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SQ4937EY-T1_GE3
Public Made by Adomby adom
Vishay Intertech MOSFETs, SO-8. Pinout cross-checked by two models against the datasheet, KiCad symbol/footprint/3D.
3D Model
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Symbol & Footprint
Schematic Symbol
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PCB Footprint
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Datasheet
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README
markdownSQ4937EY-T1_GE3
Vishay Intertech · MOSFETs · SO-8
SQ4937EY-T1_GE3 from Vishay Intertech, in a SO-8. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.
Pinout
| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | S1 | passive | Source of P-channel MOSFET 1 in the dual-P-channel device; the device ratings are VDS -30 V and VGS ±20 V. |
| 2 | G1 | input | Gate of P-channel MOSFET 1; the absolute maximum gate-source voltage is ±20 V. |
| 3 | S2 | passive | Source of P-channel MOSFET 2 in the dual-P-channel device; the device ratings are VDS -30 V and VGS ±20 V. |
| 4 | G2 | input | Gate of P-channel MOSFET 2; the absolute maximum gate-source voltage is ±20 V. |
| 5 | D2 | passive | Drain of P-channel MOSFET 2 (internally tied to pin 6); the drain-source voltage limit is -30 V and continuous drain current per leg is -5 A at TC = 25 °C. |
| 6 | D2 | passive | Drain of P-channel MOSFET 2 (internally tied to pin 5); the drain-source voltage limit is -30 V and continuous drain current per leg is -5 A at TC = 25 °C. |
| 7 | D1 | passive | Drain of P-channel MOSFET 1 (internally tied to pin 8); the drain-source voltage limit is -30 V and continuous drain current per leg is -5 A at TC = 25 °C. |
| 8 | D1 | passive | Drain of P-channel MOSFET 1 (internally tied to pin 7); the drain-source voltage limit is -30 V and continuous drain current per leg is -5 A at TC = 25 °C. |
Key specifications
| Parameter | Value |
|---|---|
| Manufacturer | Vishay Intertech |
| Package | SO-8 |
| Category | Transistors/Thyristors |
| Pins | 8 |
Electrical characteristics
Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).
| Parameter | Symbol | Min | Typ | Max | Unit | Conditions | Page |
|---|---|---|---|---|---|---|---|
| Drain-Source Voltage | VDS | -30 | V | 1 | |||
| Gate-Source Voltage | VGS | -20 | 20 | V | 1 | ||
| Continuous Drain Current | ID | -5 | A | TC = 25 °C | 1 | ||
| Continuous Drain Current | ID | -3 | A | TC = 125 °C | 1 | ||
| Continuous Source Current (Diode Conduction) | IS | -3 | A | 1 | |||
| Pulsed Drain Current | IDM | -20 | A | Pulse test; pulse width 300 μs, duty cycle 2 % | 1 | ||
| Single Pulse Avalanche Current | IAS | -10 | A | L = 0.1 mH | 1 | ||
| Single Pulse Avalanche Energy | EAS | 5 | mJ | 1 | |||
| Maximum Power Dissipation | PD | 3.3 | W | TC = 25 °C | 1 | ||
| Maximum Power Dissipation | PD | 1.1 | W | TC = 125 °C | 1 | ||
| Operating Junction and Storage Temperature Range | TJ, Tstg | -55 | 175 | °C | 1 | ||
| Junction-to-Ambient | RthJA | 110 | °C/W | PCB mount (note b: 1 in square PCB, FR-4) | 1 | ||
| Junction-to-Foot (Drain) | RthJF | 45 | °C/W | 1 | |||
| Drain-Source Breakdown Voltage | VDS | -30 | V | VGS = 0 V, ID = - 250 μA | 2 | ||
| Gate-Source Threshold Voltage | VGS(th) | -1.5 | -2 | -2.5 | V | VDS = VGS, ID = - 250 μA | 2 |
| Gate-Source Leakage | IGSS | -100 | 100 | nA | VDS = 0 V, VGS = ± 20 V | 2 | |
| Zero Gate Voltage Drain Current | IDSS | -1 | μA | VGS = 0 V VDS = - 30 V | 2 | ||
| Zero Gate Voltage Drain Current | IDSS | -50 | μA | VGS = 0 V VDS = - 30 V, TJ = 125 °C | 2 | ||
| Zero Gate Voltage Drain Current | IDSS | -150 | μA | VGS = 0 V VDS = - 30 V, TJ = 175 °C | 2 | ||
| On-State Drain Current | ID(on) | -15 | A | VGS = - 10 V VDS- 5 V | 2 | ||
| Drain-Source On-State Resistance | RDS(on) | 0.056 | 0.075 | Ω | VGS = - 10 V ID = - 3.9 A | 2 | |
| Drain-Source On-State Resistance | RDS(on) | 0.109 | Ω | VGS = - 10 V ID = - 3.9 A, TJ = 125 °C | 2 | ||
| Drain-Source On-State Resistance | RDS(on) | 0.127 | Ω | VGS = - 10 V ID = - 3.9 A, TJ = 175 °C | 2 | ||
| Drain-Source On-State Resistance | RDS(on) | 0.119 | 0.145 | Ω | VGS = - 4.5 V ID = - 2 A | 2 | |
| Gate Resistance | Rg | 3.5 | 10.5 | Ω | f = 1 MHz | 2 | |
| Input Capacitance | Ciss | 384 | 480 | pF | VGS = 0 V VDS = - 25 V, f = 1 MHz | 2 | |
| Output Capacitance | Coss | 84 | 105 | pF | 2 | ||
| Reverse Transfer Capacitance | Crss | 56 | 70 | pF | 2 | ||
| Total Gate Charge | Qg | 9.5 | 15 | nC | VGS = - 10 V VDS = - 15 V, ID = - 4.9 A | 2 | |
| Pulsed Current | ISM | -20 | A | Pulse test; pulse width 300 μs, duty cycle 2 % | 2 | ||
| Forward Voltage | VSD | -0.85 | -1.2 | V | IF = - 3 A, VGS = 0 V | 2 | |
| Rise Time | tr | 8 | 12 | ns | 2 | ||
| Turn-Off Delay Time | td(off) | 15 | 23 | ns | 2 | ||
| Fall Time | tf | 8 | 12 | ns | 2 | ||
| Turn-On Delay Time | td(on) | 69 | ns | VDD = - 15 V, RL = 15, ID - 1 A, VGEN = - 10 V, Rg = 1 | 2 | ||
| Forward Transconductance | gfs | 6 | S | VDS = - 15 V, ID = - 3.9 A | 2 | ||
| Gate-Source Charge | Qgs | 1.7 | nC | 2 | |||
| Gate-Drain Charge | Qgd | 2.3 | nC | 2 |
CAD (KiCad official)
- Symbol:
SQ4937EY-T1_GE3 - Footprint:
Package_SO:SOIC-8_3.9x4.9mm_P1.27mm - 3D model: SO-8 (KiCad packages3D, STEP)
- 3D model files:
sq4937ey-t1-ge3-etched.step/sq4937ey-t1-ge3-etched.glbcarry the MPN laser-etched on the die in a toggleableAdom.LaserEtchgroup (Fusion-ready);sq4937ey-t1-ge3.step/sq4937ey-t1-ge3.glbare the bare package body.
Provenance
Data extracted from the manufacturer datasheet, not a distributor listing:
- Datasheet: Vishay Intertech datasheet (9 pp, sha256
57e261be56f9e514, retrieved 2026-10-17, tier: lcsc) - Extractor: parts-factory
2.0.0/extract_pins 0.3, primaryclaude-haiku-5-5(text), consensusclaude-sonnet-5-5(agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish. - CAD: KiCad official libraries (CC-BY-SA 4.0).