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Contents

README

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CRK0612-FZ-R010E

BOURNS · Chip Resistor - Surface Mount · 0612

CRK0612-FZ-R010E from BOURNS, in a 0612. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 1 passive Terminal 1 of an unpolarised resistor; either orientation.
2 2 passive Terminal 2 of an unpolarised resistor; either orientation.

Key specifications

Parameter Value
Manufacturer BOURNS
Package 0612
Category Resistors
Pins 2

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
Resistance Value (CRK0612, code R010) 10 mΩ 1
Tolerance (suffix F = ±1 %) -1 1 % 1
Temperature Coefficient of Resistance (suffix Z) -50 50 ppm/°C 1
Power Rating @ 70 °C P 1 W @ 70 °C; with total solder pad and trace size of 300 mm2 1
Operation Temperature Range -55 170 ℃ 1
Thermal EMF 40 µV/°C 1
Inductance 5 nH 1
Insulation Resistance 100 MΩ 100 V DC for 1 minute 1
Load Life: resistance change -1 1 % 1000 hours at rated power, 70 ℃, 1.5 hours ON, 0.5 hour OFF 1
Short Time Overload: resistance change -0.5 0.5 % 5 X rated power for 5 s 1
Moisture no Load: resistance change -0.5 0.5 % 85 ℃, 85 %RH, 1000 hrs 1
Temperature Cycle: resistance change -0.5 0.5 % -55 ℃ & +155 ℃, 100 cycle, 15 min per extreme condition 1
Resistance to Soldering Heat: resistance change -0.5 0.5 % 260 ±5 ℃ for 10 ±1 sec 1
High Temperature Exposure: resistance change -0.5 0.5 % 155 ℃, 1000 hrs 1
Low Temperature Storage: resistance change -0.5 0.5 % -55 ℃, 1000 hrs 1
Substrate Bending: resistance change -1 1 % Bending width 2 mm 1
Preheat Temperature Min. (Tsmin) Tsmin 150 °C Solder profile lead free assembly 3
Preheat Temperature Max. (Tsmax) Tsmax 200 °C Solder profile lead free assembly 3
Preheat Time (Tsmin to Tsmax) ts 60 150 seconds Solder profile lead free assembly 3
Time maintained above TL tL 60 120 seconds Solder profile lead free assembly 3
Liquidus Temperature (TL) TL 217 °C Solder profile lead free assembly 3
Peak Temperature (Tp) Tp 260 °C Solder profile lead free assembly 3
Average ramp-up rate (Tsmax to Tp) 3 °C/second Tsmax to Tp 3
Ramp-down rate 6 °C/second Solder profile lead free assembly 3
Time 25 °C to Peak Temperature 8 minutes Solder profile lead free assembly 3

CAD (KiCad official)

  • Symbol: CRK0612-FZ-R010E
  • Footprint: Resistor_SMD:R_0612_1632Metric
  • 3D model: 0612 (KiCad packages3D, STEP)
  • 3D model files: crk0612-fz-r010e-etched.step / crk0612-fz-r010e-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); crk0612-fz-r010e.step / crk0612-fz-r010e.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: BOURNS datasheet (5 pp, sha256 c54eb3eb11e77bdb, retrieved 2026-10-14, tier: lcsc)
  • Extractor: parts-factory 2.0.0 / extract_pins, primary two-terminal convention (convention), consensus off (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF