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Contents

README

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ICM-20948

TDK InvenSense · Accelerometers · QFN-24(3x3)

ICM-20948 from TDK InvenSense, in a QFN-24(3x3). Pinout and pin descriptions extracted from the manufacturer datasheet by ds2sf; symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 NC unconnected No connect. Do not connect.
2 NC unconnected No connect. Do not connect.
3 NC unconnected No connect. Do not connect.
4 NC unconnected No connect. Do not connect.
5 NC unconnected No connect. Do not connect.
6 NC unconnected No connect. Do not connect.
7 AUX_CL output Auxiliary I2C master serial clock, used to interface external sensors (e.g. onboard AK09916 magnetometer).
8 VDDIO power_in Digital I/O supply voltage. Operating range 1.71-1.95 V. Requires 0.1 uF bypass capacitor to GND.
9 AD0/SDO bidirectional In I2C mode: I2C slave address LSB (AD0) - selects 7-bit slave address 0x68 (low) or 0x69 (high). In SPI mode: SPI serial data output (SDO).
10 REGOUT passive Internal regulator filter capacitor connection. Connect a 0.1 uF X7R ceramic capacitor (2 V rating) between this pin and GND.
11 FSYNC input Frame synchronization digital input, used for EIS timestamping/synchronization. Tie to GND if unused.
12 INT1 output Interrupt 1 output. Programmable (push-pull/open-drain, active-high/low) via INT_PIN_CFG register. Route to a host GPIO capable of waking the processor.
13 VDD power_in Main power supply voltage. Operating range 1.71-3.6 V. Requires 0.1 uF bypass capacitor to GND.
14 NC unconnected No connect. Do not connect.
15 NC unconnected No connect. Do not connect.
16 NC unconnected No connect. Do not connect.
17 NC unconnected No connect. Do not connect.
18 GND power_in Power supply ground. The exposed die pad is NOT electrically connected to GND and should not be soldered down (avoids package thermo-mechanical stress).
19 RESV unconnected Reserved. Do not connect (leave floating).
20 RESV passive Reserved. Must be connected to GND.
21 AUX_DA bidirectional Auxiliary I2C master serial data, used to interface external sensors (e.g. onboard AK09916 magnetometer). Open-drain; requires pull-up.
22 nCS input SPI chip select, active low. Tie high in I2C mode; a low level at boot latches the device into SPI mode.
23 SCL/SCLK input In I2C mode: I2C serial clock (SCL, open-drain, requires 10 kΩ pull-up to VDDIO). In SPI mode: SPI serial clock (SCLK), up to 7 MHz.
24 SDA/SDI bidirectional In I2C mode: I2C serial data (SDA, open-drain, requires 10 kΩ pull-up to VDDIO). In SPI mode: SPI serial data input (SDI/MOSI).

Key specifications

Parameter Value
Manufacturer TDK InvenSense
Package QFN-24(3x3)
Category Sensors
Pins 24

CAD (KiCad official)

  • Symbol: ICM-20948
  • Footprint: Package_DFN_QFN:QFN-24-1EP_3x3mm_P0.4mm_EP1.75x1.6mm
  • 3D model: QFN-24(3x3) (KiCad packages3D, STEP)

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: TDK InvenSense datasheet (88 pp, sha256 230aaf125f015d7b, retrieved 2026-08-17, tier: lcsc)
  • Extractor: ds2sf (Claude). Every pin and dimension is cited to a datasheet page; it refuses to fabricate.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF