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ISL3175EIUZ-T

Public Made by Adom

by adom

RENESAS Pre-ordered Chips, MSOP-8. Pinout cross-checked by two models against the datasheet, KiCad symbol/footprint/3D.

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Contents

README

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ISL3175EIUZ-T

RENESAS · Pre-ordered Chips · MSOP-8

ISL3175EIUZ-T from RENESAS, in a MSOP-8. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 RO output Receiver output: high if A-B ≥ -50mV, low if A-B ≤ -200mV, and high if A and B are floating or shorted.
2 RE input Receiver output enable: RO is enabled when RE is low and high impedance when RE is high; if unused, connect to GND directly or through a 1kΩ to 3kΩ resistor.
3 DE input Driver output enable: driver outputs are enabled when DE is high and high impedance when DE is low; if unused, connect to VCC through a 1kΩ to 3kΩ resistor.
4 DI input Driver input: a low forces output Y low and Z high, a high forces Y high and Z low.
5 GND power_in Ground connection.
6 A/Y bidirectional ±15kV IEC61000 ESD protected RS-485/422 noninverting receiver input and noninverting driver output; an input if DE = 0 and an output if DE = 1.
7 B/Z bidirectional ±15kV IEC61000 ESD protected RS-485/422 inverting receiver input and inverting driver output; an input if DE = 0 and an output if DE = 1.
8 VCC power_in System power supply input (3.0V to 3.6V).

Key specifications

Parameter Value
Manufacturer RENESAS
Package MSOP-8
Category Interface ICs
Pins 8

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
Driver Differential VOUT (RS-422) VOD 2 2.3 V RL = 100Ω (RS-422), VCC ≥ 3.15V 7
Driver Differential VOUT (RS-485) VOD 1.5 2 V RL = 54Ω (RS-485) 7
Driver Differential VOUT with common mode VOD 1.5 2.2 V RL = 60Ω, -7V ≤ VCM ≤ 12V 7
Change in Magnitude of Driver Differential VOUT ΔVOD 0.01 0.2 V RL = 54Ω or 100Ω 7
Driver Common-Mode VOUT VOC 2 3 V RL = 54Ω or 100Ω 7
Change in Magnitude of Driver Common-Mode VOUT ΔVOC 0.01 0.2 V RL = 54Ω or 100Ω 7
Logic Input High Voltage VIH 2 V DI, DE, RE 7
Logic Input Low Voltage VIL 0.8 V DI, DE, RE 7
Logic Input Hysteresis VHYS 100 mV DE, RE, 25°C 7
Logic Input Current IIN1 -2 2 µA DI = DE = RE = 0V or VCC 7
Input Current (A/Y, B/Z) at 12V IIN2 80 125 µA DE = 0V, VCC = 0V or 3.6V, VIN = 12V 7
Input Current (A/Y, B/Z) at -7V IIN2 -100 -50 µA DE = 0V, VCC = 0V or 3.6V, VIN = -7V 7
Driver Short-Circuit Current IOSD1 -250 250 mA DE = VCC, -7V ≤ VY or VZ ≤ 12V 7
Receiver Differential Threshold Voltage VTH -200 -125 -50 mV -7V ≤ VCM ≤ 12V 7
Receiver Input Hysteresis VTH 15 mV VCM = 0V, 25°C 7
Receiver Output Low Voltage VOL 0.17 0.4 V IO = -4mA, VID = -200mV 8
Three-State Receiver Output Current IOZR -1 0.015 1 µA 0.4V ≤ VO ≤ 2.4V 8
Receiver Input Resistance RIN 96 150 kΩ -7V ≤ VCM ≤ 12V 8
Receiver Short-Circuit Current IOSR 7 30 60 mA 0V ≤ VO ≤ VCC 8
Thermal Shutdown Threshold TSD 150 °C 8
No-Load Supply Current (driver enabled) ICC 510 800 µA DI = 0V or VCC, DE = VCC, RE = 0V or VCC 8
No-Load Supply Current (driver disabled) ICC 480 700 µA DE = 0V, RE = 0V 8
Shutdown Supply Current ISHDN 0.01 12 µA DE = 0V, RE = VCC, DI = 0V or VCC 8
Maximum Data Rate (driver, 500kbps) fMAX 500 1600 kbps VOD = ±1.5V, CD = 820pF 8
Driver Differential Output Delay tDD 180 350 800 ns RDIFF = 54Ω, CD = 50pF 8
Driver Differential Output Skew tSKEW 1 30 ns RDIFF = 54Ω, CD = 50pF 8
Driver Differential Rise or Fall Time tR, tF 200 380 800 ns RDIFF = 54Ω, CD = 50pF 8
Driver Enable to Output High tZH 26 350 ns RL = 500Ω, CL = 50pF, SW = GND 8
Driver Enable to Output Low tZL 100 350 ns RL = 500Ω, CL = 50pF, SW = VCC 9
Driver Disable from Output High tHZ 28 55 ns RL = 500Ω, CL = 50pF, SW = GND 9
Driver Disable from Output Low tLZ 30 55 ns RL = 500Ω, CL = 50pF, SW = VCC 9
Time to Shutdown (driver) tSHDN 50 200 600 ns 9
Driver Enable from Shutdown to Output High tZH(SHDN) 180 700 ns RL = 500Ω, CL = 50pF, SW = GND 9
Driver Enable from Shutdown to Output Low tZL(SHDN) 100 700 ns RL = 500Ω, CL = 50pF, SW = VCC 9
Receiver Maximum Data Rate fMAX 12 20 Mbps VID = ±1.5V, ISL3170E-75E 9
Receiver Input to Output Delay tPLH, tPHL 25 70 120 ns ISL3170E-75E 9
Receiver Skew /tPLH - tPHL/ tSKD 1.5 4 ns 9
Receiver Skew, Part-to-Part tRSKEW 15 ns 9
Receiver Enable to Output High tZH 5 15 20 ns RL = 1kΩ, CL = 15pF, SW = GND, ISL3170E-75E 9
Receiver Enable to Output Low tZL 5 15 20 ns RL = 1kΩ, CL = 15pF, SW = VCC, ISL3170E-75E 9
Receiver Disable from Output High tHZ 5 12 20 ns RL = 1kΩ, CL = 15pF, SW = GND, ISL3170E-75E 10
Receiver Disable from Output Low tLZ 5 13 20 ns RL = 1kΩ, CL = 15pF, SW = VCC, ISL3170E-75E 10
Time to Shutdown (receiver) tSHDN 50 180 600 ns 10
Receiver Enable from Shutdown to Output High tZH(SHDN) 240 500 ns RL = 1kΩ, CL = 15pF, SW = GND 10
Receiver Enable from Shutdown to Output Low tZL(SHDN) 240 500 ns RL = 1kΩ, CL = 15pF, SW = VCC 10
ESD IEC61000-4-2 Air-Gap, RS-485 pins 15 kV Air-Gap Discharge Method, 25°C (printed ±15) 8
ESD IEC61000-4-2 Contact, RS-485 pins 8 kV Contact Discharge Method, 25°C (printed ±8) 8
ESD HBM, RS-485 pins 15 kV Human Body Model, bus pins to GND, 25°C (printed ±15) 8
ESD HBM, all pins 7 kV MIL-STD-883 Method 3015, 25°C (printed ±7) 8
ESD Machine Model 200 V 25°C 8
Supply Voltage (test range) VCC 3 3.3 3.6 V Electrical Specifications test conditions 7
Operating Temperature Range -40 85 °C 7
VCC to GND VCC 7 V 7
DI Input Voltage DI -0.3 7 V 7
DE, RE Input Voltage DE, RE -0.3 7 V 7
A, B, Y, Z Input/Output Voltage -8 13 V 7
Maximum Junction Temperature TJ 150 °C Plastic package 7
Storage Temperature Range TSTG -65 150 °C 7
Thermal Resistance, 8 Ld MSOP θJA 140 °C/W Typical, Note 4 7

CAD (KiCad official)

  • Symbol: ISL3175EIUZ-T
  • Footprint: Package_SO:MSOP-8_3x3mm_P0.65mm
  • 3D model: MSOP-8 (KiCad packages3D, STEP)
  • 3D model files: isl3175eiuz-t-etched.step / isl3175eiuz-t-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); isl3175eiuz-t.step / isl3175eiuz-t.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: RENESAS datasheet (24 pp, sha256 a078fda83c895dae, retrieved 2026-10-26, tier: manufacturer)
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-sonnet-5-5 (text), consensus claude-sonnet-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF