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Contents

README

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ADUM1311ARWZ-RL

Analog Devices · Digital Isolators · SOIC-16

ADUM1311ARWZ-RL from Analog Devices, in a SOIC-16. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 VDD1 power_in Supply voltage for isolator side 1, 2.7 V to 5.5 V.
2 GND1 power_in Ground reference for isolator side 1; internally connected to pin 8, and connecting both to GND1 is recommended.
3 VIA input Logic input A for channel A.
4 VIB input Logic input B for channel B.
5 VOC output Logic output C; it is high when CTRL1 is high or disconnected and VDD2 is off, low when CTRL1 is low and VDD2 is off, and CTRL1 has no effect while VDD2 is powered.
6 NC unconnected No connection.
7 CTRL1 input Default output control for the side 2 outputs; it sets the state of VOC when input power (VDD2) is off and has no effect when VDD2 is powered.
8 GND1 power_in Ground reference for isolator side 1; internally connected to pin 2, and connecting both to GND1 is recommended.
9 GND2 power_in Ground reference for isolator side 2; internally connected to pin 15, and connecting both to GND2 is recommended.
10 CTRL2 input Default output control for the side 1 outputs; VOA and VOB are high when CTRL2 is high or disconnected and VDD1 is off, low when CTRL2 is low and VDD1 is off, and it has no effect when VDD1 is powered.
11 NC unconnected No connection.
12 VIC input Logic input C for channel C.
13 VOB output Logic output B for channel B.
14 VOA output Logic output A for channel A.
15 GND2 power_in Ground reference for isolator side 2; internally connected to pin 9, and connecting both to GND2 is recommended.
16 VDD2 power_in Supply voltage for isolator side 2, 2.7 V to 5.5 V.

Key specifications

Parameter Value
Manufacturer Analog Devices
Package SOIC-16
Category Signal Isolation Devices
Pins 16

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
Logic High Input Threshold (5 V operation) VIH 2 V 3
Logic Low Input Threshold (5 V operation) VIL 0.8 V 3
Logic High Input Threshold (3 V operation) VIH 1.6 V 5
Logic Low Input Threshold (3 V operation) VIL 0.4 V 5
Input Currents (all models) IIA, IIB, IIC, ICTRL1, ICTRL2, IDISABLE -10 0.01 10 µA 0 V ≤ VIA, VIB, VIC ≤ VDD1 or VDD2, 0 V ≤ VCTRL1, VCTRL2 ≤ VDD1 or VDD2, 0 V ≤ VDISABLE ≤ VDD1 3
VDD1 Supply Current, ADuM1311, DC to 2 Mbps (5 V operation) IDD1 (Q) 2.2 2.8 mA DC to 1 MHz logic signal frequency 3
VDD2 Supply Current, ADuM1311, DC to 2 Mbps (5 V operation) IDD2 (Q) 1.8 2.4 mA DC to 1 MHz logic signal frequency 3
VDD1 Supply Current, ADuM1311, DC to 2 Mbps (3 V operation) IDD1 (Q) 1 1.6 mA DC to 1 MHz logic signal frequency 5
VDD2 Supply Current, ADuM1311, DC to 2 Mbps (3 V operation) IDD2 (Q) 0.9 1.4 mA DC to 1 MHz logic signal frequency 5
Logic Low Output Voltage (5 V and 3 V operation) VOAL, VOBL, VOCL 0 0.1 V IOx = 20 µA, VIx = VIxL 3
Logic Low Output Voltage (5 V and 3 V operation) VOAL, VOBL, VOCL 0.2 0.4 V IOx = 4 mA, VIx = VIxL 3
Minimum Pulse Width (ADuM131xARWZ) PW 1000 ns CL = 15 pF, CMOS signal levels 3
Maximum Data Rate (ADuM131xARWZ) 1 Mbps CL = 15 pF, CMOS signal levels 3
Propagation Delay (ADuM131xARWZ, 5 V and 3 V operation) tPHL, tPLH 20 100 ns CL = 15 pF, CMOS signal levels 3
Pulse Width Distortion (ADuM131xARWZ) PWD 40 ns CL = 15 pF, CMOS signal levels 3
Propagation Delay Skew (ADuM131xARWZ) tPSK 50 ns CL = 15 pF, CMOS signal levels 3
Channel-to-Channel Matching (ADuM131xARWZ) tPSKCD/OD 50 ns CL = 15 pF, CMOS signal levels 3
Output Rise/Fall Time (10% to 90%) tR/tF 2.5 ns CL = 15 pF, CMOS signal levels 4
Common-Mode Transient Immunity at Logic High Output /CMH/ 25 35 kV/µs VIx = VDD1 or VDD2, VCM = 1000 V, transient magnitude = 800 V 4
Common-Mode Transient Immunity at Logic Low Output /CML/ 25 35 kV/µs VIx = 0 V, VCM = 1000 V, transient magnitude = 800 V 4
Refresh Rate (5 V operation) fr 1.2 Mbps 4
Refresh Rate (3 V operation) fr 1.1 Mbps 6
Input Enable Time tENABLE 2 µs VIA, VIB, VIC = 0 V or VDD1 4
Input Disable Time tDISABLE 5 µs VIA, VIB, VIC = 0 V or VDD1 4
Input Supply Current per Channel, Quiescent (5 V operation) IDDI (Q) 0.5 0.73 mA 4
Output Supply Current per Channel, Quiescent (5 V operation) IDDO (Q) 0.38 0.53 mA 4
Input Supply Current per Channel, Quiescent (3 V operation) IDDI (Q) 0.25 0.38 mA 6
Output Supply Current per Channel, Quiescent (3 V operation) IDDO (Q) 0.19 0.33 mA 6
Propagation Delay (ADuM131xARWZ, mixed 5 V/3 V or 3 V/5 V operation) tPHL, tPLH 25 100 ns CL = 15 pF, CMOS signal levels 8
Operating Temperature TA -40 105 °C 11
Supply Voltages VDD1, VDD2 2.7 5.5 V All voltages relative to their respective grounds 11
Input Signal Rise and Fall Times 1 ms 11
Storage Temperature TST -65 150 °C 12
Ambient Operating Temperature TA -40 105 °C 12
Supply Voltages VDD1, VDD2 -0.5 7 V All voltages relative to their respective ground 12
Input Voltage VIA, VIB, VIC, VDISABLE, VCTRL1, VCTRL2 -0.5 V Upper limit printed as VDDI + 0.5 V 12
Output Voltage VOA, VOB, VOC -0.5 V Upper limit printed as VDDO + 0.5 V 12
Average Output Current per Pin, Side 1 IO1 -18 18 mA 12
Average Output Current per Pin, Side 2 IO2 -22 22 mA 12
Common-Mode Transients -100 100 kV/µs Refers to common-mode transients across the insulation barrier 12
Logic High Output Voltage (5 V operation, IOx = -20 µA) VOAH, VOBH, VOCH 5 V IOx = −20 µA, VIx = VIxH 3
Logic High Output Voltage (5 V operation, IOx = -4 mA) VOAH, VOBH, VOCH 4.8 V IOx = −4 mA, VIx = VIxH 3
Logic High Output Voltage (3 V operation, IOx = -20 µA) VOAH, VOBH, VOCH 3 V IOx = −20 µA, VIx = VIxH 5
Logic High Output Voltage (3 V operation, IOx = -4 mA) VOAH, VOBH, VOCH 2.8 V IOx = −4 mA, VIx = VIxH 5
IC Junction-to-Case Thermal Resistance, Side 1 θJCI 33 °C/W Thermocouple located at center of package underside 10
IC Junction-to-Case Thermal Resistance, Side 2 θJCO 28 °C/W 10

Materials and finish

As the datasheet states them (page.json metadata.appearance; the 3D model's colours follow it).

Part Material Colour / plating Datasheet says Page
housing pC In accordance with DIN V VDE V 0884-10, each ADuM1310/ADuM1311 is proof-tested by applying an insulation test voltage ≥1050 V peak for 1 second (partial discharge detection limit = 5 pC). The asterisk 10

CAD (KiCad official)

  • Symbol: ADUM1311ARWZ-RL
  • Footprint: Package_SO:SOIC-16_3.9x9.9mm_P1.27mm
  • 3D model: SOIC-16 (KiCad packages3D, STEP)
  • 3D model files: adum1311arwz-rl-etched.step / adum1311arwz-rl-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); adum1311arwz-rl.step / adum1311arwz-rl.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: Analog Devices datasheet (24 pp, sha256 0997a5eaebc2abed, retrieved 2026-10-21, tier: lcsc)
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-haiku-5-5 (text), consensus claude-sonnet-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF