component
TPS62163DSGR
Public Made by Adomby adom
Texas Instruments DC-DC Converters, WSON-8-EP(2x2). Pinout cross-checked by two models against the datasheet, KiCad symbol/footprint/3D.
3D Model
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Symbol & Footprint
Schematic Symbol
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PCB Footprint
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Datasheet
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README
markdownTPS62163DSGR
Texas Instruments · DC-DC Converters · WSON-8-EP(2x2)
TPS62163DSGR from Texas Instruments, in a WSON-8-EP(2x2). Pinout and pin descriptions extracted from the manufacturer datasheet by ds2sf; symbol, footprint, and 3D from KiCad-official CAD.
Pinout
| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | PGND | power_in | Power ground; return path for switching current and control circuit reference. |
| 2 | VIN | power_in | Supply voltage input; operating range 3 V to 17 V. |
| 3 | EN | input | Enable input; high enables device operation, low forces shutdown with 1.5 µA typical shutdown current. |
| 4 | AGND | power_in | Analog ground; reference point for internal feedback control and regulation circuitry. |
| 5 | FB | input | Feedback voltage input; for this fixed 5.0V output version connect to AGND for improved thermal performance. |
| 6 | VOS | input | Output voltage sense pin providing feedback signal to internal control loop for regulation. |
| 7 | SW | output | Switch node output connected to internal MOSFET switches; connect external inductor between SW and output capacitor. |
| 8 | PG | output | Power good open-drain output; high impedance when disabled, high when VOUT ≥ 92% nominal, low when below; requires external pull-up resistor. |
| 9 | Exposed Thermal Pad | power_in | Exposed thermal pad connected to AGND; must be soldered to PCB for proper thermal dissipation and mechanical reliability. |
Key specifications
| Parameter | Value |
|---|---|
| Manufacturer | Texas Instruments |
| Package | WSON-8-EP(2x2) |
| Category | Power Management (PMIC) |
| Pins | 9 |
Electrical characteristics
Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).
| Parameter | Symbol | Min | Typ | Max | Unit | Conditions | Page |
|---|---|---|---|---|---|---|---|
| Input voltage range (VIN) | VIN | 3 | 17 | V | 6 | ||
| Operating quiescent current | IQ | 17 | 30 | µA | EN = High, IOUT = 0 mA, device not switching | 6 | |
| Operating quiescent current | IQ | 17 | 25 | µA | TJ = -40°C to +85°C | 6 | |
| Shutdown current | ISD | 1.5 | 25 | µA | EN = Low | 6 | |
| Shutdown current | ISD | 1.5 | 4 | µA | TJ = -40°C to +85°C | 6 | |
| Undervoltage lockout threshold, falling input voltage | VUVLO | 2.6 | 2.7 | 2.82 | V | Falling input voltage | 6 |
| Input leakage current (EN) | ILKG_EN | 0.01 | 1 | µA | EN = VIN or GND | 6 | |
| Power good threshold voltage, rising (%VOUT) | VTH_PG | 92 | 95 | 98 | % | Rising (%VOUT) | 6 |
| Power good threshold voltage, falling (%VOUT) | VTH_PG | 87 | 90 | 93 | % | Falling (%VOUT) | 6 |
| Power good output low voltage | VOL_PG | 0.07 | 0.3 | V | IPG = –2 mA | 6 | |
| Input leakage current (PG) | ILKG_PG | 1 | 400 | nA | VPG = 1.8 V | 6 | |
| High-side MOSFET ON-resistance | RDS(ON) | 300 | 600 | mΩ | VIN ≥ 6 V | 6 | |
| Low-side MOSFET ON-resistance | RDS(ON) | 120 | 200 | mΩ | VIN ≥ 6 V | 6 | |
| High-side MOSFET forward current limit | ILIMF | 1.45 | 1.95 | 2.45 | A | VIN = 12 V, TJ = 25°C | 6 |
| Initial output voltage accuracy (PWM mode) | -3 | 3 | % | PWM mode operation, VIN ≥ VOUT + 1 V | 6 | ||
| Initial output voltage accuracy (power save mode) | -3.5 | 4 | % | Power save mode operation, COUT = 22 µF | 6 | ||
| Supply voltage | VIN | 3 | 17 | V | 5 | ||
| Output voltage | VOUT | 0.9 | 6 | V | 5 | ||
| Operating junction temperature | TJ | -40 | 125 | °C | 5 | ||
| Pin voltage range, VIN | VIN | -0.3 | 20 | V | 5 | ||
| Pin voltage range, EN and SW (DC) | EN, SW | -0.3 | V | DC; upper limit printed as VIN + 0.3 | 5 | ||
| Pin voltage range, SW (AC) | SW | -2 | 24.5 | V | less than 10 ns, while switching | 5 | |
| Pin voltage range, FB, PG, VOS | FB, PG, VOS | -0.3 | 7 | V | 5 | ||
| Power good sink current | PG | 10 | mA | 5 | |||
| Operating junction temperature | TJ | -40 | 150 | °C | 5 | ||
| Storage temperature | Tstg | -65 | 150 | °C | 5 | ||
| Junction-to-ambient thermal resistance (DSG WSON) | RθJA | 61.8 | °C/W | 5 | |||
| Junction-to-case (top) thermal resistance (DSG WSON) | RθJC(top) | 61.3 | °C/W | 5 | |||
| Junction-to-board thermal resistance (DSG WSON) | RθJB | 15.5 | °C/W | 5 | |||
| Junction-to-top characterization parameter (DSG WSON) | ψJT | 0.4 | °C/W | 5 | |||
| Junction-to-board characterization parameter (DSG WSON) | ψJB | 15.4 | °C/W | 5 | |||
| Junction-to-case (bottom) thermal resistance (DSG WSON) | RθJC(bot) | 8.6 | °C/W | 5 |
CAD (KiCad official)
- Symbol:
TPS62163DSGR - Footprint:
Package_SON:WSON-8-1EP_2x2mm_P0.5mm_EP0.9x1.6mm - 3D model: WSON-8-EP(2x2) (KiCad packages3D, STEP)
- 3D model files:
tps62163dsgr-etched.step/tps62163dsgr-etched.glbcarry the MPN laser-etched on the die in a toggleableAdom.LaserEtchgroup (Fusion-ready);tps62163dsgr.step/tps62163dsgr.glbare the bare package body.
Provenance
Data extracted from the manufacturer datasheet, not a distributor listing:
- Datasheet: Texas Instruments datasheet (42 pp, sha256
729fe659c0bb2b33, retrieved 2026-09-23, tier: lcsc) - Datasheet language: Chinese. Pin names, descriptions, and specs on this page were extracted and translated to English by ds2sf; the linked PDF is the manufacturer original.
- Extractor: parts-factory
2.0.0/extract_pins 0.2, primaryclaude-haiku-4-5-20251001(text), consensusclaude-sonnet-5(agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish. - CAD: KiCad official libraries (CC-BY-SA 4.0).