Loads when you scroll to it. Unloads after 5 minutes in the background.

Symbol & Footprint

Schematic Symbol

Open full view ↗
Loads when you scroll to it. Unloads after 5 minutes in the background.

PCB Footprint

Open full view ↗
Loads when you scroll to it. Unloads after 5 minutes in the background.
Loads when you scroll to it. Unloads after 5 minutes in the background.
Download PDF
Contents

README

markdown

BZX84C3V9Q-13-F

Diodes Incorporated · Zener Diodes · SOT-23

BZX84C3V9Q-13-F from Diodes Incorporated, in a SOT-23. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 A passive Anode of the zener diode, drawn as the lower-left terminal in the device schematic.
2 NC unconnected Lower-right terminal, shown in the device schematic with no internal connection.
3 K passive Cathode of the zener diode, the single top terminal in the device schematic (VZ 3.7V to 4.1V at IZT = 5mA for the C3V9 type).

Key specifications

Parameter Value
Manufacturer Diodes Incorporated
Package SOT-23
Category Diodes
Pins 3

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
Zener voltage (BZX84C3V9) VZ 3.7 3.9 4.1 V @ IZT = 5.0 mA; short duration pulse test (Note 8) 2
Maximum Zener impedance ZZT 90 Ω @ IZT = 5.0 mA, f = 1 kHz 2
Maximum Zener impedance (knee) ZZK 600 Ω @ IZK = 1.0 mA, f = 1 kHz 2
Maximum reverse current IR 3 µA @ VR = 1.0 V 2
Forward voltage VF 0.9 V @ IF = 10 mA 2
Power dissipation PD 300 mW Note 6: FR-4 PC board with recommended pad layout 2
Power dissipation PD 350 mW Note 7: terminals kept at ambient temperature 2
Thermal resistance, junction to ambient air RθJA 417 °C/W Note 6: FR-4 PC board with recommended pad layout 2
Thermal resistance, junction to ambient air RθJA 357 °C/W Note 7: terminals kept at ambient temperature 2
Operating and storage temperature range TJ, TSTG -65 150 °C 2
Temperature coefficient (BZX84C3V9) -3.5 mV/C @ IZT = 5.0 mA 2

Materials and finish

As the datasheet states them (page.json metadata.appearance; the 3D model's colours follow it).

Part Material Colour / plating Datasheet says Page
contacts tin  Terminals: Matte Tin Finish Annealed over Alloy 42 Leadframe (Lead Free Plating). Solderable per MIL-STD-202, Method 208 1

CAD (KiCad official)

  • Symbol: BZX84C3V9Q-13-F
  • Footprint: Package_TO_SOT_SMD:SOT-23
  • 3D model: SOT-23 (KiCad packages3D, STEP)
  • 3D model files: bzx84c3v9q-13-f-etched.step / bzx84c3v9q-13-f-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); bzx84c3v9q-13-f.step / bzx84c3v9q-13-f.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: Diodes Incorporated datasheet (5 pp, sha256 70c346b571aa2f8b, retrieved 2026-10-21, tier: lcsc)
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-sonnet-5-5 (text+vision), consensus claude-opus-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF