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Contents

README

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MM74HC541MTC

onsemi · Buffers, Drivers, Receivers, Transceivers · TSSOP-20

MM74HC541MTC from onsemi, in a TSSOP-20. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 G1 input Active-low 3-STATE control input; if either G1 or G2 is HIGH all eight outputs are high-impedance.
2 A1 input Buffer data input 1, protected by diodes to VCC and ground.
3 A2 input Buffer data input 2, protected by diodes to VCC and ground.
4 A3 input Buffer data input 3, protected by diodes to VCC and ground.
5 A4 input Buffer data input 4, protected by diodes to VCC and ground.
6 A5 input Buffer data input 5, protected by diodes to VCC and ground.
7 A6 input Buffer data input 6, protected by diodes to VCC and ground.
8 A7 input Buffer data input 7, protected by diodes to VCC and ground.
9 A8 input Buffer data input 8, protected by diodes to VCC and ground.
10 GND power_in Ground reference for the device.
11 Y8 tri_state Non-inverting 3-STATE output 8 following A8, high-impedance when G1 or G2 is HIGH.
12 Y7 tri_state Non-inverting 3-STATE output 7 following A7, high-impedance when G1 or G2 is HIGH.
13 Y6 tri_state Non-inverting 3-STATE output 6 following A6, high-impedance when G1 or G2 is HIGH.
14 Y5 tri_state Non-inverting 3-STATE output 5 following A5, high-impedance when G1 or G2 is HIGH.
15 Y4 tri_state Non-inverting 3-STATE output 4 following A4, high-impedance when G1 or G2 is HIGH.
16 Y3 tri_state Non-inverting 3-STATE output 3 following A3, high-impedance when G1 or G2 is HIGH.
17 Y2 tri_state Non-inverting 3-STATE output 2 following A2, high-impedance when G1 or G2 is HIGH.
18 Y1 tri_state Non-inverting 3-STATE output 1 following A1, high-impedance when G1 or G2 is HIGH.
19 G2 input Active-low 3-STATE control input; if either G1 or G2 is HIGH all eight outputs are high-impedance.
20 VCC power_in Positive supply voltage, 2 to 6 V recommended operating range.

Key specifications

Parameter Value
Manufacturer onsemi
Package TSSOP-20
Category Logic
Pins 20

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
Supply Voltage VCC 2 6 V 3
DC Input or Output Voltage VIN, VOUT 0 V Maximum is VCC 3
Operating Temperature Range TA -40 85 °C 3
Input Rise or Fall Time tr, tf 1000 ns VCC 2.0V 3
Input Rise or Fall Time tr, tf 500 ns VCC 4.5V 3
Input Rise or Fall Time tr, tf 400 ns VCC 6.0V 3
Supply Voltage VCC -0.5 7 V 3
DC Input Voltage VIN -1.5 V Upper limit VCC + 1.5 V 3
DC Output Voltage VOUT -0.5 V Upper limit VCC + 0.5 V 3
Clamp Diode Current ICD -20 20 mA 3
DC Output Current, per pin IOUT -35 35 mA 3
DC VCC or GND Current, per pin ICC -70 70 mA 3
Storage Temperature Range TSTG -65 150 °C 3
Power Dissipation PD 600 mW Note 3, plastic N package 3
Power Dissipation PD 500 mW S.O. package only 3
Lead Temperature TL 260 °C Soldering 10 seconds 3
Minimum HIGH Level Input Voltage VIH 1.5 V VCC 2.0V 3
Minimum HIGH Level Input Voltage VIH 3.15 V VCC 4.5V 3
Minimum HIGH Level Input Voltage VIH 4.2 V VCC 6.0V 3
Minimum HIGH Level Input Voltage VIH 3.85 V VCC 5.5V (Note 4) 3
Maximum LOW Level Input Voltage VIL 0.5 V VCC 2.0V 3
Maximum LOW Level Input Voltage VIL 1.35 V VCC 4.5V 3
Maximum LOW Level Input Voltage VIL 1.8 V VCC 6.0V 3
Minimum HIGH Level Output Voltage VOH 1.9 2 V VIN VIH or VIL, /IOUT/ ≤ 20 µA, VCC 2.0V 3
Minimum HIGH Level Output Voltage VOH 4.4 4.5 V VIN VIH or VIL, /IOUT/ ≤ 20 µA, VCC 4.5V 3
Minimum HIGH Level Output Voltage VOH 5.9 6 V VIN VIH or VIL, /IOUT/ ≤ 20 µA, VCC 6.0V 3
Minimum HIGH Level Output Voltage VOH 3.7 4.2 V VIN VIH or VIL, /IOUT/ ≤ 6.0 mA, VCC 4.5V 3
Minimum HIGH Level Output Voltage VOH 5.2 5.7 V VIN VIH or VIL, /IOUT/ ≤ 7.8 mA, VCC 6.0V 3
Maximum LOW Level Output Voltage VOL 0 0.1 V VIN VIH or VIL, /IOUT/ ≤ 20 µA, VCC 2.0V 3
Maximum LOW Level Output Voltage VOL 0.2 0.4 V VIN VIH or VIL, /IOUT/ ≤ 6.0 mA, VCC 4.5V 3
Maximum Input Current IIN -1 1 µA VIN VCC or GND, VCC 6.0V 3
Maximum 3-STATE Output Leakage Current IOZ -10 10 µA VIN VIH or VIL, G VIH, VOUT VCC or GND, VCC 6.0V 3
Maximum Quiescent Supply Current ICC 160 µA VIN VCC or GND, IOUT 0 µA, VCC 6.0V 3
Maximum Propagation Delay (541) tPHL, tPLH 14 20 ns VCC 5 V, TA 25°C, CL 45 pF, tr/tf 6 ns 4
Maximum Propagation Delay (541) tPHL, tPLH 58 171 ns CL 50 pF, VCC 2.0 V 4
Maximum Propagation Delay (541) tPHL, tPLH 83 246 ns CL 150 pF, VCC 2.0 V 4
Maximum Propagation Delay (541) tPHL, tPLH 14 34 ns CL 50 pF, VCC 4.5 V 4
Maximum Propagation Delay (541) tPHL, tPLH 17 49 ns CL 150 pF, VCC 4.5 V 4
Maximum Propagation Delay (541) tPHL, tPLH 11 29 ns CL 50 pF, VCC 6.0 V 4
Maximum Propagation Delay (541) tPHL, tPLH 14 42 ns CL 150 pF, VCC 6.0 V 4
Maximum Output Enable Time tPZH, tPZL 17 28 ns VCC 5 V, TA 25°C, RL 1 kΩ, CL 45 pF 4
Maximum Output Enable Time tPZH, tPZL 75 224 ns RL 1 kΩ, CL 50 pF, VCC 2.0 V 4
Maximum Output Enable Time tPZH, tPZL 100 298 ns RL 1 kΩ, CL 150 pF, VCC 2.0 V 4
Maximum Output Enable Time tPZH, tPZL 15 45 ns RL 1 kΩ, CL 50 pF, VCC 4.5 V 4
Maximum Output Enable Time tPZH, tPZL 30 60 ns RL 1 kΩ, CL 150 pF, VCC 4.5 V 4
Maximum Output Enable Time tPZH, tPZL 13 38 ns RL 1 kΩ, CL 50 pF, VCC 6.0 V 4
Maximum Output Enable Time tPZH, tPZL 17 51 ns RL 1 kΩ, CL 150 pF, VCC 6.0 V 4
Maximum Output Disable Time tPHZ, tPLZ 15 25 ns RL 1 kΩ, CL 5 pF 4
Maximum Output Disable Time tPHZ, tPLZ 75 224 ns RL 1 kΩ, CL 50 pF, VCC 2.0 V 4
Maximum Output Disable Time tPHZ, tPLZ 15 45 ns RL 1 kΩ, CL 50 pF, VCC 4.5 V 4
Maximum Output Disable Time tPHZ, tPLZ 13 38 ns RL 1 kΩ, CL 50 pF, VCC 6.0 V 4
Maximum Output Rise and Fall Time tTHL, tTLH 25 90 ns CL 50 pF, VCC 2.0 V 4
Maximum Output Rise and Fall Time tTHL, tTLH 7 18 ns CL 50 pF, VCC 4.5 V 4
Maximum Output Rise and Fall Time tTHL, tTLH 6 15 ns CL 50 pF, VCC 6.0 V 4
Maximum Input Capacitance CIN 5 10 pF 4
Maximum Output Capacitance COUT 15 20 pF 4

CAD (KiCad official)

  • Symbol: MM74HC541MTC
  • Footprint: Package_SO:TSSOP-20_4.4x6.5mm_P0.65mm
  • 3D model: TSSOP-20 (KiCad packages3D, STEP)
  • 3D model files: mm74hc541mtc-etched.step / mm74hc541mtc-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); mm74hc541mtc.step / mm74hc541mtc.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: onsemi datasheet (9 pp, sha256 e16a852170962d74, retrieved 2026-10-21, tier: manufacturer)
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-sonnet-5-5 (text+vision), consensus claude-opus-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF