VRRM 1000 V 1
Maximum RMS Voltage VRMS 700 V 1
Maximum DC Blocking Voltage VDC 1000 V 1
Maximum Average Forward Rectified Current IO(AV) 25 A at TL = 100℃ 1
Peak Forward Surge Current IFSM 250 A 8.3ms single half-sine-wave superimposed on rated load (JEDEC Method) 1
Forward Surge Current (Non-repetitive) 500 A @1ms, square wave, 1 cycle, Tj=25℃ 1
Current squared time I2t 259.4 A2S @1ms≤t≤8.3ms Tj=25℃, rating per diode 1
Maximum Forward Voltage VFM 1.1 V at 12.5A DC 1
Maximum Reverse Current IR 5 uA TA = 25℃, at Rated DC Blocking Voltage 1
Maximum Reverse Current IR 100 uA TA = 100℃, at Rated DC Blocking Voltage 1
Operating Junction Temperature Range TJ -55 150 ℃ 1
Storage Temperature Range TSTG -55 150 ℃ 1
Typical Thermal Resistance RθJA 75 ℃/W 1

Materials and finish

As the datasheet states them (page.json metadata.appearance; the 3D model's colours follow it).

Part Material Colour / plating Datasheet says Page
contacts tin Terminals:Tin Plated leads, solderable per Mil-STD-750 Method 2026 1

CAD (KiCad official)

  • Symbol: GBU2510
  • Footprint: Diode_THT:Diode_Bridge_Vishay_GBU
  • 3D model: GBU (KiCad packages3D, STEP)
  • 3D model files: gbu2510-etched.step / gbu2510-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); gbu2510.step / gbu2510.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: XUMAO datasheet (5 pp, sha256 fc9a2bfb91fb6698, retrieved 2026-10-22, tier: lcsc)
  • Extractor: ds2sf (Claude). Every pin and dimension is cited to a datasheet page; it refuses to fabricate.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF