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XPD977BP18

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Shenzhen Fuman Battery Management ICs, QFN-32-EP(5x5). Pinout cross-checked by two models against the datasheet, KiCad symbol/footprint/3D.

componentpower management icsxpd977bp18factory-2.0.0extractor-text
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Contents

README

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XPD977BP18

Shenzhen Fuman · Battery Management ICs · QFN-32-EP(5x5)

XPD977BP18 from Shenzhen Fuman, in a QFN-32-EP(5x5). Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 VFB input Voltage regulation port connected to the system voltage feedback point (internal reference 1.24V, RFB1 must be 100kΩ).
2 IREF passive CC loop compensation pin; leave floating if the CC function is not used.
3 CSN input Current-sense negative port; connect to GND if unused, must not be left floating.
4 CSP input Current-sense positive port; connect to GND if unused, must not be left floating.
5 ISP2 input Type-A2 port current-sense positive port (external 5mΩ sense resistor).
6 ISP3 input Type-A3 port current-sense positive port (external 5mΩ sense resistor).
7 DP3 bidirectional Type-A3 port data line DP.
8 LINK bidirectional XPD-LINK interconnect port; bus is pulled to ground with a 10kΩ resistor.
9 DM3 bidirectional Type-A3 port data line DM.
10 DIS output Gate control for the external discharge NMOS transistor.
11 AISN input Interconnect current-sense negative port for interconnection with non-XPD-series products; connect to GND when unused.
12 AISP input Interconnect current-sense positive port for interconnection with non-XPD-series products; connect to GND when unused.
13 USBA3 passive Type-A3 port VBUS output power.
14 GD3 output Type-A3 port PMOS switch gate drive.
15 DP2 bidirectional Type-A2 port data line DP; withstands above 24V.
16 DM2 bidirectional Type-A2 port data line DM; withstands above 24V.
17 USBA2 passive Type-A2 port VBUS output power.
18 GD2 output Type-A2 port PMOS switch gate drive.
19 CC1 bidirectional Type-C port configuration channel CC1; rated -0.3 to 26V.
20 DP1 bidirectional Type-C port data line (datasheet table text says DM; named DP1).
21 DM1 bidirectional Type-C port data line (datasheet table text says Type-A DP; named DM1).
22 CC2 bidirectional Type-C port configuration channel CC2; rated -0.3 to 26V.
23 VBUS power_out Type-C port VBUS output power through the integrated 10mΩ switch (pins 23/24/25 common); max -0.3 to 26V.
24 VBUS power_out Type-C port VBUS output power through the integrated 10mΩ switch (pins 23/24/25 common); max -0.3 to 26V.
25 VBUS power_out Type-C port VBUS output power through the integrated 10mΩ switch (pins 23/24/25 common); max -0.3 to 26V.
26 NC unconnected No connection (floating).
27 NC unconnected No connection (floating).
28 VPWR power_in Input power supply, 3.3V to 21V recommended (pins 28/29/30 common); max -0.3 to 26V.
29 VPWR power_in Input power supply, 3.3V to 21V recommended (pins 28/29/30 common); max -0.3 to 26V.
30 VPWR power_in Input power supply, 3.3V to 21V recommended (pins 28/29/30 common); max -0.3 to 26V.
31 NC unconnected No connection (floating).
32 OPTO output Optocoupler drive output, tolerates above 20V; max -0.3 to 26V.
33 EP passive Exposed pad (from the footprint; not named in the datasheet pin table).

Key specifications

Parameter Value
Manufacturer Shenzhen Fuman
Package QFN-32-EP(5x5)
Category Power Management ICs
Pins 33

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
Absolute max voltage VPWR, VBUS, VBUSA, CC1, CC2, DP1, DM1, DP2, DM2, OPTO -0.3 26 V 8
Absolute max voltage other pins -0.3 7 V Other 8
Junction temperature -40 150 ℃ 8
Storage temperature -65 150 ℃ 8
ESD HBM VESD -4000 4000 V HBM 8
VPWR input voltage VPWR 3.3 21 V 8
VBUS capacitance CVBUS 1 10 µF 8
VPWR capacitance CVPWR 1 10 µF 8
Operating ambient temperature TA -40 85 ℃ 8
Type-A2 MOS GS capacitance CGATE1 47 nF 8
Type-A3 MOS GS capacitance CGATE2 47 nF 8
System voltage divider resistor RFB1 100 kΩ 8
System voltage divider resistor RFB2 33 kΩ 8
Constant current sense resistor RS1 10 mΩ 8
Type-A2 current sense resistor RS2 5 mΩ 8
Type-A3 current sense resistor RS3 5 mΩ 8
Link bus resistor RLINK 10 kΩ 8
Thermal resistance junction to ambient RθJA 34 QFN32 8
Thermal resistance junction to case top RθJCtop 32 QFN32 8
Thermal resistance junction to board RθJB 10 QFN32 8
VPWR UVLO threshold rising VVPWR_TH 3.3 V Rising edge 9
VPWR UVLO threshold falling VVPWR_TH 2.9 V Falling edge 9
VPWR UVLO hysteresis VVPWR_TH 0.4 V Hysteresis 9
Typical operating current ISUPP 2 mA VPWR=5V, VBUS=5V 9
Switch MOSFET on-resistance RDSON 10 mΩ 9
CC transmit output resistance RTX 50 Ω During transmission 9
Transmit LOW VTXLO -75 75 mV 9
Transmit HIGH VTXHI 1.15 V 9
Bit unit interval tUI 3.3 us 9
BMC rise/fall time tBMC 300 600 ns Rload=5.1k,Cload=1nF 9
Receive HIGH VRXHI 800 840 885 mV 9
Receive LOW VRXLO 485 525 570 mV 9
CC broadcasting current 3A IRP_SRC 304 330 356 uA 3A DFP mode, 0 ≤ VCCX ≤ 2.5V 9
CC broadcasting current 1.5A IRP_SRC 166 180 194 uA 1.5A DFP mode, 0 ≤ VCCX ≤ 1.5V 9
OTP die temperature rising edge TJ1 135 145 155 ℃ Temperature rising edge 9
OTP hysteresis TJ1 20 ℃ Hysteresis 9
Data line detect voltage VDAT(REF) 0.25 0.325 0.4 V 9
Output voltage select VSEL(REF) 1.8 2 2.2 V 9
D+ high glitch filter time TGLITCH(DP)HIGH 1 1.25 1.5 s 9
Output voltage glitch filter time TGLITCH(V)CHANGE 20 40 60 ms 10
Continuous mode glitch filter time TGLITCH(CONT)CHANGE 100 150 200 us 10
D+ leakage resistance RDAT(LKG) 300 500 800 KΩ 10
D- pulldown resistance RDM(DWN) 14.25 19.53 24.5 KΩ 10
Switch N1 on-resistance RON(N1) 40 100 Ω 10
PD connect detect voltage threshold VTH(PD) 0.25 0.325 0.4 V 10
PD connect detect filter time TDPD 120 160 200 ms 10
Apple 2.4A D+/D- data line voltage VDAT(2.7V) 2.57 2.7 2.84 V 10
Current source step up ΔIT(UP) 2 uA RIREF=100KΩ 10
Current source step down ΔIT(DO) 2 uA RIREF=100KΩ 10

CAD (KiCad official)

  • Symbol: XPD977BP18
  • Footprint: Package_DFN_QFN:QFN-32-1EP_5x5mm_P0.5mm_EP3.3x3.3mm
  • 3D model: QFN-32-EP(5x5) (KiCad packages3D, STEP)
  • 3D model files: xpd977bp18-etched.step / xpd977bp18-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); xpd977bp18.step / xpd977bp18.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: Shenzhen Fuman datasheet (19 pp, sha256 5a87c34d62e6ac88, retrieved 2026-10-27, tier: lcsc)
  • Datasheet language: Chinese. Pin names, descriptions, and specs on this page were extracted and translated to English by ds2sf; the linked PDF is the manufacturer original.
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-sonnet-5-5 (text), consensus claude-sonnet-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF