M24C64-DFDW6TP from STMicroelectronics, in a TSSOP-8. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin	Name	Type	Function
1	E0	input	Chip Enable input (Table 1); one of the three bits that set the device select code, and it must be held at a defined level for the device to be addressed.
2	E1	input	Chip Enable input (Table 1); one of the three bits that set the device select code, and it must be held at a defined level for the device to be addressed.
3	E2	input	Chip Enable input (Table 1); one of the three bits that set the device select code, and it must be held at a defined level for the device to be addressed.
4	VSS	power_in	Ground reference for the device (Table 1).
5	SDA	bidirectional	Serial Data I/O of the I2C bus (Table 1); when driven low it sinks up to 5 mA maximum (IOL, Table 8).
6	SCL	input	Serial Clock input of the I2C bus (Table 1); clock frequency up to 1 MHz when VCC is at least 1.7 V (Table 11).
7	WC	input	Write Control input (Table 1); when high, data writes are inhibited (Figure 11 WC = 1 case).
8	VCC	power_in	Supply voltage (Table 1); 1.7 V to 5.5 V for voltage range F, which covers this MPN (Table 11).

Key specifications

Parameter	Value
Manufacturer	STMicroelectronics
Package	TSSOP-8
Category	Memory
Pins	8

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter	Symbol	Min	Max	Unit	Conditions	Page
Ambient operating temperature		-40	130	°C		24
Storage temperature	TSTG	-65	150	°C		24
DC output current (SDA = 0)	IOL		5	mA	SDA = 0	24
Input or output range	VIO	-0.5	6.5	V		24
Supply voltage	VCC	-0.5	6.5	V		24
Electrostatic pulse (Human Body model)	VESD		3000	V	AEC-Q100-002, C1=100 pF, R1=1500 Ω	24
Supply voltage (voltage range F)	VCC	1.7	5.5	V	Voltage range F	25
Ambient operating temperature: READ	TA	-40	85	°C	READ	25
Ambient operating temperature: WRITE	TA	0	85	°C	WRITE	25
Operating clock frequency	fC		1000	kHz	VCC ≥ 1.7 V	25
Load capacitance	Cbus		100	pF		25
SCL input rise/fall time, SDA input fall time			50	ns		25
Input capacitance (SDA)	CIN		8	pF		26
Input capacitance (other pins)	CIN		6	pF		26
Input impedance (E2, E1, E0, WC) when selected	ZL	30		kΩ	VIN < 0.3 VCC	26
Input impedance (E2, E1, E0, WC) when selected	ZH	500		kΩ	VIN > 0.7 VCC	26
Write cycle endurance	Ncycle		4e+06	Write cycle	TA ≤ 25 °C, VCC(min) < VCC < VCC(max)	26
Write cycle endurance	Ncycle		1.2e+06	Write cycle	TA = 85 °C, VCC(min) < VCC < VCC(max)	26
Data retention		200		Year	TA = 55 °C	26
Input leakage current (E1, E2, SCL, SDA)	ILI	-2	2	µA	VIN = VSS or VCC, device in Standby mode	29
Output leakage current	ILO	-2	2	µA	SDA in Hi-Z, external voltage applied on SDA: VSS or VCC	29
Supply current (Read)	ICC		0.8	mA	VCC = 1.6 V or 1.7 V, fC = 400 kHz	29
Supply current (Write)	ICC0		1.5	mA	During tW, VCC < 2.5 V	29
Standby supply current	ICC1		1	µA	Device not selected, VIN = VSS or VCC, VCC = 1.6 V or 1.7 V	29
Input low voltage (SCL, SDA, WC, Ei); printed max 0.25 VCC	VIL	-0.45	0.25	V	VCC < 2.5 V	29
Input high voltage (SCL, SDA); printed min 0.75 VCC	VIH	0.75	6.5	V	VCC < 2.5 V	29
Input high voltage (WC, E2, E1, E0); printed min 0.75 VCC, max VCC+0.6 V	VIH	0.75		V	VCC < 2.5 V	29
Output low voltage	VOL		0.2	V	IOL = 1 mA, VCC = 1.6 V or 1.7 V	29
Clock frequency (400 kHz AC)	fC		400	kHz		30
Clock pulse width high	tCHCL	600		ns		30
Clock pulse width low	tCLCH	1300		ns		30
SDA (out) fall time	tQL1QL2	20	300	ns	CL = 10 pF	30
Data in set up time	tDXCH	100		ns		30
Data in hold time	tCLDX	0		ns		30
Data out hold time	tCLQX	50		ns		30
Clock low to next data valid (access time)	tCLQV		900	ns	Rbus × Cbus within Figure 15 limits	30
Start condition setup time	tCHDL	600		ns		30
Start condition hold time	tDLCL	600		ns		30
Stop condition set up time	tCHDH	600		ns		30
Time between Stop condition and next Start condition	tDHDL	1300		ns		30
WC set up time (before the Start condition)	tWLDL	0		µs	WC=0 to enable WRITE command	30
WC hold time (after the Stop condition)	tDHWH	1		µs	WC=0 to enable WRITE command	30
Internal Write cycle duration	tW		5	ms		30
Pulse width ignored (input filter on SCL and SDA)	tNS		50	ns	Single glitch	30

Materials and finish

As the datasheet states them (page.json metadata.appearance; the 3D model's colours follow it).

Part	Material	Colour / plating	Datasheet says	Page
contacts		tin	Lead temperature during soldering see note(1) 1. Compliant with JEDEC Std J-STD-020D (for small body, Sn-Pb or Pb-free assembly), the ST ECOPACK2®	24

CAD (KiCad official)

Symbol: M24C64-DFDW6TP
Footprint: Package_SO:TSSOP-8_4.4x3mm_P0.65mm
3D model: TSSOP-8 (KiCad packages3D, STEP)
3D model files: m24c64-dfdw6tp-etched.step / m24c64-dfdw6tp-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); m24c64-dfdw6tp.step / m24c64-dfdw6tp.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

Datasheet: STMicroelectronics datasheet (54 pp, sha256 297d3d80b153effd, retrieved 2026-11-05, tier: manufacturer)
Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-haiku-5-5 (text), consensus claude-sonnet-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF

M24C64-DFDW6TP

Verified M24C64-DFDW6TP

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3D Model

Symbol & Footprint

Schematic Symbol

PCB Footprint

Datasheet

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