DRV5023AJELPGMQ1 from Texas Instruments, in a TO-92. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin	Name	Type	Function
1	VCC	power_in	Power supply input at 2.7 to 38 V; bypass this pin to GND with a 0.01-μF (minimum) ceramic capacitor rated for VCC.
2	GND	power_in	Ground pin.
3	OUT	output	Hall sensor open-drain output; the open drain requires a resistor pullup.

Key specifications

Parameter	Value
Manufacturer	Texas Instruments
Package	TO-92
Category	Magnetic Sensors
Pins	3

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter	Symbol	Min	Typ	Max	Unit	Conditions	Page
Power supply voltage	VCC	-22		40	V	Ensured by design; only tested to -20 V	6
Voltage ramp rate (VCC > 5 V)		0		2	V/µs	VCC > 5 V	6
Output pin voltage		-0.5		40	V		6
Output pin reverse current during reverse supply condition		0		100	mA	During reverse supply condition	6
Operating junction temperature	TJ	-40		175	°C	E grade	6
Storage temperature	Tstg	-65		150	°C		6
Power supply voltage	VCC	2.7		38	V		6
Output pin voltage (OUT)	VO	0		38	V		6
Output pin current sink (OUT)	ISINK	0		30	mA		6
Operating ambient temperature	TA	-40		150	°C	E grade	6
VCC operating voltage	VCC	2.7		38	V		7
Operating supply current	ICC		3	3.5	mA	VCC = 2.7 to 38 V, TA = TA,MAX	7
Power-on time	ton		35	50	µs	AJ, BI versions	7
FET on-resistance	rDS(on)		36	50	Ω	VCC = 3.3 V, IO = 10 mA, TA = 125°C	7
Off-state leakage current	Ilkg(off)			1	µA	Output Hi-Z	7
Reverse supply voltage	VCCR	-22			V		7
Overcurrent protection level	IOCP	15	30	45	mA	OUT shorted VCC	7
Output delay time	td		13	25	µs	B = BRP, 10 mT to BOP + 10 mT in 1 µs	7
Output jitter	tj	-8.5		8.5	µs	Measured from 20 000 cycles of B increasing at a rate of 50 mT/ms	7
Operate point	BOP	3	6.9	12	mT	DRV5023AJ: 6.9 / 3.2 mT	7
Release point	BRP	1	3.2	5	mT	DRV5023AJ: 6.9 / 3.2 mT	7
Junction-to-ambient thermal resistance	RθJA		180		°C/W	LPG (TO-92) package	6
Junction-to-case (top) thermal resistance	RθJC(top)		98.6		°C/W	LPG (TO-92) package	6
Junction-to-board thermal resistance	RθJB		154.9		°C/W	LPG (TO-92) package	6
Junction-to-top characterization parameter	ψJT		40		°C/W	LPG (TO-92) package	6
Junction-to-board characterization parameter	ψJB		154.9		°C/W	LPG (TO-92) package	6

CAD (KiCad official)

Symbol: DRV5023AJELPGMQ1
Footprint: Package_TO_SOT_THT:TO-92_Inline
3D model: TO-92 (KiCad packages3D, STEP)
3D model files: drv5023ajelpgmq1-etched.step / drv5023ajelpgmq1-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); drv5023ajelpgmq1.step / drv5023ajelpgmq1.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

Datasheet: Texas Instruments datasheet (34 pp, sha256 a5ccf66bec8620c9, retrieved 2026-11-06, tier: manufacturer)
Datasheet language: Chinese. Pin names, descriptions, and specs on this page were extracted and translated to English by ds2sf; the linked PDF is the manufacturer original.
Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-haiku-5-5 (text), consensus claude-sonnet-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF

DRV5023AJELPGMQ1

Verified DRV5023AJELPGMQ1

Verification log 1 record

3D Model

Symbol & Footprint

Schematic Symbol

PCB Footprint

Datasheet

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