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Contents

README

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S-LBZX84C33LT1G

LRC · Zener Diodes · SOT-23

S-LBZX84C33LT1G from LRC, in a SOT-23. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 Anode passive Anode terminal of the zener diode, identified as pin 1 in the SOT-23 pinout for the BZX84Cxx LT1 series.
2 NC unconnected No internal connection; the datasheet lists this pin as no connection.
3 Cathode passive Cathode terminal of the zener diode, identified as pin 3 in the SOT-23 pinout for the BZX84Cxx LT1 series.

Key specifications

Parameter Value
Manufacturer LRC
Package SOT-23
Category Diodes
Pins 3

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
Zener voltage VZ1 (min/nom/max) VZ1 31 33 35 V @IZT1 = 2 mA 2
Zener voltage VZ2 (min/max) VZ2 30.8 35 V @IZT2 = 0.1 mA 2
Zener voltage VZ3 (min/max) VZ3 31.1 35.4 V @IZT3 = 10 mA 2
Zener dynamic impedance ZZT1 (max) ZZT1 80 Ω @IZT1 = 2 mA 2
Zener dynamic impedance ZZT2 (max) ZZT2 325 Ω @IZT4 = 0.5 mA 2
Zener dynamic impedance ZZT3 (max) ZZT3 55 Ω @IZT3 = 10 mA 2
Max reverse leakage current IR 0.05 µA VR = 23.1 V 2
Zener voltage temperature coefficient (min/max) VZ TC 27.4 33.4 mV/k @IZT1 = 2 mA 2
Zener capacitance C 70 pF @ VR = 0, f = 1 MHz 2
Forward voltage VF 0.9 V @ IF = 10 mA 2
Total device dissipation, FR-5 board PD 225 mW TA = 25°C, FR-5 board (Note 1) 1
Thermal resistance junction to ambient, FR-5 board RθJA 556 °C/W FR-5 board (Note 1) 1
Total device dissipation, alumina substrate PD 300 mW TA = 25°C, alumina substrate (Note 2) 1
Thermal resistance junction to ambient, alumina substrate RθJA 417 °C/W alumina substrate (Note 2) 1
Junction and storage temperature TJ, Tstg -55 150 °C 1

CAD (KiCad official)

  • Symbol: S-LBZX84C33LT1G
  • Footprint: Package_TO_SOT_SMD:SOT-23
  • 3D model: SOT-23 (KiCad packages3D, STEP)
  • 3D model files: s-lbzx84c33lt1g-etched.step / s-lbzx84c33lt1g-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); s-lbzx84c33lt1g.step / s-lbzx84c33lt1g.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: LRC datasheet (5 pp, sha256 b90ba094c94d24f4, retrieved 2026-10-17, tier: lcsc)
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-haiku-5-5 (text), consensus claude-sonnet-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF