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Contents

README

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TEA1755T

NXP Semicon · AC-DC Controllers & Regulators · SOIC-16

TEA1755T from NXP Semicon, in a SOIC-16. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 VCC power_in Supply voltage pin; the VCC capacitor is charged from the rectified mains through the HV pin during start-up until VCC passes Vstartup.
2 GND power_in Ground reference pin for the controller.
3 FBCTRL input Flyback control input; VFBCTRL varies between 0.77 V at minimum output power and 4.9 V at maximum output power, and a fault is assumed above 7.75 V.
4 FBAUX input Auxiliary winding input for demagnetization timing and flyback overvoltage protection; if left open or unconnected, the converter immediately stops.
5 LATCH input General-purpose protection input that must exceed the Ven(LATCH) voltage during start-up or the LATCH output is deactivated.
6 PFCCOMP passive PFC frequency compensation pin, with its clamp circuit activated during start-up.
7 VINSENSE input Mains voltage sense input; the PFC controller stops switching when VVINSENSE falls below Vstop(VINSENSE) and power-down mode is entered below Vth(pd).
8 PFCAUX input Auxiliary winding input for demagnetization timing of the PFC.
9 VOSENSE input Sense input for the PFC output voltage; the PFC controller stops switching when VVOSENSE exceeds VOVP(VOSENSE).
10 FBSENSE input Flyback current sense input that senses primary current across an external resistor and sources a 2.1 A offset current to set the minimum flyback peak current.
11 PFCSENSE input PFC current sense input, whose soft-start capacitor is charged during start-up.
12 PFCDRIVER output PFC gate-driver output.
13 FBDRIVER output Flyback gate-driver output.
14 PFCTIMER passive PFC override and switch-off delay timer pin.
15 HVS unconnected High-voltage safety spacer; not connected.
16 HV input High-voltage start-up and flyback valley sensing pin, connected to the flyback transformer center tap or the drain of MOSFET S2.

Key specifications

Parameter Value
Manufacturer NXP Semicon
Package SOIC-16
Category Power Management ICs
Pins 16

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
VCC supply voltage VCC -0.4 38 V 21
VLATCH voltage on pin LATCH VLATCH -0.4 10 V current limited 21
VFBCTRL voltage on pin FBCTRL VFBCTRL -0.4 9 V 21
VPFCCOMP voltage on pin PFCCOMP VPFCCOMP -0.4 5 V 21
VVINSENSE voltage on pin VINSENSE VVINSENSE -0.4 10 V current limited 21
VVOSENSE voltage on pin VOSENSE VVOSENSE -0.4 10 V current limited 21
VPFCAUX voltage on pin PFCAUX VPFCAUX -25 25 V 21
VFBSENSE voltage on pin FBSENSE VFBSENSE -0.4 5 V current limited 21
VPFCSENSE voltage on pin PFCSENSE VPFCSENSE -0.4 5 V current limited 21
VPFCTIMER voltage on pin PFCTIMER VPFCTIMER -0.4 10 V current limited 21
VHV voltage on pin HV VHV -0.4 650 V 21
IFBAUX current on pin FBAUX IFBAUX -1 1 mA 21
IPFCSENSE current on pin PFCSENSE IPFCSENSE -1 10 mA 21
IFBSENSE current on pin FBSENSE IFBSENSE -1 10 mA 21
IFBDRIVER current on pin FBDRIVER IFBDRIVER -0.8 2 A duty cycle < 10 % 21
IPFCDRIVER current on pin PFCDRIVER IPFCDRIVER -0.8 2 A duty cycle < 10 % 21
IHV current on pin HV during start-up and restart IHV 8 mA 21
IHV current on pin HV during start-up and restart (dV/dt) IHV -15 30 mA = 3 % due to dV/dt on HV pin 21
Total power dissipation Ptot 0.6 W Tamb < 75 C 21
Storage temperature Tstg -55 150 °C 21
Junction temperature Tj -40 155 °C 21
ESD voltage, human body model, pins 1 to 14 VESD -2 2 kV human body model; pins 1 to 14 21
ESD voltage, human body model, pin 16 (HV) VESD -2 2 kV human body model; pin 16 (HV) 21
ESD voltage, charged device model VESD -500 500 V charged device model 21
IHV current on pin HV IHV 0.9 1.1 1.3 mA VHV > 75 V; VCC < Vtrip 22
Trip voltage Vtrip 0.5 0.6 0.7 V 22
Start-up voltage Vstartup 21.3 22.3 23.3 V 22
Undervoltage lockout threshold voltage Vth(UVLO) 12.4 13.4 14.4 V 22
Hysteresis voltage Vhys 8.3 8.9 9.5 V Vstartup - Vth(UVLO) 22
Operating supply current ICC(oper) 2.45 2.7 2.95 mA no-load on pins FBDRIVER and PFCDRIVER; VFBCTRL = 5 V; fFB = fPFC = 100 kHz 22
Operating supply current in burst mode, flyback switching ICC(oper) 1.75 1.95 2.15 mA no-load on pins FBDRIVER and PFCDRIVER; flyback switching; VFBCTRL = 1.6 V; VPFCSENSE = 0 V 22
Operating supply current in burst mode, flyback not switching ICC(oper) 1.24 1.35 1.46 mA flyback not switching; VFBCTRL = 0 V; VPFCSENSE = 0 V 22
Protection supply current ICC(prot) 0.3 0.45 0.6 mA time-out protection triggered; VHV = 0 V 22
Stop voltage on pin VINSENSE Vstop(VINSENSE) 0.86 0.89 0.92 V 23
Start voltage on pin VINSENSE Vstart(VINSENSE) 1.12 1.16 1.2 V 23
Dual boost voltage high level Vbst(dual) 2.08 2.28 2.48 V high level 23
Maximum PFC sense voltage Vsense(PFC)max 465 495 525 mV dV/dt = 0 V/s 24
Maximum flyback sense voltage Vsense(fb)max 525 545 565 mV dV/dt = 0 V/s 26
Minimum flyback sense voltage Vsense(fb)min 221 232 243 mV dV/dt = 0 V/s 26
Maximum flyback on-time ton(fb)max 32.5 38.5 44.5 µs 25
Maximum flyback switching frequency fsw(fb)max 110 130 150 kHz 26
Maximum PFC switching frequency fsw(PFC)max 119 139 159 kHz 24
Switch-off threshold voltage on pin PFCTIMER Vth(off)PFCTIMER 4.2 4.4 4.6 V PFC override voltage 25
Trip voltage on pin FBCTRL Vto(FBCTRL) 7.3 7.75 8.2 V trip voltage 26
On-state burst mode threshold voltage on pin FBCTRL Vth(burst)on 2.2 2.4 2.6 V on pin FBCTRL 26
Off-state burst mode threshold voltage on pin FBCTRL Vth(burst)off 0.62 0.77 0.92 V on pin FBCTRL 26
Protection voltage on pin LATCH Vprot(LATCH) 469 494 519 mV 27
IC protection level temperature Tpl(IC) 135 145 155 °C 28
Thermal resistance from junction to ambient Rth(j-a) 127 K/W in free air; JEDEC test board 22
Thermal resistance from junction to case Rth(j-c) 36 K/W in free air; JEDEC test board 22

CAD (KiCad official)

  • Symbol: TEA1755T
  • Footprint: Package_SO:SOIC-16_3.9x9.9mm_P1.27mm
  • 3D model: SOIC-16 (KiCad packages3D, STEP)
  • 3D model files: tea1755t-etched.step / tea1755t-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); tea1755t.step / tea1755t.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: NXP Semicon datasheet (35 pp, sha256 b7d1a0d70f3644d9, retrieved 2026-10-27, tier: manufacturer)
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-haiku-5-5 (text), consensus off (skipped (clean text read)), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF