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Contents

README

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ESD56151W05-2

WILLSEMI Will Semicon · ESD And Surge Protection (TVS/ESD) · SOD-323

ESD56151W05-2 from WILLSEMI Will Semicon, in a SOD-323. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 Pin1 passive Bi-directional TVS terminal 1 (measured pin 1 to pin 2); ESD56151W05 has 5.0V reverse stand-off voltage, 5.3-7.1V breakdown at 1mA, and 145A rated peak pulse current (8/20μs).
2 Pin2 passive Bi-directional TVS terminal 2 (measured pin 1 to pin 2); protects power lines with ±30kV IEC61000-4-2 ESD contact and air discharge capability.

Key specifications

Parameter Value
Manufacturer WILLSEMI Will Semicon
Package SOD-323
Category Circuit Protection
Pins 2

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
Peak pulse power Ppk 2400 W tp = 8/20μs 2
ESD IEC61000-4-2 air discharge VESD -30 30 kV IEC61000-4-2 air discharge 2
ESD IEC61000-4-2 contact discharge VESD -30 30 kV IEC61000-4-2 contact discharge 2
Junction temperature TJ 125 °C 2
Operating temperature TOP -40 85 °C 2
Lead temperature TL 260 °C 2
Storage temperature TSTG -55 150 °C 2
Reverse stand-off voltage VRWM 5 V ESD56151W05, TA = 25°C 3
Breakdown voltage VBR 5.3 6.3 7.1 V IBR = 1mA 3
Reverse leakage current IRM 0.1 μA at VRWM 3
Junction capacitance CJ 400 450 pF F = 1MHz, VR=0V 3
Rated peak pulse current IPP 145 A 8/20μs, IEC61000-4-5, pin 1 to pin 2 3
Clamping voltage VCL 16 V at IPP (A) per Table 4, 8/20μs, IEC61000-4-5 3
Clamping voltage VCL 6.7 V IPP = 16A, tp = 100ns, IEC61000-4-2 3
Clamping voltage VCL 7.5 V VESD = 8kV, IEC61000-4-2 3

CAD (KiCad official)

  • Symbol: ESD56151W05-2
  • Footprint: Diode_SMD:D_SOD-323
  • 3D model: SOD-323 (KiCad packages3D, STEP)
  • 3D model files: esd56151w05-2-etched.step / esd56151w05-2-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); esd56151w05-2.step / esd56151w05-2.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: WILLSEMI Will Semicon datasheet (6 pp, sha256 412df2390bfb76fd, retrieved 2026-10-22, tier: lcsc)
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-sonnet-5-5 (text), consensus claude-sonnet-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF