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Contents

README

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STPS3045CGY-TR

STMicroelectronics · Schottky Diodes · D2PAK

STPS3045CGY-TR from STMicroelectronics, in a D2PAK. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 A1 passive First anode of dual center-tap Schottky rectifier with 15 A average forward current per diode and 45 V repetitive peak reverse voltage.
2 K passive Common cathode (center tap) for dual Schottky rectifier with 15 A average forward current per diode and 45 V repetitive peak reverse voltage.
3 A2 passive Second anode of dual center-tap Schottky rectifier with 15 A average forward current per diode and 45 V repetitive peak reverse voltage.

Key specifications

Parameter Value
Manufacturer STMicroelectronics
Package D2PAK
Category Diodes
Pins 3

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
Repetitive peak reverse voltage VRRM 45 V 2
Forward rms voltage IF(RMS) 30 A 2
Average forward current, per diode IF(AV) 10 A δ = 0.5, TC = 155 °C 2
Average forward current, per device IF(AV) 30 A δ = 0.5, TC = 155 °C 2
Surge non repetitive forward current IFSM 220 A tp = 10 ms sinusoidal 2
Repetitive peak avalanche power PARM 6000 W tp = 1 µs, Tj = 25 °C 2
Storage temperature range Tstg -65 175 °C 2
Maximum operating junction temperature Tj -40 175 °C 2
Critical rate of rise reverse voltage dV/dt 10000 V/µs 2
Reverse leakage current IR 200 µA Tj = 25 °C, VR = VRRM 2
Reverse leakage current IR 11 40 mA Tj = 125 °C, VR = VRRM 2
Forward voltage drop VF 0.5 0.57 V Tj = 125 °C, IF = 15 A 2
Forward voltage drop VF 0.84 V Tj = 25 °C, IF = 30 A 2
Forward voltage drop VF 0.65 0.72 V Tj = 125 °C 2
Junction to case, per diode Rth (j-c) 1.6 °C/W 2
Junction to case, total Rth (j-c) 0.85 °C/W 2
Coupling Rth (c) 0.1 °C/W 2

CAD (KiCad official)

  • Symbol: STPS3045CGY-TR
  • Footprint: Package_TO_SOT_SMD:TO-263-2
  • 3D model: D2PAK (KiCad packages3D, STEP)
  • 3D model files: stps3045cgy-tr-etched.step / stps3045cgy-tr-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); stps3045cgy-tr.step / stps3045cgy-tr.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: STMicroelectronics datasheet (7 pp, sha256 742ec87b4109aa81, retrieved 2026-10-21, tier: lcsc)
  • Extractor: ds2sf (Claude). Every pin and dimension is cited to a datasheet page; it refuses to fabricate.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF