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DS16EV5110ASQX
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Texas Instruments Video Interface ICs, WQFN-48-EP(7x7). Pinout cross-checked by two models against the datasheet, KiCad symbol/footprint/3D.
3D Model
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Symbol & Footprint
Schematic Symbol
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PCB Footprint
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Datasheet
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README
markdownDS16EV5110ASQX
Texas Instruments · Video Interface ICs · WQFN-48-EP(7x7)
DS16EV5110ASQX from Texas Instruments, in a WQFN-48-EP(7x7). Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.
Pinout
| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | C_IN- | input | Inverting TMDS clock input (CML) to the equalizer, with an on-chip 50Ω termination resistor to VDD. |
| 2 | C_IN+ | input | Non-inverting TMDS clock input (CML) to the equalizer, with an on-chip 50Ω termination resistor to VDD. |
| 3 | VDD | power_in | Power supply pin (3.0V to 3.6V), tied to the VDD plane through a low inductance path with a 0.1µF bypass capacitor to GND. |
| 4 | D_IN0- | input | Inverting TMDS data 0 input (CML) to the equalizer, with an on-chip 50Ω termination resistor to VDD. |
| 5 | D_IN0+ | input | Non-inverting TMDS data 0 input (CML) to the equalizer, with an on-chip 50Ω termination resistor to VDD. |
| 6 | VDD | power_in | Power supply pin (3.0V to 3.6V), tied to the VDD plane through a low inductance path with a 0.1µF bypass capacitor to GND. |
| 7 | VDD | power_in | Power supply pin (3.0V to 3.6V), tied to the VDD plane through a low inductance path with a 0.1µF bypass capacitor to GND. |
| 8 | D_IN1- | input | Inverting TMDS data 1 input (CML) to the equalizer, with an on-chip 50Ω termination resistor to VDD. |
| 9 | D_IN1+ | input | Non-inverting TMDS data 1 input (CML) to the equalizer, with an on-chip 50Ω termination resistor to VDD. |
| 10 | VDD | power_in | Power supply pin (3.0V to 3.6V), tied to the VDD plane through a low inductance path with a 0.1µF bypass capacitor to GND. |
| 11 | D_IN2- | input | Inverting TMDS data 2 input (CML) to the equalizer, with an on-chip 50Ω termination resistor to VDD. |
| 12 | D_IN2+ | input | Non-inverting TMDS data 2 input (CML) to the equalizer, with an on-chip 50Ω termination resistor to VDD. |
| 13 | VDD | power_in | Power supply pin (3.0V to 3.6V), tied to the VDD plane through a low inductance path with a 0.1µF bypass capacitor to GND. |
| 14 | BST_1 | input | LVCMOS equalizer boost select bit 1 (with BST_0 and BST_2 selects 1 of 8 boost levels), internally pulled Low. |
| 15 | VDD | power_in | Power supply pin (3.0V to 3.6V), tied to the VDD plane through a low inductance path with a 0.1µF bypass capacitor to GND. |
| 16 | CS | input | SMBus chip select: High enables the equalizer SMBus register, Low disables it; internally pulled Low and gated with SDC. |
| 17 | SDC | input | SMBus clock input (LVCMOS), internally pulled High to 3.3V with a High-Z pull up. |
| 18 | SDA | bidirectional | SMBus data input/output (LVCMOS), internally pulled High to 3.3V with a High-Z pull up. |
| 19 | Reserv | unconnected | Reserved; do not connect. |
| 20 | Reserv | unconnected | Reserved; do not connect. |
| 21 | FEB | input | Force External Boost: High sets boost from the BST_[0:2] pins, Low sets boost through the SMBus; internally pulled High. |
| 22 | GND | power_in | Ground reference, tied to a solid ground plane through a low impedance path. |
| 23 | BST_0 | input | LVCMOS equalizer boost select bit 0 (with BST_1 and BST_2 selects 1 of 8 boost levels), internally pulled Low. |
| 24 | GND | power_in | Ground reference, tied to a solid ground plane through a low impedance path. |
| 25 | D_OUT2+ | output | Non-inverting TMDS data 2 output (CML) from the equalizer, open collector. |
| 26 | D_OUT2- | output | Inverting TMDS data 2 output (CML) from the equalizer, open collector. |
| 27 | GND | power_in | Ground reference, tied to a solid ground plane through a low impedance path. |
| 28 | D_OUT1+ | output | Non-inverting TMDS data 1 output (CML) from the equalizer, open collector. |
| 29 | D_OUT1- | output | Inverting TMDS data 1 output (CML) from the equalizer, open collector. |
| 30 | GND | power_in | Ground reference, tied to a solid ground plane through a low impedance path. |
| 31 | GND | power_in | Ground reference, tied to a solid ground plane through a low impedance path. |
| 32 | D_OUT0+ | output | Non-inverting TMDS data 0 output (CML) from the equalizer, open collector. |
| 33 | D_OUT0- | output | Inverting TMDS data 0 output (CML) from the equalizer, open collector. |
| 34 | GND | power_in | Ground reference, tied to a solid ground plane through a low impedance path. |
| 35 | C_OUT+ | output | Non-inverting TMDS clock output (CML) from the equalizer, open collector. |
| 36 | C_OUT- | output | Inverting TMDS clock output (CML) from the equalizer, open collector. |
| 37 | BST_2 | input | LVCMOS equalizer boost select bit 2 (with BST_0 and BST_1 selects 1 of 8 boost levels), internally pulled Low. |
| 38 | Reserv | unconnected | Reserved; do not connect. |
| 39 | Reserv | unconnected | Reserved; do not connect. |
| 40 | Reserv | unconnected | Reserved; do not connect. |
| 41 | Reserv | unconnected | Reserved; do not connect. |
| 42 | Reserv | unconnected | Reserved; do not connect. |
| 43 | Reserv | unconnected | Reserved; do not connect. |
| 44 | EN | input | Enable input: High selects normal operation, Low selects standby mode; internally pulled High and global to all data and clock channels. |
| 45 | SD | output | LVCMOS clock channel signal detect output, High when signal is detected. |
| 46 | VDD | power_in | Power supply pin (3.0V to 3.6V), tied to the VDD plane through a low inductance path with a 0.1µF bypass capacitor to GND. |
| 47 | Reserv | unconnected | Reserved; do not connect. |
| 48 | Reserv | unconnected | Reserved; do not connect. |
| 49 | EP | passive | Exposed pad (from the footprint; not named in the datasheet pin table). |
Key specifications
| Parameter | Value |
|---|---|
| Manufacturer | Texas Instruments |
| Package | WQFN-48-EP(7x7) |
| Category | Communication Interface Chip/UART/485/232 |
| Pins | 49 |
CAD (KiCad official)
- Symbol:
DS16EV5110ASQX - Footprint:
Package_DFN_QFN:QFN-48-1EP_7x7mm_P0.5mm_EP5.15x5.15mm - 3D model: WQFN-48-EP(7x7) (KiCad packages3D, STEP)
- 3D model files:
ds16ev5110asqx-etched.step/ds16ev5110asqx-etched.glbcarry the MPN laser-etched on the die in a toggleableAdom.LaserEtchgroup (Fusion-ready);ds16ev5110asqx.step/ds16ev5110asqx.glbare the bare package body.
Provenance
Data extracted from the manufacturer datasheet, not a distributor listing:
- Datasheet: Texas Instruments datasheet (25 pp, sha256
8197f99e1a4a9be5, retrieved 2026-10-08, tier: lcsc) - Extractor: parts-factory
2.0.0/extract_pins 0.3, primaryclaude-haiku-5-5(text), consensusclaude-sonnet-5-5(agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish. - CAD: KiCad official libraries (CC-BY-SA 4.0).