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Contents

README

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SUD45P03-10-E3

JSMSEMI · MOSFETs · TO-252

SUD45P03-10-E3 from JSMSEMI, in a TO-252. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 G input Gate; gate-source voltage limited to ±25 V, threshold VGS(th) -1 to -2.5 V at 250 µA.
2 D passive Drain (also the exposed tab); drain-source voltage -30 V, continuous drain current -50 A at TC=25℃.
3 S passive Source; continuous source (diode) current -55 A, body diode forward voltage max -1.2 V at IS=-6A.

Key specifications

Parameter Value
Manufacturer JSMSEMI
Package TO-252
Category Transistors/Thyristors
Pins 3

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
Drain-Source Breakdown Voltage BVDSS -30 V VGS=0V,ID=250μA 2
Zero Gate Voltage Drain Current IDSS 1 μA VGS=0V, VDS=-30V 2
Gate-Source Leakage Current IGSS -100 100 nA VGS=±25V, VDS=0A 2
Gate-Source Threshold Voltage VGS(th) -1 -1.6 -2.5 V VGS=VDS, ID=250μA 2
Drain-Source On Resistance RDS(ON) 9.5 14 mΩ VGS=-10V,ID=-20A 2
Drain-Source On Resistance RDS(ON) 13 21 mΩ VGS=-4.5V,ID=-15A 2
Forward Transconductance GFS 10 22 S VDS=-5V,ID=-6A 2
Source-Drain Diode Forward Voltage VSD -1.2 V VGS=0V,IS=-6A 2
Continuous Source Current ISD -55 A 3
Drain-Source Voltage VDS -30 V 1
Gate-Source Voltage VGS -25 25 V 1
Continuous Drain Current ID -50 A TC=25℃ 1
Continuous Drain Current ID -38 A TC=100℃ 1
Drain Current, Pulsed IDM (pluse) -220 A Note 1: repetitive rating, pulse width limited by maximum junction temperature 1
Power Dissipation PD 75 W TC=25℃ 1
Power Dissipation PD 37.5 W TC=100℃ 1
Operating and Storage Junction Temperature Range TJ, TSTG -55 175 ℃ 1
Thermal Resistance, Junction to Case RθJC 2 ℃/W 1

CAD (KiCad official)

  • Symbol: SUD45P03-10-E3
  • Footprint: Package_TO_SOT_SMD:TO-252-2
  • 3D model: TO-252 (KiCad packages3D, STEP)
  • 3D model files: sud45p03-10-e3-etched.step / sud45p03-10-e3-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); sud45p03-10-e3.step / sud45p03-10-e3.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: JSMSEMI datasheet (6 pp, sha256 91557196b83274b2, retrieved 2026-10-18, tier: lcsc)
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-sonnet-5-5 (text+vision), consensus claude-opus-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF