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Contents

README

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IX4427N

IXYS · Gate Drive ICs · SOIC-8

IX4427N from IXYS, in a SOIC-8. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 NC unconnected No connection; this pin is not internally connected on the SOIC package.
2 INA input Channel A logic input, TTL and CMOS compatible, virtually immune to latch-up.
3 GND power_in Ground, the common ground reference for the device.
4 INB input Channel B logic input, TTL and CMOS compatible, virtually immune to latch-up.
5 OUTB output Channel B output that sources or sinks up to 1.5A peak current to turn on or turn off a discrete MOSFET or IGBT.
6 VCC power_in Supply voltage that provides power to the device, 4.5V to 35V operating range per the datasheet.
7 OUTA output Channel A output that sources or sinks up to 1.5A peak current to turn on or turn off a discrete MOSFET or IGBT.
8 NC unconnected No connection; this pin is not internally connected on the SOIC package.

Key specifications

Parameter Value
Manufacturer IXYS
Package SOIC-8
Category Power Management ICs
Pins 8

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
Supply Voltage VCC -0.3 35 V 3
Input Voltage VIN -5 V 3
Output Current IOUT -1.5 1.5 A 3
Junction Temperature TJ -55 150 °C 3
Storage Temperature TSTG -65 150 °C 3
Supply Voltage VCC 4.5 30 V 3
Operating Temperature Range TA -40 125 °C 3
Input Voltage, High VIH 2.4 V TA=25°C; 4.5V<VCC<18V 4
Input Voltage, Low VIL 0.8 V TA=25°C; 4.5V<VCC<18V 4
Input Current IIN -1 1 A TA=25°C; 4.5V<VCC<18V; 0V < VIN < VCC 4
Output Voltage, High (min is VCC-0.025 V; printed offset shown) VOH -0.025 V TA=25°C; 4.5V<VCC<18V 4
Output Voltage, Low VOL 0.025 V TA=25°C; 4.5V<VCC<18V 4
Latch-Up Protection With Reverse Current I 500 mA TA=25°C; 4.5V<VCC<18V 4
Rise Time tR 10 20 ns TA=25°C; 4.5V<VCC<18V; VCC=18V, CLOAD=1000pF 4
Fall Time tF 8 20 ns TA=25°C; 4.5V<VCC<18V; VCC=18V, CLOAD=1000pF 4
On-Time Propagation Delay ton 35 60 ns TA=25°C; 4.5V<VCC<18V; VCC=18V, CLOAD=1000pF 4
Off-Time Propagation Delay toff 35 60 ns TA=25°C; 4.5V<VCC<18V; VCC=18V, CLOAD=1000pF 4
Power Supply Current ICC 2.5 4 mA TA=25°C; 4.5V<VCC<18V; VINA=VINB=3V 4
Power Supply Current ICC 0.6 0.8 mA TA=25°C; 4.5V<VCC<18V; VINA=VINB=0V 4
Input Voltage, High VIH 2.4 V TA=-40°C to +125°C; 4.5V<VCC<18V 5
Input Voltage, Low VIL 0.8 V TA=-40°C to +125°C; 4.5V<VCC<18V 5
Input Current IIN -1 1 A TA=-40°C to +125°C; 4.5V<VCC<18V; 0V < VIN < VCC 5
Output Voltage, High (min is VCC-0.025 V; printed offset shown) VOH -0.025 V TA=-40°C to +125°C; 4.5V<VCC<18V 5
Output Voltage, Low VOL 0.025 V TA=-40°C to +125°C; 4.5V<VCC<18V 5
Output Resistance, High State ROH 12 Ω TA=-40°C to +125°C; 4.5V<VCC<18V; VCC=18V, IOUT=-100mA 5
Output Resistance, Low State ROL 8 Ω TA=-40°C to +125°C; 4.5V<VCC<18V; VCC=18V, IOUT=100mA 5
Latch-Up Protection With Reverse Current I 500 mA TA=-40°C to +125°C; 4.5V<VCC<18V 5
Rise Time tR 30 ns TA=-40°C to +125°C; 4.5V<VCC<18V; VCC=18V, CLOAD=1000pF 5
Fall Time tF 30 ns TA=-40°C to +125°C; 4.5V<VCC<18V; VCC=18V, CLOAD=1000pF 5
On-Time Propagation Delay ton 70 ns TA=-40°C to +125°C; 4.5V<VCC<18V; VCC=18V, CLOAD=1000pF 5
Off-Time Propagation Delay toff 70 ns TA=-40°C to +125°C; 4.5V<VCC<18V; VCC=18V, CLOAD=1000pF 5
Power Supply Current ICC 6 mA TA=-40°C to +125°C; 4.5V<VCC<18V; VINA=VINB=3V 5
Power Supply Current ICC 1 mA TA=-40°C to +125°C; 4.5V<VCC<18V; VINA=VINB=0V 5
Output Resistance, High State ROH 48 Ω TA=25°C; 4.5V<VCC<18V; VCC=18V, IOUT=-100mA 4
Output Resistance, Low State ROL 24 Ω TA=25°C; 4.5V<VCC<18V; VCC=18V, IOUT=100mA 4
Thermal Resistance, Junction-to-Ambient (8-Pin SOIC) JA 120 °C/W 6

Materials and finish

As the datasheet states them (page.json metadata.appearance; the 3D model's colours follow it).

Part Material Colour / plating Datasheet says Page
housing PC Circuits Division classifies its plastic encapsulated devices for moisture sensitivity according to the latest version of the joint industry standard, IPC/JEDEC J-STD-020, in force at the time of prod 11

CAD (KiCad official)

  • Symbol: IX4427N
  • Footprint: Package_SO:SOIC-8_3.9x4.9mm_P1.27mm
  • 3D model: SOIC-8 (KiCad packages3D, STEP)
  • 3D model files: ix4427n-etched.step / ix4427n-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); ix4427n.step / ix4427n.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: IXYS datasheet (13 pp, sha256 a2f2457ab79c0dfe, retrieved 2026-11-05, tier: lcsc)
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-haiku-5-5 (text), consensus claude-sonnet-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF