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AMC1300DWVR
Public Made by Adomby adom
Texas Instruments Special Purpose Amplifiers, SOIC-8-300mil. Pinout cross-checked by two models against the datasheet, KiCad symbol/footprint/3D.
3D Model
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Symbol & Footprint
Schematic Symbol
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PCB Footprint
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Datasheet
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README
markdownAMC1300DWVR
Texas Instruments · Special Purpose Amplifiers · SOIC-8-300mil
AMC1300DWVR from Texas Instruments, in a SOIC-8-300mil. Pinout and pin descriptions extracted from the manufacturer datasheet by ds2sf; symbol, footprint, and 3D from KiCad-official CAD.
Pinout
| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | VDD1 | power_in | High-side power supply; operate at 4.5 V to 5.5 V. |
| 2 | INP | input | Noninverting analog input; differential input range ±250 mV (DC path to GND1 required). |
| 3 | INN | input | Inverting analog input; differential input range ±250 mV (DC path to GND1 required). |
| 4 | GND1 | power_in | High-side analog ground reference. |
| 5 | GND2 | power_in | Low-side analog ground reference. |
| 6 | OUTN | output | Inverting analog output; differential gain 8.2 V/V. |
| 7 | OUTP | output | Noninverting analog output; differential gain 8.2 V/V. |
| 8 | VDD2 | power_in | Low-side power supply; operate at 3.0 V to 5.5 V. |
Key specifications
| Parameter | Value |
|---|---|
| Manufacturer | Texas Instruments |
| Package | SOIC-8-300mil |
| Category | Amplifiers/Comparators |
| Pins | 8 |
Electrical characteristics
Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).
| Parameter | Symbol | Min | Typ | Max | Unit | Conditions | Page |
|---|---|---|---|---|---|---|---|
| High-side power supply, VDD1 to GND1 (AMC1300) | VDD1 | 4.5 | 5 | 5.5 | V | VDD1 to GND1, AMC1300 | 6 |
| Low-side power supply, VDD2 to GND2 | VDD2 | 3 | 3.3 | 5.5 | V | VDD2 to GND2 | 6 |
| Differential input voltage before clipping output | VClipping | -320 | 320 | mV | VIN = VINP - VINN | 6 | |
| Specified linear differential full-scale voltage | VFSR | -250 | 250 | mV | VIN = VINP - VINN | 6 | |
| Absolute common-mode input voltage | -2 | V | (VINP+VINN)/2 to GND1 | 6 | |||
| Operating common-mode input voltage | VCM | -0.16 | V | (VINP+VINN)/2 to GND1 | 6 | ||
| Specified ambient temperature, AMC1300 | TA | -40 | 125 | °C | AMC1300 | 6 | |
| Absolute maximum VDD1 to GND1 | VDD1 | -0.3 | 6.5 | V | High-side VDD1 to GND1 | 6 | |
| Absolute maximum VDD2 to GND2 | VDD2 | -0.3 | 6.5 | V | Low-side VDD2 to GND2 | 6 | |
| Input current, continuous, any pin except power-supply pins | -10 | 10 | mA | Continuous, any pin except power-supply pins | 6 | ||
| Junction temperature | TJ | 150 | °C | 6 | |||
| Storage temperature | Tstg | -65 | 150 | °C | 6 | ||
| Common-mode overvoltage detection hysteresis | 60 | mV | 10 | ||||
| Input offset voltage, initial, AMC1300 | VOS | -2 | 0.01 | 2 | mV | AMC1300, initial, at TA = 25°C, VINP = VINN = GND1 | 10 |
| Input offset drift, AMC1300 | TCVOS | -4 | 1.3 | 4 | uV/°C | AMC1300 | 10 |
| Input bias current | IIB | -41 | -30 | -24 | uA | INP = INN = GND1; IIB = (IIBP+IIBN) / 2 | 10 |
| Input offset current | IIO | -5 | 5 | nA | IIO = IIBP - IIBN | 10 | |
| Gain error, initial, AMC1300 | EG | -1 | 0.4 | 1 | % | AMC1300, initial, at TA = 25°C | 10 |
| Gain error drift, AMC1300 | TCEG | -50 | 50 | ppm/°C | AMC1300 | 10 | |
| Nonlinearity | -0.03 | 0.01 | 0.03 | % | 10 | ||
| Signal-to-noise ratio | SNR | 81.5 | 85 | dB | fIN = 1 kHz, BW = 10 kHz | 10 | |
| Common-mode output voltage | VCMout | 1.39 | 1.44 | 1.49 | V | 10 | |
| Clipping differential output voltage | VCLIPout | -2.52 | 2.49 | 2.52 | V | VOUT = (VOUTP – VOUTN); /VIN/ = /VINP – VINN/ > /VClipping/ | 10 |
| Failsafe differential output voltage | VFAILSAFE | -2.63 | -2.57 | -2.53 | V | VCM ≥ VCMov, or VDD1 missing | 10 |
| Output bandwidth, AMC1300 | BWOUT | 170 | 230 | kHz | AMC1300 | 11 | |
| Output resistance | ROUT | 0.2 | Ω | On OUTP or OUTN | 11 | ||
| Common-mode transient immunity, AMC1300 | CMTI | 15 | 30 | kV/µs | /GND1 – GND2/ = 1 kV | 11 | |
| VDD1 undervoltage detection threshold voltage | VDD1UV | 2.4 | 2.6 | 2.8 | V | VDD1 falling | 11 |
| High-side supply current | IDD1 | 7.2 | 9.8 | mA | 4.5 V ≤ VDD1 ≤ 5.5 V | 11 | |
| Low-side supply current | IDD2 | 5.3 | 7.2 | mA | 3.0 V ≤ VDD2 ≤ 3.6 V | 11 | |
| Low-side supply current | IDD2 | 5.9 | 8.1 | mA | 4.5 V ≤ VDD2 ≤ 5.5 V | 11 | |
| Common-mode rejection ratio | CMRR | -100 | dB | fIN = 0 Hz, VCM min ≤ VCM ≤ VCM max | 10 | ||
| Common-mode rejection ratio | CMRR | -98 | dB | fIN = 10 kHz, VCM min ≤ VCM ≤ VCM max | 10 | ||
| Single-ended input resistance | RIN | 19 | kΩ | INN = GND1 | 10 | ||
| Differential input resistance | RIND | 22 | kΩ | 10 | |||
| Single-ended input capacitance | CIN | 2 | pF | INN = GND1, fIN = 275 kHz | 10 | ||
| Differential input capacitance | CIND | 1 | pF | fIN = 275 kHz | 10 | ||
| Nominal gain | 8.2 | 10 | |||||
| Total harmonic distortion | THD | -85 | dB | fIN = 10 kHz | 10 | ||
| Output noise | 230 | uVRMS | INP = INN = GND1, fIN = 0 Hz, BW = 100 kHz brickwall filter | 10 | |||
| Signal-to-noise ratio | SNR | 72 | dB | fIN = 10 kHz, BW = 100 kHz | 10 | ||
| Power-supply rejection ratio vs VDD1 | PSRR | -103 | dB | at DC | 10 | ||
| Power-supply rejection ratio vs VDD1 | PSRR | -96 | dB | 100-mV and 10-kHz ripple | 10 | ||
| Power-supply rejection ratio vs VDD2 | PSRR | -106 | dB | at DC | 10 | ||
| Power-supply rejection ratio vs VDD2 | PSRR | -86 | dB | 100-mV and 10-kHz ripple | 10 | ||
| Output short-circuit current | 14 | mA | On OUTP or OUTN, sourcing or sinking, INN = INP = GND1, outputs shorted to either GND2 or VDD2 | 11 | |||
| Junction-to-ambient thermal resistance | RθJA | 85.4 | °C/W | 7 | |||
| Junction-to-case (top) thermal resistance | RθJC(top) | 26.8 | °C/W | 7 | |||
| Junction-to-board thermal resistance | RθJB | 43.5 | °C/W | 7 | |||
| Junction-to-top characterization parameter | ψJT | 4.8 | °C/W | 7 | |||
| Junction-to-board characterization parameter | ψJB | 41.2 | °C/W | 7 |
CAD (KiCad official)
- Symbol:
AMC1300DWVR - Footprint:
Package_SO:SOIC-8_3.9x4.9mm_P1.27mm - 3D model: SOIC-8-300mil (KiCad packages3D, STEP)
- 3D model files:
amc1300dwvr-etched.step/amc1300dwvr-etched.glbcarry the MPN laser-etched on the die in a toggleableAdom.LaserEtchgroup (Fusion-ready);amc1300dwvr.step/amc1300dwvr.glbare the bare package body.
Provenance
Data extracted from the manufacturer datasheet, not a distributor listing:
- Datasheet: Texas Instruments datasheet (39 pp, sha256
62a3f250106ff0f2, retrieved 2026-09-17, tier: lcsc) - Datasheet language: Chinese. Pin names, descriptions, and specs on this page were extracted and translated to English by ds2sf; the linked PDF is the manufacturer original.
- Extractor: parts-factory
2.0.0/extract_pins 0.2, primaryclaude-haiku-4-5-20251001(text), consensusclaude-sonnet-4-6(agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish. - CAD: KiCad official libraries (CC-BY-SA 4.0).