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Contents

README

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CESD3V3D3

UMW · ESD And Surge Protection (TVS/ESD) · SOD-323

CESD3V3D3 from UMW, in a SOD-323. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 Pin1 passive Pin 1 of the unidirectional ESD protection diode, shown only as a label in the SOD-323 pinning figure; the text does not state whether it is the anode or cathode.
2 Pin2 passive Pin 2 of the unidirectional ESD protection diode, shown only as a label in the SOD-323 pinning figure; the text does not state whether it is the anode or cathode.

Key specifications

Parameter Value
Manufacturer UMW
Package SOD-323
Category Circuit Protection
Pins 2

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
Reverse stand-off voltage VRWM 3.3 V 4
Reverse leakage current IR 5 µA 4
Breakdown voltage V(BR) 5.9 V IT=1mA 4
Clamping voltage VC 10 V IPP=16A 4
Clamping voltage (max) VC 13 V IPP=16A 4
Forward voltage VF 0.9 V IF=10mA 4
Junction capacitance CJ 13 pF VR=0V, f=1MHz 4
ESD voltage, IEC 61000-4-2 Air Model VESD 25 kV Device stressed with ten non-repetitive ESD pulses 2
ESD voltage, IEC 61000-4-2 Contact Model VESD 25 kV Device stressed with ten non-repetitive ESD pulses 2
ESD voltage, Human Body Model VESD 16 kV Device stressed with ten non-repetitive ESD pulses 2
ESD voltage, Machine Model VESD 0.4 kV Device stressed with ten non-repetitive ESD pulses 2
Peak pulse power PPP 210 W Non-repetitive current pulse 8/20µs exponential decay waveform according to IEC61000-4-5 2
Peak pulse current IPP 16 A Non-repetitive current pulse 8/20µs exponential decay waveform according to IEC61000-4-5 2
Lead solder temperature (10 s) TL 260 °C 10 second duration 2
Junction temperature TJ 150 °C 2
Storage temperature range TSTG -55 150 °C 2

CAD (KiCad official)

  • Symbol: CESD3V3D3
  • Footprint: Diode_SMD:D_SOD-323
  • 3D model: SOD-323 (KiCad packages3D, STEP)
  • 3D model files: cesd3v3d3-etched.step / cesd3v3d3-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); cesd3v3d3.step / cesd3v3d3.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: UMW datasheet (8 pp, sha256 3689c123e775c217, retrieved 2026-10-23, tier: lcsc)
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-haiku-5-5 (text), consensus claude-sonnet-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF