FIN1031MX from onsemi, in a SOIC-16. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin	Name	Type	Function
1	DIN1	input	LVTTL data input for channel 1; VIH 2.0V to VCC, VIL GND to 0.8V.
2	DOUT1+	output	Non-inverting LVDS driver output for channel 1, typical differential swing 350mV into 100Ω.
3	DOUT1-	output	Inverting LVDS driver output for channel 1, typical differential swing 350mV into 100Ω.
4	EN	input	Driver enable pin; outputs are active when EN is HIGH, and high impedance when EN is LOW and /EN is HIGH.
5	DOUT2-	output	Inverting LVDS driver output for channel 2, typical differential swing 350mV into 100Ω.
6	DOUT2+	output	Non-inverting LVDS driver output for channel 2, typical differential swing 350mV into 100Ω.
7	DIN2	input	LVTTL data input for channel 2; VIH 2.0V to VCC, VIL GND to 0.8V.
8	GND	power_in	Ground.
9	DIN3	input	LVTTL data input for channel 3; VIH 2.0V to VCC, VIL GND to 0.8V.
10	DOUT3+	output	Non-inverting LVDS driver output for channel 3, typical differential swing 350mV into 100Ω.
11	DOUT3-	output	Inverting LVDS driver output for channel 3, typical differential swing 350mV into 100Ω.
12	/EN	input	Inverting driver enable pin; outputs are active when /EN is LOW, and high impedance when EN is LOW and /EN is HIGH.
13	DOUT4-	output	Inverting LVDS driver output for channel 4, typical differential swing 350mV into 100Ω.
14	DOUT4+	output	Non-inverting LVDS driver output for channel 4, typical differential swing 350mV into 100Ω.
15	DIN4	input	LVTTL data input for channel 4; VIH 2.0V to VCC, VIL GND to 0.8V.
16	VCC	power_in	Power supply, 3.0V to 3.6V recommended operating range (absolute max −0.5V to +4.6V).

Key specifications

Parameter	Value
Manufacturer	onsemi
Package	SOIC-16
Category	Interface ICs
Pins	16

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter	Symbol	Min	Typ	Max	Unit	Conditions	Page
Output Differential Voltage	VOD	250	350	450	mV		2
Offset Voltage	VOS	1.125	1.25	1.375	V	See Figure 1	2
Power Off Output Current	IOFF	-20		20	µA	VCC = 0V, VOUT = 0V or 3.6V	2
Short Circuit Output Current	IOS	-6			mA	VOUT = 0V, Driver Enabled	2
Short Circuit Output Current	IOS	-6		6	mA	VOD = 0V, Driver Enabled	2
Input HIGH Voltage	VIH	2			V		2
Input LOW Voltage	VIL			0.8	V		2
Input Current	IIN	-20		20	µA	VIN = 0V or VCC	2
Disabled Output Leakage Current	IOZ	-20		20	µA	EN = 0.8V, EN = 2.0V; VOUT = 0V or 4.7V	2
Power-OFF Input Current	II(OFF)	-20		20	µA	VCC = 0V, VIN = 0V or 3.6V	2
Input Clamp Voltage	VIK			-1.5	V	IIK = −18 mA	2
Power Supply Current (No Load, Driver Enabled)	ICC		3.2	5	mA	No Load, VIN = 0V or VCC, Driver Enabled	2
Power Supply Current (Driver Disabled)	ICC		3.2	5	mA	RL = 100 Ω, Driver Disabled	2
Power Supply Current (Driver Enabled, RL)	ICC		17.9	25	mA	RL = 100 Ω, VIN = 0V or VCC, Driver Enabled	2
Differential Propagation Delay LOW-to-HIGH	tPLHD	0.8	1.4	2	ns		3
Differential Propagation Delay HIGH-to-LOW	tPHLD	0.8	1.4	2	ns		3
Differential Output Rise Time (20% to 80%)	tTLHD	0.6	0.85	1.2	ns	RL = 100 Ω, CL = 10 pF	3
Differential Output Fall Time (80% to 20%)	tTHLD	0.6	0.85	1.2	ns	See Figure 2 and Figure 3 (Note 7)	3
Pulse Skew	tSK(P)			0.4	ns	/tPLH - tPHL/	3
Channel-to-Channel Skew	tSK(LH), tSK(HL)			0.3	ns		3
Part-to-Part Skew	tSK(PP)			1	ns		3
Maximum Frequency	fMAX	200	275		MHz		3
Differential Output Enable Time from Z to HIGH	tZHD		2.5	5	ns		3
Differential Output Enable Time from Z to LOW	tZLD		2.7	5	ns	RL = 100Ω, CL = 10 pF	3
Differential Output Disable Time from HIGH to Z	tHZD		3.2	5	ns	See Figure 4 and Figure 5 (Note 7)	3
Differential Output Disable Time from LOW to Z	tLZD		3.4	5	ns		3
Supply Voltage (VCC)	VCC	-0.5		4.6	V		2
DC Input Voltage	VIN	-0.5		6	V	@VCC ≥ 3V	2
DC Input Voltage	VIN	-0.5		4.6	V	@VCC = 0V	2
DC Output Voltage	VOUT	-0.5		4.6	V	@VCC = 0V	2
Storage Temperature Range	TSTG	-65		150	°C		2
Max Junction Temperature	TJ			150	°C		2
Lead Temperature	TL			260	°C	Soldering, 10 seconds	2
ESD (Human Body Model)		8000			V	Human Body Model	2
ESD (Machine Model)		600			V	Machine Model	2
Supply Voltage (VCC)	VCC	3		3.6	V		2
Input Voltage (VIN)	VIN	0			V		2
Operating Temperature (TA)	TA	-40		85	°C		2

CAD (KiCad official)

Symbol: FIN1031MX
Footprint: Package_SO:SOIC-16_3.9x9.9mm_P1.27mm
3D model: SOIC-16 (KiCad packages3D, STEP)
3D model files: fin1031mx-etched.step / fin1031mx-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); fin1031mx.step / fin1031mx.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

Datasheet: onsemi datasheet (6 pp, sha256 9fdbc2538bfb1483, retrieved 2026-10-30, tier: lcsc)
Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-sonnet-5-5 (text+vision), consensus claude-opus-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF

FIN1031MX

Verified FIN1031MX

Verification log 1 record

3D Model

Symbol & Footprint

Schematic Symbol

PCB Footprint

Datasheet

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