Loads when you scroll to it. Unloads after 5 minutes in the background.

Symbol & Footprint

Schematic Symbol

Open full view ↗
Loads when you scroll to it. Unloads after 5 minutes in the background.

PCB Footprint

Open full view ↗
Loads when you scroll to it. Unloads after 5 minutes in the background.
Loads when you scroll to it. Unloads after 5 minutes in the background.
Download PDF
Contents

README

markdown

IS25LP016D-JBLA3-TR

ISSI Integrated Silicon Solution · NOR FLASH · SOIC-8-208mil

IS25LP016D-JBLA3-TR from ISSI Integrated Silicon Solution, in a SOIC-8-208mil. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 CE# input Chip Enable: when CE# is high the device is deselected, outputs are high impedance and it enters standby; after power-up CE# must go from high to low before a new instruction is accepted.
2 SO (IO1) bidirectional Serial Data Output in standard SPI, read on the falling edge of SCK; becomes bidirectional IO1 in Dual and Quad SPI modes.
3 WP# (IO2) bidirectional Write Protect: with SRWD set to 1 and WP# pulled low, the Status Register bits (SRWD, QE, BP3, BP2, BP1, BP0) are write-protected; when QE is 1 this pin is used as IO2 and WP# function is unavailable.
4 GND power_in Ground: connect to ground when referenced to Vcc.
5 SI (IO0) bidirectional Serial Data Input in standard SPI, latched on the rising edge of SCK; becomes bidirectional IO0 in Dual and Quad SPI and QPI modes.
6 SCK input Serial Data Clock: synchronized clock for input and output timing operations; the device supports SPI modes 0 (0,0) and 3 (1,1).
7 HOLD# or RESET# (IO3) bidirectional HOLD# is active low and pauses serial communication with SO at high impedance while CE# is low (default, P7=0); it can be set to RESET# by the P7 bit in the Read Register (P7=1), and becomes IO3 when QE is 1.
8 Vcc power_in Power: device core power supply.

Key specifications

Parameter Value
Manufacturer ISSI Integrated Silicon Solution
Package SOIC-8-208mil
Category Memory
Pins 8

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
VCC Power Supply (IS25LP) VCC 2.3 3 3.6 V IS25LP 93
Ambient Operating Temperature (Automotive Grade A3) -40 125 °C Automotive Grade A3 93
Storage Temperature -65 150 °C 93
Input Voltage with Respect to Ground on All Pins -0.5 V 93
All Output Voltage with Respect to Ground -0.5 V 93
VCC Supply Voltage (IS25LP) VCC -0.5 6 V IS25LP 93
Electrostatic Discharge Voltage (Human Body Model) -2000 2000 V ANSI/ESDA/JEDEC JS-001 93
VCC Active Read current ICC1 4 12 mA NORD at 50MHz 94
VCC Active Read current ICC1 6 14 mA FRD Single at 133MHz 94
VCC Active Read current ICC1 8 15 mA FRD Dual at 133MHz 94
VCC Active Read current ICC1 10 17 mA FRD Quad at 133MHz 94
VCC Active Read current ICC1 9 16 mA FRD Quad at 104MHz 94
VCC Program Current ICC2 25 mA CE# = VCC, 125°C 94
VCC WRSR Current ICC3 25 mA CE# = VCC, 125°C 94
VCC Erase Current (SER/BER32/BER64) ICC4 25 mA CE# = VCC, 125°C 94
VCC Erase Current (CE) ICC5 25 mA CE# = VCC, 125°C 94
VCC Standby Current CMOS ISB1 30 µA CE# = VCC, VIN = GND or VCC, 125°C 94
Deep power down current (IS25LP) ISB2 20 µA CE# = VCC, VIN = GND or VCC, 125°C 94
Input Leakage Current ILI -1 1 µA VIN = 0V to VCC 94
Output Leakage Current ILO -1 1 µA VIN = 0V to VCC 94
Input Low Voltage VIL -0.5 V 94
Output Low Voltage VOL 0.2 V IOL = 100 µA 94
Clock Frequency (except fast read Quad I/O, QPI, DTR and read 03h) fCT 0 133 MHz except fast read Quad I/O, QPI, DTR and read (03h) 96
Clock Frequency for fast read Quad I/O and QPI (IS25LP) fCT 0 133 MHz fast read Quad I/O and QPI, IS25LP 96
Clock Frequency for fast read DTR fCT 0 66 MHz SPI DTR, Dual DTR, Dual I/O DTR, Quad I/O DTR, QPI DTR 96
Clock Frequency for read (03h) fC 0 50 MHz read (03h) 96
CE# High Time tCEH 7 ns 96
CE# Setup Time tCS 5 ns 96
CE# Hold Time tCH 5 ns 96
CE# Not Active Hold Time tCHSL 2.7 ns 96
CE# Not Active Setup Time tSHCH 2.7 ns 96
Data In Setup Time tDS 2 ns STR 96
Data In Setup Time tDS 1.5 ns DTR 96
Data In Hold Time tDH 2 ns STR 96
Data In Hold Time tDH 1.5 ns DTR 96
Output Valid tV 7 ns @133MHz (CL = 15pF) 96
Output Valid tV 8 ns @104MHz (CL = 30pF) 96
Output Hold Time tOH 2 ns 96
Output Disable Time tDIS 8 ns 96
HOLD to Output Low Z tLZ 12 ns 96
HOLD to Output High Z tHZ 12 ns 96
Sector Erase Time (4Kbyte) tEC 70 300 ms 102
Block Erase Time (32Kbyte) 0.1 0.5 s 102
Block Erase Time (64Kbyte) 0.15 1 s 102
Chip Erase Time (16Mb) 4 12 102
Page Programming Time tPP 0.2 0.8 ms 102
Release deep power down (IS25LP) tRES1 3 µs IS25LP 97
Deep power down tDP 3 µs 97
Write Status Register time tW 2 15 ms 97
Suspend to read ready tSUS 100 µs 97
Resume to next suspend TRS 80 µs 97
Software Reset recovery time tSRST 35 µs 97
RESET# pin low pulse width tRESET 100 ns 97
Hardware Reset recovery time tHWRST 35 µs 97
Input Capacitance (CE#, SCK) CIN 6 pF VIN = 0V; TA=25°C, VCC=3V (IS25LPx), 1MHz 95
Input/Output Capacitance (other pins) CIN/OUT 8 pF VIN/OUT = 0V; TA=25°C, VCC=3V (IS25LPx), 1MHz 95

CAD (KiCad official)

  • Symbol: IS25LP016D-JBLA3-TR
  • Footprint: Package_SO:SOIC-8_3.9x4.9mm_P1.27mm
  • 3D model: SOIC-8-208mil (KiCad packages3D, STEP)
  • 3D model files: is25lp016d-jbla3-tr-etched.step / is25lp016d-jbla3-tr-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); is25lp016d-jbla3-tr.step / is25lp016d-jbla3-tr.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: ISSI Integrated Silicon Solution datasheet (115 pp, sha256 3479c151bb5e0c1e, retrieved 2026-10-18, tier: lcsc)
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-haiku-5-5 (text), consensus claude-sonnet-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF