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Contents

README

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BZX585-C30

Nexperia · Zener Diodes · SOD-523(SC-79)

BZX585-C30 from Nexperia, in a SOD-523(SC-79). Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 K passive Cathode; the marking bar on the package indicates the cathode.
2 A passive Anode of the Zener diode.

Key specifications

Parameter Value
Manufacturer Nexperia
Package SOD-523(SC-79)
Category Diodes
Pins 2

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
Working voltage (C series, nominal 30 V) VZ 28.5 31.5 V 6
Differential resistance rdiff 70 300 Ω IZ = 2 mA 6
Differential resistance rdiff 30 80 Ω IZ = 0.5 mA 6
Temperature coefficient SZ 24.4 26.6 29.4 mV/K IZ = 2 mA 6
Reverse current IR 0.05 µA VR = 21.0 V 6
Diode capacitance Cd 50 pF f = 1 MHz; VR = 0 V 6
Non-repetitive peak reverse current IZSM 1 A tp = 100 µs; square wave; tj = 25 °C before surge 6
Forward current IF 200 mA 3
Non-repetitive peak reverse power dissipation PZSM 40 W tp = 100 µs; square wave; Tamb = 25 °C; prior to surge 3
Total power dissipation Ptot 300 mW Tamb = 25 °C; device mounted on FR4 PCB, ~35 mm² Cu at cathode tab 3
Junction temperature Tj -65 150 °C 3
Ambient temperature Tamb -65 150 °C 3
Storage temperature Tstg -65 150 °C 3
Thermal resistance from junction to ambient Rth(j-a) 350 K/W in free air; device mounted on FR4 PCB, ~35 mm² Cu at cathode tab 3
Thermal resistance from junction to solder point Rth(j-sp) 65 K/W soldering point of cathode tab 3
Forward voltage VF 0.9 V IF = 10 mA; pulse test tp ≤ 300 µs; δ ≤ 0.02 4
Forward voltage VF 1.1 V IF = 100 mA; pulse test tp ≤ 300 µs; δ ≤ 0.02 4

CAD (KiCad official)

  • Symbol: BZX585-C30
  • Footprint: Diode_SMD:D_SOD-523
  • 3D model: SOD-523(SC-79) (KiCad packages3D, STEP)
  • 3D model files: bzx585-c30-etched.step / bzx585-c30-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); bzx585-c30.step / bzx585-c30.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: Nexperia datasheet (13 pp, sha256 ce6f045443a822c0, retrieved 2026-10-15, tier: lcsc)
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-haiku-5-5 (text), consensus claude-sonnet-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF