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Contents

README

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CMD65R900Q

Cmos(广东场效应半导体) · IC · TO-252

CMD65R900Q from Cmos(广东场效应半导体), in a TO-252. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 G input Gate terminal of the 650V super junction N-channel MOSFET; gate-source voltage is rated at ±30 V (VGS).
2 D passive Drain terminal; rated 650 V drain-source (VDS) with 5 A continuous drain current at TC=25℃.
3 S passive Source terminal; continuous source current is rated at 5 A (IS) and pulsed source current at 20 A (ISM).

Key specifications

Parameter Value
Manufacturer Cmos(广东场效应半导体)
Package TO-252
Category
Pins 3

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
Gate-Source Leakage Current IGSS -100 100 nA VGS=±30V, VDS=0V 2
Gate Threshold Voltage VGS(th) 2 4 V VGS=VDS, ID=250uA 2
Drain-Source Leakage Current IDSS 1 μA VDS=650V, VGS=0V 2
Continuous Source Current IS 5 A 2
Pulsed Source Current ISM 20 A VG=VD=0V, Force Current 2
Diode Forward Voltage VSD 1.4 V VGS=0V, IS=5A, TJ=25℃ 2
Drain-Source Breakdown Voltage BVDSS 650 V VGS=0V, ID=250uA 2
Static Drain-Source On-Resistance RDS(ON) 820 900 mΩ VGS=10V, ID=3A 2
Drain-Source Voltage VDS 650 V 1
Gate-Source Voltage VGS -30 30 V 1
Continuous Drain Current ID 5 A TC=25℃ 1
Continuous Drain Current ID 3.2 A TC=100℃ 1
Pulsed Drain Current IDM 20 A 1
Single Pulse Avalanche Energy EAS 183 mJ VDD=100V, VGS=10V, L=30mH, IAS=3.5A 1
Total Power Dissipation PD 35 W TC=25℃ 1
Storage Temperature Range TSTG -55 150 ℃ 1
Operating Junction Temperature Range TJ -55 150 ℃ 1
Thermal Resistance Junction-ambient RθJA 62.5 ℃/W 1
Thermal Resistance Junction-case RθJC 3.57 ℃/W 1

CAD (KiCad official)

  • Symbol: CMD65R900Q
  • Footprint: Package_TO_SOT_SMD:TO-252-2
  • 3D model: TO-252 (KiCad packages3D, STEP)
  • 3D model files: cmd65r900q-etched.step / cmd65r900q-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); cmd65r900q.step / cmd65r900q.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: Cmos(广东场效应半导体) datasheet (6 pp, sha256 4b44f71f04a24239, retrieved 2026-10-20, tier: lcsc)
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-haiku-5-5 (text), consensus claude-sonnet-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF